A high-frequency circuit is configured so as to include a printed circuit board and a flexible circuit board connected to the printed circuit board, wherein the printed circuit board includes: a first dielectric layer having a first surface and a second surface, a first ground conductor being formed on the first surface; a second dielectric layer having a third surface and a fourth surface, a second ground conductor being formed on the fourth surface; and first signal lines wired between the second surface and the third surface, the flexible circuit board includes: a third dielectric layer having a fifth surface and a sixth surface, a third ground conductor being formed on the fifth surface; a fourth dielectric layer having a seventh surface and an eighth surface, a fourth ground conductor being formed on the eighth surface; and second signal lines wired between the sixth surface and the seventh surface, and a connecting portion between the printed circuit board and the flexible circuit board includes: a plurality of first connecting conductors each having a first end connected to each of the first signal lines and a second end exposed from the fourth surface in a non-conductive state with the second ground conductor; and a plurality of second connecting conductors each having a first end exposed from the fifth surface in a non-conductive state with the third ground conductor and connected to the second end of each of the first connecting conductors, and a second end connected to each of the second signal lines.

A circuit assembly for cooling a quantum electrical device, use of said circuit assembly, a system and a method for cooling a quantum electric device are provided. The circuit assembly comprises a quantum electric device to be cooled, at least one normal-metal-insulator-superconductor (NIS) tunnel junction electrically connected to the quantum electric device and at least one superconductive lead for supplying a drive voltage V.sub.QCR for said at least one NIS tunnel junction. The quantum electric device is cooled when the voltage V.sub.QCR is supplied to at least one NIS tunnel junction, said voltage V.sub.QCR being equal to or below the voltage NΔ/e, where N=1 or N=2, N is the number of NIS tunnel junctions electrically coupled in series with the means for generating the voltage, Δ is the energy gap in the superconductor density of states, and e is the elementary charge.

In an array antenna apparatus, a first height of top faces of plurality of antenna elements is greater than or equal to a second height of a first top of a first electronic component relative to a first primary surface. The first electronic component is the tallest among one or more electronic components mounted on fourth primary surfaces of one or more first external circuit boards. A third height of a second primary surface is greater than a fourth height of fourth primary surfaces. Accordingly, the array antenna apparatus has good antenna characteristics.

A transmission line includes first, second, and third signal lines defining a parallel portion. No conductor connecting the first ground conductor and the second ground conductor is between the first signal line and the second signal line, and the first signal line is closer to the ground connection conductor than the second signal line. A closest frequency difference between a fundamental wave of one of the first signal and the second signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the second signal is equal to or larger than a closest frequency difference between a fundamental wave of one of the first signal and the third signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the third signal.

Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

A waveguide structure includes a dielectric layer, a plurality of circuit layers, a plurality of insulation layers, and a conductor connection layer. The dielectric layer has an opening. The circuit layers are disposed on the dielectric layer. The insulation layers and the circuit layers are alternately stacked. The conductor connection layer covers an outer wall of the opening in a direction perpendicular to the circuit layers and connects at least two circuit layers on two opposite sides of the opening. At least the conductor connection layer and a part of the circuit layers define an air cavity for transmitting signals at a position corresponding to the opening.

A radio frequency (RF) circuit connection assembly comprises a RF circuit board and a RF connector. The RF circuit board has a first side and a second side opposite the first side. A RF circuit is located on the first side and an aperture extends through the RF circuit board from the first side to the second side. The RF connector comprises a barrel having a socket configured to receive a RF bullet, a flange having a mounting surface, and a RF connector pin extending laterally from the barrel. The barrel of the RF connector extends through the aperture of the RF circuit board such that the mounting surface of the flange is seated against the first side of the RF circuit board, and the RF connector pin is electrically coupled to the RF circuit on the first side of the RF circuit board.

A device for transmission of at least one high-frequency signal includes at least one first electrically-conductive track formed inside and/or on top of a flexible substrate.

A transmission line includes a first interlayer connection conductor connecting a first signal conductor and a first mounting electrode, a second interlayer connection conductor connecting a second signal conductor and a second mounting electrode, a third and fourth interlayer connection conductors respectively including third and fourth interlayer connection conductors, and each connecting first and second ground conductors between the first and second signal conductors. The third interlayer connection conductor is closer to the first and second interlayer connection conductors than the fourth interlayer connection conductor is, an adjacent distance between two of the fourth interlayer connection conductors is greater than an adjacent distance between two of the third interlayer connection conductors, and the adjacent distance between the two fourth interlayer connection conductors is less than about ½ of a minimum wavelength of signals transmitted by the first signal conductor and the second signal conductor.

This document describes a twin line fed dipole array antenna that may be coupled to several different types of feed networks in a space-efficient manner. The antenna makes use of a twin line feed to a plurality of dipoles that minimizes cross-polarization. The antenna may be manufactured on a printed circuit board (PCB) and has a centered feed slot that is easily coupled to several different types of waveguides or a microstrip. In some implementations, the dipole elements may have an approximately rectangular shape. In other implementations, the dipole elements may have an approximately bowtie shape, round shape, oval shape, C-shape, or L-shape. The size and placement of the dipole elements may be optimized for certain operating frequencies of the radar system to which the antenna is coupled.