Provided are examples of removable circularly polarized antenna fitment and methods of fabrication. In one aspect, a fitment comprises a plurality of conductive elements spaced radially around a central point contained with a housing. The elements may have an included angle of between 8 and 71 degrees from horizontal. The plurality of conducting elements may be straight, bent, or curved and may be comprised of between 3 and 12 conductors. The fitment may contain a housing which is removable from a linear antenna.

An antenna array for use in a passenger vehicle. Four of the roof support pillars are used as antenna elements. Each of the four pillars is electrically connected or coupled to one end of a corresponding meanderline component. The other end of each meanderline is in turn coupled to a radio receiver, typically through a combining network.

An antenna includes a first dipole arm and a second dipole arm. The first dipole arm is connected to a first conductor and is formed of a first conducting material. The first dipole arm extends in an axial direction from the first conductor. The second dipole arm is connected to a second conductor that is distinct from the first conductor and is formed of a second conducting material. The second dipole arm extends in the axial direction from the second conductor and is wound around the first dipole arm to form a number of loops. The second dipole arm does not contact the first dipole arm. An axial length of the second dipole arm in the axial direction is less than 90% of an axial length of the first dipole arm in the axial direction.

An antenna includes a first dipole arm and a second dipole arm. The first dipole arm is connected to a first conductor and is formed of a first conducting material. The first dipole arm extends in an axial direction from the first conductor. The second dipole arm is connected to a second conductor that is distinct from the first conductor and is formed of a second conducting material. The second dipole arm extends in the axial direction from the second conductor and is wound around the first dipole arm to form a number of loops. The second dipole arm does not contact the first dipole arm. An axial length of the second dipole arm in the axial direction is less than 90% of an axial length of the first dipole arm in the axial direction.

The invention relates to an antenna structure for transmitting and/or receiving wavelengths of metric frequency or decimetric frequency, characterised in that it comprises n collinear antennas, each antenna comprising a radiating portion comprising a first succession of i coaxial radiating elements about a first axis alternating with at least an additional succession of i radiating elements about another axis, each antenna being independently powered by a coaxial cable, each antenna comprising at least one lower quarter-wave trap and at least one upper quarter-wave trap, at least a first antenna comprising at least one hollow core being configured to receive a coaxial cable intended for powering of another antenna collinear with the first antenna, at least one intermediate quarter-wave trap being arranged between two consecutive collinear antennas around a coaxial cable, and a terminal element.

Disclosed is a system, method, mobile communication device and one or more computer programs for a monitoring system. In one aspect, the system includes a plurality of transmitters, each transmitter having associated therewith a reflector antenna configured to substantially reflect signal transmission toward a detection area; and a mobile device configured to: receive transmitter signals from at least two transmitters from the plurality of transmitters; and determine that the mobile device is located within the detection area based on received signal strengths of the at least some of the transmitter signals.

A method for X2 interface communication is disclosed, comprising: at an X2 gateway for communicating with, and coupled to, a first and a second radio access network (RAN), receiving messages from the first RAN according to a first X2 protocol and mapping the received messages to a second X2 protocol for transmission to the second RAN; maintaining state of one of the first RAN or the second RAN at the X2 gateway; executing executable code received at an interpreter at the X2 gateway as part of the received messages; altering the maintained state based on the executed executable code; and receiving and decoding an initial X2 message from the first RAN; identifying specific strings in the initial X2 message; matching the identified specific strings in a database of stored scripts; and performing a transformation on the initial X2 message, the transformation being retrieved from the database for stored scripts, the stored scripts being transformations.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

An antenna for a communication device is disclosed. The antenna has a structure including a ground plane and a lid component. The lid component is conductive, substantially planar and has a planform shape which is lesser in a first lid component dimension (L.sub.1) than it is in a second lid component dimension (L.sub.2) perpendicular to the first lid component dimension (L.sub.1). The ground plane is conductive and substantially planar, and the size of the ground plane is greater than the size of the lid component. The lid component is conductively connected to the ground plane but also spaced apart from the ground plane, such that there is a space between the lid component and the ground plane, and the antenna is center fed.