A connecting unit for radio-frequency components has: a housing; a first interface and a second interface which are arranged on the housing and are designed to be coupled to in each case one radio-frequency component; an internal conductor which runs in the housing and is connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; a spacer which surrounds the internal conductor and extends at least along a portion of the length of the internal conductor. The housing is manufactured from an electrically conductive and rigid material and the spacer is arranged such that the internal conductor is at a distance from the housing at least in sections.

The waveguide element includes: a dielectric portion having holes periodically formed in a substrate made of a ceramics material; a low-dielectric constant portion having a dielectric constant smaller than a dielectric constant of the dielectric portion; and a support substrate arranged below the dielectric portion, the support substrate being configured to support the dielectric portion. The waveguide element is configured to guide an electromagnetic wave having a frequency of 30 GHz or more and 20 THz or less, and a frequency range of the electromagnetic wave in which an absolute value of a propagation loss becomes 1 dB/cm or less is 50 GHz or more.

Aspects of the subject disclosure may include, a system for generating electromagnetic signals that resonate in a cavity having a plurality of reflectors resulting in resonating electromagnetic signals and combining the resonating electromagnetic signals to form an electromagnetic wave that traverses a reflector and couples onto a physical transmission medium. One or more of the reflectors is implemented via a programmable substrate. Other embodiments are disclosed.

Aspects of the subject disclosure may include, a system for generating electromagnetic signals that resonate in a cavity having a plurality of reflectors resulting in resonating electromagnetic signals and combining the resonating electromagnetic signals to form an electromagnetic wave that traverses a reflector and couples onto a physical transmission medium. One or more of the reflectors is implemented via a programmable substrate. Other embodiments are disclosed.

Embodiments herein relate to systems, apparatuses, or processes for packages that include transceivers that are at least partly positioned underneath a waveguide launcher array to decrease the maximum signal transmission time between the transceiver and the waveguide launcher array. This configuration may increase the overall data transmission rate between a die and waveguides coupled with the waveguide launcher array. Other embodiments may be described and/or claimed.

A device includes a multilayer substrate having a first surface and a second surface opposite the first surface. An integrated circuit is mounted on the second surface of the multilayer substrate, the integrated circuit having transmission circuitry configured to process millimeter wave signals. A substrate waveguide having a substantially solid wall is formed within a portion of the multilayer substrate perpendicular to the first surface. The substrate waveguide has a first end with the wall having an edge exposed on the first surface of the multilayer substrate. A reflector is located in one of the layers of the substrate and is coupled to an edge of the wall on an opposite end of the substrate waveguide.

A transition device includes a first metal layer, a signaling metal line, an excitation metal piece, a first dielectric layer, a plurality of conductive via elements, a reflector, and a waveguide. The first metal layer has a notch. The notch extends to the interior of the first metal layer, forming a first slot region. The signaling metal line is disposed in the notch. The excitation metal piece is disposed in the first slot region and is coupled to the signaling metal line. The first dielectric layer has a pair of first openings. The first dielectric layer includes a bridging portion disposed between the first openings. The bridging portion is configured to carry the excitation metal piece. The conductive via elements penetrate the first dielectric layer and are coupled to the first metal layer. The conductive via elements at least partially surround the first slot region.

Aspects of the subject disclosure may include, a system that can be configured for generating an electromagnetic wave and coupling the electromagnetic wave to a transmission medium with a reduced loss of radiation of the electromagnetic wave into free space. The system can also be configured to receive an electromagnetic waves form the transmission medium with a reduced loss of radiation of the electromagnetic wave into free space. Other embodiments are disclosed.

Aspects of the subject disclosure may include, a system for generating electromagnetic signals that resonate in a cavity having a plurality of reflectors resulting in resonating electromagnetic signals and combining the resonating electromagnetic signals to form an electromagnetic wave that traverses a reflector and couples onto a physical transmission medium. One or more of the reflectors is implemented via a programmable substrate. Other embodiments are disclosed.

Aspects of the subject disclosure may include, a system for generating electromagnetic signals that resonate in a cavity having a plurality of reflectors resulting in resonating electromagnetic signals and combining the resonating electromagnetic signals to form an electromagnetic wave that traverses a reflector and couples onto a physical transmission medium. One or more of the reflectors is implemented via a programmable substrate. Other embodiments are disclosed.