An antenna device according to an embodiment includes a dielectric layer including a high transmittance area and a low transmittance area, and an antenna unit disposed on the dielectric layer. The antenna unit includes a radiator disposed on the high transmittance area of the dielectric layer and having a mesh structure, a signal pad disposed on the low transmittance area of the dielectric layer and having a solid pattern structure, and an impedance matching pattern connecting the radiator and the signal pad on the low transmittance area of the dielectric layer. The impedance matching pattern has a larger width than that of the signal pad and has a solid pattern structure.

A device includes a redistribution structure, a first semiconductor device, a first antenna, and a first conductive pillar on the redistribution structure that are electrically connected to the redistribution structure, an antenna structure over the first semiconductor device, wherein the antenna structure includes a second antenna that is different from the first antenna, wherein the antenna structure includes an external connection bonded to the first conductive pillar, and a molding material extending between the antenna structure and the redistribution structure, the molding material surrounding the first semiconductor device, the first antenna, the external connection, and the first conductive pillar.

Package substrates employing integrated slot-shaped antenna(s), and related integrated circuit (IC) packages and fabrication methods. The package substrate can be provided in a radio-frequency (RF) IC (RFIC) package. The package substrate includes one or more slot-shaped antennas each formed from a slot disposed in the metallization substrate that can be coupled to the RFIC die for receiving and radiating RF signals. The slot-shaped antenna includes a conductive slot disposed in at least one metallization layer in the package substrate. A metal interconnect in a metallization layer in the package substrate is coupled to the conductive slot to provide an antenna feed line for the slot-shaped antenna. In this manner, the slot-shaped antenna being integrated into the metallization substrate of the IC package can reduce the area in the IC package needed to provide an antenna and/or provide other directions of antenna radiation patterns for enhanced directional RF performance.

In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall between the cavity ceiling and the cavity base. Either a bottom surface of the antenna element defines the cavity ceiling and a perimeter portion of the antenna element is fixed to the antenna dielectric structure, or the antenna dielectric structure includes a body portion having a bottom surface that defines the cavity ceiling and the antenna element is vertically spaced apart from the bottom surface of the body portion. An semiconductor component is coupled to a bottom side of the substrate and is coupled to the transceiver pattern. Other examples and related methods are also disclosed herein.

The disclosure relates to radio engineering, and more specifically to a wide scanning patch antenna array. The technical result consists in extending the scanning range of the antenna array, increasing its efficiency and reducing losses. An antenna array is provided. The antenna array includes a printed circuit board on which at least two patch antennas are located, each having at least one feeding port, wherein, the patch antennas are rotated relative to each other around the normal in the center of symmetry of the patch antenna in such a way that the corresponding feeding ports of the patch antennas related to the same polarization are rotated by 180 degrees relative to each other, wherein the phases of the signals applied to said feeding ports rotated relative to each other, differ by 180 degrees plus a phase shift for scanning control, a dielectric radome located above the printed circuit board, and passive beamforming elements of the array elements, located on the radome above the patch antennas.

A semiconductor package includes an antenna structure including an antenna member configured to transmit and receive a signal through the first surface in the dielectric layer, a connection via extending from the antenna member toward the second surface, and a ground member spaced apart from the connection via; a frame surrounding the side surface of the antenna structure; a first encapsulant covering at least a portion of the antenna structure and the frame; a redistribution structure on the second surface and including an insulating layer in contact with the antenna structure and the frame, and a redistribution conductor configured to be electrically connected to the ground member and the connection via in the insulating layer; a first semiconductor chip on the redistribution structure and electrically connected to the antenna member through the redistribution conductor; a second encapsulant encapsulating the first semiconductor chip on the redistribution structure; and a shielding layer surrounding a surface of the second encapsulant.

A package structure including a first radio frequency die, a second radio frequency die, an insulating encapsulant, a redistribution circuit structure, a first oscillation cavity and a second oscillation cavity is provided. A first frequency range of the first radio frequency die is different from a second frequency range of the second radio frequency die. The insulating encapsulant laterally encapsulates the first radio frequency die and the second radio frequency die. The redistribution circuit structure is disposed on the first radio frequency die, the second die and the insulating encapsulant. The first oscillation cavity is electrically connected to the first radio frequency die, and the second oscillation cavity is electrically connected to the second radio frequency die.

The present disclosure relates to an antenna element comprising a lower conducting plane, an upper conducting plane and an upper dielectric layer structure that is positioned between the conducting planes. The upper dielectric layer structure comprises a plurality of conducting vias that electrically connect the conducting planes to each other and circumvent an upper radiating patch formed in, below or above the upper conducting plane. The conducting vias circumvent at least one intermediate radiating patch that is formed in the upper dielectric layer structure, and a lowest intermediate radiating patch that is closest to the lower conducting plane is connected to a feed arrangement that comprises at least one feeding probe that extends via a corresponding aperture in the lower conducting plane and is electrically connected to the lowest intermediate radiating patch.

An antenna device includes a ground electrode, a feed element, and a parasitic element. The ground electrode has a substantially non-square rectangular plane shape that includes a first side extending in a first direction and a second side extending in a second direction orthogonal to the first direction. The feed element has a substantially rectangular plane shape and is formed in such a way that each side of the feed element becomes parallel to the first direction or the second direction. The parasitic element is formed in such a manner as to face a side of the feed element parallel to the first side. The feed element is configured to radiate a first polarized wave that excites in the first direction and a second polarized wave that excites in the second direction. The length of the first side is longer than the length of the second side.

In one embodiment of the present disclosure, an antenna apparatus includes a housing assembly including a radome portion and a lower enclosure portion, wherein the radome portion and lower enclosure portion are couplable to form an inner compartment for housing antenna components of the antenna assembly, an antenna stack assembly disposed within the inner compartment, wherein the antenna stack assembly generates heat when in operation, and a heat transfer system within the inner compartment configured to facilitate the flow of heat toward the radome portion.