An electromagnetic bandgap (EBG) structure for improving isolation characteristics between antennas of a MIMO antenna array. The structure includes an EBG unit cell formed on a metal layer over a composite dielectric substrate and over a ground plane. The ground plane may include a defected ground structure to further improve isolation, and another metal layer including a substrate integrated waveguide may be included at an interface of the composite dielectric substrate.

This disclosure presents an antenna device including one or more arrays of radiating elements, wherein each array may be an end-fire array. The antenna device comprises an array of N radiating elements (N>1) arranged on a common axis. Each radiating element is configured to radiate a radio wave in response to a RF signal fed to the respective radiating element. A reflector is arranged on the common axis to reflect the N radio waves into a main radiating direction. The antenna device comprises a feed structure to feed a RF signal to each radiating element. The RF signal at each radiating element has a respective phase difference relative to the RF signal at a first radiating element. The feed structure comprises one or more phase shifters, for one or more or all radiating elements, to set the phase difference of the RF signal at the respective radiating element.

A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.

A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.

An antenna, an antenna assembly and a wireless communication device are provided. The antenna includes an antenna substrate; and at least one radiation unit disposed on the antenna substrate, each of the at least one radiation unit including: a first radiation branch, and a second radiation branch, where one of the first radiation branch or the second radiation branch is connected to a feeding point, the other of the first radiation branch or the second radiation branch is connected to a ground point, an end part of the first radiation branch bends toward the second radiation branch, and an end part of the second radiation branch is extend in a direction away from the first radiation branch.

The invention provides a chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate. According to the millimeter-wave antenna chip provided in this application, the end-fire antenna may be lifted to the upper surface of the package substrate of the chip by using stacked metal via holes of the package substrate, and a height of the end-fire antenna relative to a peripheral component may be increased by using a thickness of the package substrate.

An antenna device includes a plurality of dipole antennas and a port. Each of the dipole antennas is connected to the port. The dipole antennas are arranged around the port. Each of the dipole antennas comprises two ends. The device further includes a plurality of passive elements. The ends of the dipole antennas and the passive elements are interchangeably arranged around the port such that each of the passive elements is situated between ends of two different antennas from the plurality of dipole antennas. One or more switches are configured to switch between an omnidirectional state, in which the ends of the dipole antennas are not connected to the plurality of passive elements, and a directional state, in which at least one end of one of the passive elements is connected to at least one end of one of the antennas.

A RFID tag for placement on a surface of a container that contains a liquid is provided. The RFID tag includes an IC chip configured to store identification information, a loop conductor connected to the IC chip, and an antenna unit that includes two conductor units connected to the loop conductor and extending away from each other from the loop conductor.

Provided is an antenna device including a feeding antenna conductor, a non-feeding antenna conductor, a ground conductor, and an artificial magnetic conductor disposed between the feeding antenna conductor and the non-feeding antenna conductor, and the ground conductor. The antenna device further includes a conductor that electrically connects the artificial magnetic conductor to the ground conductor. The conductor is disposed at a position opposite to the feeding antenna conductor with respect to the non-feeding antenna conductor, and is separated from the non-feeding antenna conductor.

A phased circular array of antennas each having an omnidirectional radiation pattern are disposed on an outside surface of a planar sheet conformed to the shape of a cylinder. A plurality of coplanar waveguides includes a ground line and a signal line feeding the antennas is disposed on the outside surface of the cylinder. A signal-carrying feed network electromagnetically coupled to the coplanar waveguides is disposed on an inside surface of the cylinder which does not interfere with radiation from the antennas. An electrical ground is disposed on the outside surface of the cylinder which is connected to the ground feed of each of the coplanar waveguides and serves as a ground plane for the signal-carrying feed network. The array is configured to provide 360° beam steering around the vertical axis of the cylinder. A method of fabrication is disclosed.