Radio frequency signal boosters for high frequency cellular communications are provided herein. In certain embodiments, a signal booster system for providing high frequency wireless signal reception of a 5G network inside a building is provided. The signal booster system includes one or more auxiliary signal boosters for extending coverage within rooms of the building. For example, an auxiliary signal booster can include a donor unit located in a first room and having a base station antenna and booster circuitry integrated therewith. The auxiliary signal booster further includes a server unit located in a second room and having a having a mobile station antenna integrated therewith. The donor unit and the server unit are connected by a short cable.

Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.

An antenna array assembly comprises at least a first and second antenna element, each comprising at least one radiator element in a substantially parallel relationship to a respective ground plate, and an isolator bar disposed between the respective ground plates of the first and second antenna elements, the isolator bar being elongate having a cross-section comprising a T shape, the cross-section being across a long axis. The isolator bar comprises a support bar in contact with the ground plates forming the stem of the T shape, and a cross piece forming the top of the T shape. The cross piece of the isolator bar has a width in the cross-section of at least a quarter of a wavelength at an operating frequency of the antenna array, whereby to provide radio frequency isolation between the first and second antenna elements.

Systems and methods of manufacture are disclosed for a semiconductor device assembly having a semiconductor device having a first side and a second side opposite of the first side, a mold compound region adjacent to the semiconductor device, a redistribution layer adjacent to the first side of the semiconductor device, a dielectric layer adjacent to the second side of the semiconductor device, a first via extending through the mold compound region that connects to at least one trace in the dielectric layer, and an antenna structure formed on the dielectric layer and connected to the semiconductor device through the first via.

An antenna device comprising: one or more substrates; a first radiating element disposed on a first region of a surface of the one or more substrates that face a cover covering the antenna device: a second radiating element disposed on a second region of the surface of the one or more substrates that face the cover; a first reflecting plate that reflects an electromagnetic wave from the first radiating element; and a second reflecting plate that reflects an electromagnetic wave from the second radiating element, wherein the first reflecting plate and the second reflecting plate take different positions in a direction perpendicular to the surface of the one or more substrates that face the cover, and the first region and the second region are regions that do not overlap each other on the surface of the one or more substrates that face the cover.

An electronic device includes a housing that includes a front plate facing a first direction, a back plate facing a second direction opposite to the first direction, and a side member surrounding a space between the front plate and the back plate and at least a portion of which is formed of a metal material. A display is viewable through the front plate, and an antenna module is positioned in the space and includes a first surface facing a third direction different from the first direction and the second direction, a second surface facing a fourth direction different from the third direction, and at least one conductive element extended in a fifth direction, which is perpendicular to the third direction and the fourth direction and faces a first portion of the side member, adjacent to the side member, and between the first surface and the second surface.

The invention discloses shared-aperture dual-band dual-polarized antenna array and communication equipment. The antenna array comprises a first dielectric substrate, a second dielectric substrate, a third dielectric substrate, a fourth dielectric substrate, and a fifth dielectric substrate. The first dielectric substrate, the second dielectric substrate, and the third dielectric substrate constitute a dielectric substrate group. The dielectric substrate group is provided with a low-frequency antenna element and four high-frequency antenna elements. The low-frequency antenna element is loaded with a filtering structure. The low-frequency antenna element and the high-frequency antenna element are fed by coaxial lines. The fourth dielectric substrate and the fifth dielectric substrate form a dual-function metasurface. When the dual-function metasurface is used as an artificial magnetic conductor reflector, the radiation of the low-frequency antenna element is enhanced in a low profile, and when used as a frequency selective surface, the electromagnetic scattering of the low-frequency antenna element in the high-frequency band is suppressed. Compared with the existing solutions, the present invention is more compact, and maintains high cross-band isolation and stable radiation patterns in dual bands.

An electronic device including an antenna module is provided. The electronic device includes a 5th generation (5G) antenna module that includes an antenna array, at least one conductive region operating as a ground with respect to the antenna array, and a first communication circuit feeding a power to the antenna array to communicate through a millimeter wave signal, and a printed circuit board (PCB) that includes a second communication circuit and a ground region. The second communication circuit feeds the power to an electrical path at least including the at least one conductive region and transmits or receives a signal in a frequency band different from a frequency band of the millimeter wave signal based on the electrical path supplied with the power and the ground region.

An antenna apparatus includes a first antenna array that includes at least one antenna unit, and a first antenna unit in the at least one antenna unit includes a first patch subunit and a first feeder subunit. The first feeder subunit includes a first feeder and a second feeder. A first included angle θ between the first patch subunit and the first feeder satisfies 0<θ<90°. A second included angle β between the first feeder and the second feeder satisfies 0<β<180°.

An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.