The invention relates to an antenna designed to emit and/or receive surface waves with a decametric, hectometric or kilometric central wavelength .sub.0, characterised in that it comprises at least one horizontal wire aerial element of between 0.5.sub.0 and .sub.0 in length, and at least three vertical wire aerial elements of the same length between 0.03.sub.0 and 0.1.sub.0, arranged in a same plane and each comprising an upper end and a lower end, said upper ends being connected to the horizontal wire aerial element, said lower ends being designed to be connected to a conducting medium having a substantially horizontal surface. The invention also relates to an antenna, an antenna array and a use of an antenna or of an antenna array.

A dual-band antenna module includes a substrate, a dual-band omnidirectional antenna, a low-frequency reflection module and a high-frequency reflection module. The dual-band omnidirectional antenna is disposed perpendicular to the substrate and is used for resonating to generate a first radio-frequency signal with a first frequency and a second radio-frequency signal with a second frequency. The low-frequency reflection module includes three low-frequency reflection units used for reflecting the first radio-frequency signal with the first frequency according to different low-frequency directional control signals. The high-frequency reflection module includes three high-frequency reflection units used for reflecting the second radio-frequency signal with the second frequency according to different high-frequency directional control signals. The low-frequency reflection units of the low-frequency reflection module and the high-frequency reflection units of the high-frequency reflection module are disposed on the substrate and are disposed around the dual-band omnidirectional antenna.

A dual-band antenna module includes a substrate, a dual-band omnidirectional antenna, a low-frequency reflection module and a high-frequency reflection module. The dual-band omnidirectional antenna is disposed perpendicular to the substrate and is used for resonating to generate a first radio-frequency signal with a first frequency and a second radio-frequency signal with a second frequency. The low-frequency reflection module includes three low-frequency reflection units used for reflecting the first radio-frequency signal with the first frequency according to different low-frequency directional control signals. The high-frequency reflection module includes three high-frequency reflection units used for reflecting the second radio-frequency signal with the second frequency according to different high-frequency directional control signals. The low-frequency reflection units of the low-frequency reflection module and the high-frequency reflection units of the high-frequency reflection module are disposed on the substrate and are disposed around the dual-band omnidirectional antenna.

Disclosed is a system, method, mobile communication device and one or more computer programs for a monitoring system. In one aspect, the system includes a plurality of transmitters, each transmitter having associated therewith a reflector antenna configured to substantially reflect signal transmission toward a detection area; and a mobile device configured to: receive transmitter signals from at least two transmitters from the plurality of transmitters; and determine that the mobile device is located within the detection area based on received signal strengths of the at least some of the transmitter signals.

Technology for an antenna is disclosed. The antenna can include a center feed line and a plurality of antenna elements carried by the center feed line. An antenna element in the plurality of antenna elements can have a selected length and a selected width with a first end of the antenna element carried by the center feed line and a second end of the antenna element can be disposed distally from the center feed line. Two or more antenna elements of the plurality of antenna elements can each include a protrusion with a stepped width over a selected length. The protrusion can be located proximate to the second end of the antenna element, and the protrusion can have a width that is greater than the selected width of the antenna element.

Technology for an antenna is disclosed. The antenna can include a center feed line and a plurality of antenna elements carried by the center feed line. An antenna element in the plurality of antenna elements can have a selected length and a selected width with a first end of the antenna element carried by the center feed line and a second end of the antenna element can be disposed distally from the center feed line. Two or more antenna elements of the plurality of antenna elements can each include a protrusion with a stepped width over a selected length. The protrusion can be located proximate to the second end of the antenna element, and the protrusion can have a width that is greater than the selected width of the antenna element.

An antenna structure includes a dipole antenna element and a floating metal element. The floating metal element is disposed adjacent to the dipole antenna element. The vertical projection of the dipole antenna element at least partially overlaps the floating metal element. The floating metal element is configured for fine-tuning the radiation pattern of the antenna structure and to increase the operation bandwidth of the antenna structure.

An antenna structure includes a dipole antenna element and a floating metal element. The floating metal element is disposed adjacent to the dipole antenna element. The vertical projection of the dipole antenna element at least partially overlaps the floating metal element. The floating metal element is configured for fine-tuning the radiation pattern of the antenna structure and to increase the operation bandwidth of the antenna structure.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die has an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die has an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.