The present disclosure relates to an antenna element comprising a lower conducting plane, an upper conducting plane and an upper dielectric layer structure that is positioned between the conducting planes. The upper dielectric layer structure comprises a plurality of conducting vias that electrically connect the conducting planes to each other and circumvent an upper radiating patch formed in, below or above the upper conducting plane. The conducting vias circumvent at least one intermediate radiating patch that is formed in the upper dielectric layer structure, and a lowest intermediate radiating patch that is closest to the lower conducting plane is connected to a feed arrangement that comprises at least one feeding probe that extends via a corresponding aperture in the lower conducting plane and is electrically connected to the lowest intermediate radiating patch.

An antenna device includes a ground electrode, a feed element, and a parasitic element. The ground electrode has a substantially non-square rectangular plane shape that includes a first side extending in a first direction and a second side extending in a second direction orthogonal to the first direction. The feed element has a substantially rectangular plane shape and is formed in such a way that each side of the feed element becomes parallel to the first direction or the second direction. The parasitic element is formed in such a manner as to face a side of the feed element parallel to the first side. The feed element is configured to radiate a first polarized wave that excites in the first direction and a second polarized wave that excites in the second direction. The length of the first side is longer than the length of the second side.

An antenna radiation module for assembling to an antenna inlay for a component carrier or to a component carrier. The module includes a dielectric layer structure and an antenna radiation layer structure. The antenna radiation layer structure is embedded in the first dielectric layer structure. Further, an antenna inlay, a component carrier, and a manufacturing method are described.

An electronic device includes: a housing; a substrate disposed in the housing; an antenna radiator; and an electrical connection member electrically interconnecting the antenna radiator and the substrate, wherein the electrical connection member includes: a plate portion including a first surface facing the antenna radiator and a second surface facing away from the first surface; a first fixing portion provided at a first end of the plate portion, the first fixing portion including a through hole and a tension structure; and a second fixing portion provided at a second end of the plate portion and electrically connecting the electrical connection member to the substrate, wherein the first fixing portion is fixed to the antenna radiator via a locking device that passes through the through hole, and wherein the tension structure is configured to contact the antenna radiator and maintain tension between the electrical connection member and the antenna radiator during fastening of the locking device.

An antenna is disclosed. The antenna can include a coplanar antenna structure. The coplanar antenna structure can include a substrate and a radiating portion that is configured to emit electromagnetic radiation and is disposed over the substrate. The radiating portion defines a slot having a width to length ratio of at least approximately 0.4. The antenna also includes a scattering element disposed over the substrate and at least partially surrounds the radiating portion.

An antenna module includes a first antenna layer, including at least one main radiation unit including at least two main radiation patches symmetrically arranged and spaced apart from each other and at least one feeder portion located at or corresponds to a gap between adjacent two of the main radiation patches; a second antenna layer, stacked with the first antenna layer and including a reference ground arranged opposite to the main radiation patches and at least one microstrip insulated from the reference ground; at least one first electrically conductive member, electrically connected to the main radiation patches and the reference ground; and at least one second electrically conductive member, with an end being electrically connected to the feeder portion and another end being electrically connected to another end of the microstrip. An end of the microstrip is electrically connected to a radio frequency transceiver chip.

The present disclosure relates to an antenna element (1) comprising a lower conducting plane (2), an upper conducting plane (3) and an upper dielectric layer structure (4) that is positioned between the conducting planes (2, 3). The upper dielectric layer structure (4) comprises a plurality of conducting vias (5) that electrically connect the conducting planes (2, 3) to each other and circumvent an upper radiating patch (6) formed in, below or above the upper conducting plane (3). The conducting vias (5) circumvent at least one intermediate radiating patch (7, 8) that is formed in the upper dielectric layer structure (4), and a lowest intermediate radiating patch (7) that is closest to the lower conducting plane (2) is connected to a feed arrangement (9, 10) that comprises at least one feeding probe (9, 10) that extends via a corresponding aperture (13) in the lower conducting plane (2) and is electrically connected to the lowest intermediate radiating patch (7).

The present disclosure provides a surface-mountable antenna structure that is applicable to a broadband massive multi-input multi-output (MIMO) unit (MMU) in a wireless communication system. An antenna structure according to an embodiment of the present disclosure comprises: a printed circuit board including a first ground port, a second ground port, and a first feeding port; a first antenna electrically connected to the first ground port; a second antenna electrically connected to the second ground port; and a first feeding plate including a first bending part electromagnetically coupled to the first antenna, a second bending part electromagnetically coupled to the second antenna, and a third bending part electrically connected to the first feeding port.

A circuit board according to an embodiment includes a first substrate including an antenna feeder line formed thereon to connect an antenna driving unit and an antenna, a second substrate including a data line formed thereon to transmit data processed in the antenna driving unit to an electronic component, and a third substrate which is disposed between the first substrate and the second substrate, and includes a power supply line formed thereon to supply a power to the antenna driving unit.

The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.