A semiconductor package including a base comprising an upper surface and a lower surface that is opposite to the upper surface; a radio-frequency (RF) module embedded near the upper surface of the base; an integrated circuit (IC) die mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation; a plurality of conductive structures disposed on the lower surface of the base and arranged around the IC die; and a metal thermal interface layer comprising a backside metal layer that is in contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.

An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

An antenna module includes digital phase shifters, a plurality of antenna elements arranged in a first direction, and a fixed phase shifter. Each of the digital phase shifters changes a phase of a signal to a first phase value. The fixed phase shifter changes a phase of a signal to a second phase value, the second phase value being obtained by adding a predetermined offset phase value to the first phase value. A middle point of a virtual line is an antenna center and connects a center of an antenna element located on an end in the first direction and a center of an antenna element located on a different end. Under a symmetrical condition, an antenna center among the plurality of antenna elements are paired as an antenna element pair, the fixed phase shifter is electrically connected to at least one antenna element of the antenna element pair.

In an embodiment, an electronic device may include a housing having an inner space and an antenna structure disposed in the inner space of the housing. The antenna structure may include a printed circuit board (PCB) and at least one antenna disposed in the PCB. The PCB may have a plurality of insulating layers and a ground layer. The at least one antenna may include a conductive line disposed on a first insulating layer among the plurality of insulating layers, a conductive via extended from the conductive line in a first direction, and at least one conductive pattern branched at a right angle from the conductive line on the first insulating layer. The wireless communication circuit may be configured to transmit and/or receive a radio signal in a range of about 3 GHz to about 100 GHz through the at least one antenna.

A waveguide arrangement for guiding electromagnetic waves in a cavity surrounded by conductive material is proposed, wherein the waveguide arrangement comprises a printed circuit board material having an electrically conductive, plate-shaped back, a substrate and a conductive layer arranged on a side of the substrate facing away from the back. According to the invention, it is provided that the back has a surface structure, preferably formed by at least one recess, by which the waveguiding cavity is at least partially directly bounded; and/or that the cavity is formed in split-block technology by joining the printed circuit board material as split-block bottom part with a corresponding cover as split-block top part.

Disclosed herein is an antenna device that includes a first molded substrate having first and second surfaces opposite to each other, a second molded substrate having third and fourth surfaces opposite to each other, a first electrode formed on the first surface of the first molded substrate, a feed electrode formed on the second surface of the first molded substrate so as to overlap the first electrode in a plan view, and a first ground electrode formed on the third surface of the second molded substrate. The first and second molded substrates overlap each other such that the second surface of the first molded substrate and the fourth surface of the second molded substrate face each other.

An apparatus includes a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver or a transmitter. The first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB. The apparatus includes an antenna having a first side and a second side opposite the first side. The first side of the antenna includes a radiating side of the antenna and the second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.

A semiconductor device having an integrated antenna is provided. The semiconductor device includes a base die having an integrated circuit formed at an active surface and a cap die bonded to the backside surface of the base die. A metal trace is formed over a top surface of the cap die. A cavity is formed under the metal trace. A conductive via is formed through the base die and the cap die interconnecting the metal trace and a conductive trace of the integrated circuit.

A foldable apparatus is provided. The foldable apparatus includes a first foldable part, a middle bending part, and a second foldable part that are connected in sequence. The first foldable part and the second foldable part can rotate relative to each other based on the middle bending part. A first wireless communication chip is disposed in the first foldable part. A second wireless communication chip is disposed in the second foldable part. In the foldable apparatus, wireless communication is used to replace conventional physical wiring for internal signal transmission. The loss of a communication carrier is reduced through wireless communication. This ensures that stable transmission performance between the first foldable part and the second foldable part.

A distributing/synthesizing circuit includes first to fourth ports. A first radio frequency circuit transmits and receives a radio frequency signal to and from the first port through a first transmission line. A second transmission line is connected to the second port. A first radiating element is connected to the third port and the fourth port through a third transmission line and a fourth transmission line, respectively. The distributing/synthesizing circuit distributes and outputs the radio frequency signal input to the first port to the third port and the fourth port, synthesizes radio frequency signals that are reflected by the first radiating element and that are input to the third port and the fourth port to output the synthesized radio frequency signal to the second port. The second transmission line is longer than all of the first transmission line, the third transmission line, and the fourth transmission line.