This disclosure relates generally to Millimeter Wave (MMW) frequency antenna scanning system. Conventional approaches available for scanning an antenna beam over a large angular swath with high directivity are unable to address concerns of size and cost involved. The technical problem of providing an MMW frequency antenna scanning system using a single small size antenna capable of scanning as desired at a desired precision is addressed in the present disclosure. The antenna scanning system provided is an electromechanical system that makes the system cost effective. Computer control provides precision control in beam steering from remote. Use of a metasurface and configuration of a radiating patch and a shorting pin in a microstrip antenna addresses the concern with regards to the size of the antenna scanning system.

A patch antenna device configured to receive a radio communication signal includes a circuit board, a patch antenna, and a parasitic element. The circuit board has a signal processing circuit placed thereon. The patch antenna is stacked on the circuit board and has a quadrangular radiation element. The parasitic element is disposed above the patch antenna so as to improve antenna gain characteristics of the patch antenna and configured such that the length of the upper side of the parasitic element is shorter than the width in a plan view of the radiation element of the patch antenna and that the length between the upper and lower sides of the parasitic element is longer than the length between the upper and lower sides of the radiation element of the patch antenna.

A antenna may include a first dielectric layer having a first surface and a second surface opposing the first surface; a second dielectric layer having a third surface, and a fourth surface opposing the third surface; an adhesive layer disposed between the second surface and the third surface and connecting the first dielectric layer to the second dielectric layer; a patch pattern disposed on the second surface and embedded in the adhesive layer; and a coupling pattern disposed on the fourth surface and having at least a portion overlapping the patch pattern on a plane. Each of the first dielectric layer and the second dielectric layer may include an organic binder and an inorganic filler.

An antenna device includes a ground plane, a first feed via and a second feed via for penetrating the ground plane through a first hole and a second hole of the ground plane, a first feed pattern connected to the first feed via, a first antenna pattern configured to be coupled to the first feed pattern and transmit/receive an RF signal of a first frequency bandwidth, a second antenna pattern connected to the second feed via and configured to transmit/receive an RF signal of a second frequency bandwidth, and a third antenna pattern disposed between the first antenna pattern and the second antenna pattern, and overlapping the first antenna pattern and the second antenna pattern.

An antenna device, an array of antenna devices, and a base station having an antenna device. A radiator is configured to radiate an electromagnetic signal in a direction parallel to a radiating axis of the antenna device. The radiator has a substantially planar shape perpendicular to the radiating axis and a resonant structure adjacent to the radiator. The resonant structure has a substantially planar shape parallel to the radiator, wherein the radiator is configured to radiate the electromagnetic signal in a first frequency band and the resonant structure is configured to have a resonant frequency within the first frequency band.

A first edge of a ground plane extends in a first direction. A radiating element is arranged with a gap from the ground plane in a thickness direction of the ground plane. A feed line supplies a radio frequency signal to the radiating element. A pair of stubs are arranged at positions sandwiching the radiating element in the first direction. The stub is connected to the ground plane. In plan view, a distance from the radiating element to the first edge in a second direction orthogonal to the first direction is ¼ or less of a wavelength corresponding to a resonant frequency of the radiating element. Even when the radiating element is arranged close to an edge of the ground plane, disorder of a beam pattern may be reduced.

In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

An antenna device and an electronic device are provided. The antenna apparatus includes a dielectric substrate, a grounding metal layer, a radiation patch, a first feeding structure, a first deflection patch, and a radio frequency chip. The grounding metal layer, the dielectric substrate, and the radiation patch are stacked. The first feeding structure has a first end connected to the radiation patch, and a second end electrically connected to the radio frequency chip. The radio frequency chip is configured to feed a first excitation signal to the first feeding structure to excite the radiation patch to radiate beam. The first deflection patch is fixed on a side of dielectric substrate away from the grounding metal layer, the first deflection patch is located at a side of the radiation patch, and is configured to be in an amorphous state or in a crystalline state when the antenna device works.

A composite antenna and array antenna using the same. The antenna has a three-layer structure including a patch antenna, a slot antenna and a transmission line. A first layer includes a patch antenna resonating at half a wavelength, a second layer includes a slot antenna resonating at half the wavelength, and a third layer includes a transmission line and a feed point. The three layers are coupled and the entire composite antenna unit satisfies a resonance condition. A signal is fed through the transmission line and coupled to the slot antenna, and the signal from the slot antenna is further coupled to the patch antenna. This composition antenna has a desirable antenna gain, and an increased antenna bandwidth compared to a single patch antenna or slot antenna.