A sensor package includes at least one conductive trace providing a voltage common and a base supporting the at least one conductive trace. A conductive extension extends from the base so as to contact a conductor of an insulated conductor when the sensor package is mounted on an insulator of the insulated conductor and thereby provide an electrical connection between the conductive trace providing the voltage common and the conductor.

An electrical connector for establishing an electrical connection between two flatly overlapping current conducting elements,

Multi-pole or multi-phase electrical wiring devices that incorporate clamp-type wire termination assemblies are described. The electrical wiring devices include multi-pole motor switches. The electrical wiring devices include a plurality of wire termination assemblies. Each wire termination assembly includes a wire terminal and an activating member.

Multi-pole or multi-phase electrical wiring devices that incorporate clamp-type wire termination assemblies are described. The electrical wiring devices include multi-pole motor switches. The electrical wiring devices include a plurality of wire termination assemblies. Each wire termination assembly includes a wire terminal and an activating member.

Multi-pole or multi-phase electrical wiring devices that incorporate clamp-type wire termination assemblies are described. The electrical wiring devices include multi-pole motor switches. The electrical wiring devices include a plurality of wire termination assemblies. Each wire termination assembly includes a wire terminal and an activating member.

Multi-pole or multi-phase electrical wiring devices that incorporate clamp-type wire termination assemblies are described. The electrical wiring devices include multi-pole motor switches. The electrical wiring devices include a plurality of wire termination assemblies. Each wire termination assembly includes a wire terminal and an activating member.

Implementations of semiconductor packages may include: a die coupled to a substrate; a housing coupled to the substrate and at least partially enclosing the die within a cavity of the housing, and; a pin fixedly coupled to the housing and electrically coupled with the die, wherein the pin includes a reversibly elastically deformable lower portion configured to compress to prevent a lower end of the pin from lowering beyond a predetermined point relative to the substrate when the housing is lowered to be coupled to the substrate.

An ignition coil has a primary coil and a secondary coil, a coil terminal, a connector terminal and a connector part. The connector part has a coil-side lead wire and a connector-side lead wire. The coil terminal has a coil-side fitting groove part into which the coil-side lead wire is fitted. An internal edge surface of the coil-side fitting groove part is formed internally to have a protruded curved surface. The connector terminal has a connector-side fitting groove part into which the connector-side lead wire is fitted. An internal edge surface of the connector-side fitting groove part is formed internally to have a protruded curved surface. The coil-side lead wire is inserted into the coil-side fitting groove part in a direction perpendicular to a longitudinal direction thereof. The connector-side lead wire is fitted into the connector-side fitting groove part in a direction perpendicular to a longitudinal direction thereof.

A wire connection terminal device includes a main body and a pressing/moving unit assembled with the main body. The pressing/moving unit has a shafted section, a cam section connected with the shafted section and a force application section formed on the cam section and a press section formed on the cam section. The cam section can freely rotate or swing within a chamber defined by the main body. A metal leaf spring is disposed in the chamber of the main body for pressing and electrically connecting with a conductive wire. The metal leaf spring is responsive to the motion of the pressing/moving unit to release the conductive wire. The wire connection terminal device improves the shortcomings of the conventional structure that the volume of the case and the operational space are larger and the motional travel is longer.

Implementations of semiconductor packages may include: a die coupled to a substrate; a housing coupled to the substrate and at least partially enclosing the die within a cavity of the housing, and; a pin fixedly coupled to the housing and electrically coupled with the die, wherein the pin includes a reversibly elastically deformable lower portion configured to compress to prevent a lower end of the pin from lowering beyond a predetermined point relative to the substrate when the housing is lowered to be coupled to the substrate.