A shielded flat cable includes a first differential signal line pair including mutually parallel first and second signal lines, first and second ground lines parallel to the first differential signal line pair arranged between the first and second ground lines, an insulating layer covering the first differential signal line pair, the first and second ground lines, a first shielding layer covering a first surface of the insulating layer, and a second shielding layer covering a second surface of the insulating layer, opposite to the first surface. The insulating layer includes an opening exposing the first ground line at the first surface of the insulating layer, and the first shielding layer is electrically connected to the first ground line through the opening. A width of the first ground line is greater than a width of each of the first and second signal lines.

An electronic assembly that includes a rigid printed circuit board having an upper surface with a first plurality of lands. The electronic assembly further includes a flexible printed circuit board having a second plurality of lands on an upper surface. The lower surface of the flexible printed circuit board is directly attached to the upper surface of the rigid printed circuit board. The electronic assembly further includes a plurality of wires. Each of the wires is bonded to the first plurality of lands on the upper surface of the rigid printed circuit board and the second plurality of lands on the upper surface of the flexible printed circuit board.

An electronic assembly that includes a rigid printed circuit board having an upper surface with a first plurality of lands. The electronic assembly further includes a flexible printed circuit board having a second plurality of lands on an upper surface. The lower surface of the flexible printed circuit board is directly attached to the upper surface of the rigid printed circuit board. The electronic assembly further includes a plurality of wires. Each of the wires is bonded to the first plurality of lands on the upper surface of the rigid printed circuit board and the second plurality of lands on the upper surface of the flexible printed circuit board.

An electronic device is provided. The electronic device includes a display panel, a first connection member on which a display driver integrated circuit (DDIC) configured to control the display panel is disposed, a first contact point part disposed on the first connection member, a second contact point part spaced apart from the first contact point part in a second direction perpendicular to the first direction and disposed on the first contact point part, a second connection member disposed adjacent to the first connection member, a third contact point part arranged in the first direction and is disposed on the first layer of the second connection member to be connected to the first contact point part, and a fourth contact point part arranged in the first direction and is arranged on the second layer of the second connection member to be connected to the second contact point part.

An electronic device is provided. The electronic device includes a display panel, a first connection member on which a display driver integrated circuit (DDIC) configured to control the display panel is disposed, a first contact point part disposed on the first connection member, a second contact point part spaced apart from the first contact point part in a second direction perpendicular to the first direction and disposed on the first contact point part, a second connection member disposed adjacent to the first connection member, a third contact point part arranged in the first direction and is disposed on the first layer of the second connection member to be connected to the first contact point part, and a fourth contact point part arranged in the first direction and is arranged on the second layer of the second connection member to be connected to the second contact point part.

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

A pluggable network interface device is provided comprising a split-shell housing having a shielded side portion that protects a side of a circuit substrate disposed in the split-shell housing. The split-shell housing comprises a first shell portion that covers a first side of the circuit substrate and a second shell portion that covers a second side of the circuit substrate that is arranged opposite the first side. The shielded side portion is inset from a width of the split-shell housing and offset a distance from an electrical interconnection end of the circuit substrate. The shielded side portion is arranged at least partially in a notch of the circuit substrate disposed at the electrical interconnection end of the circuit substrate.

An electrical connector assembly includes: a first frame defining plural accommodating cavities; plural transmission units partially received in the accommodating cavities, respectively, each of the transmission units comprising a card edge connector received in a corresponding accommodating cavity, a motherboard connector, and a circuit board connected with the card edge connector and the motherboard connector; and a second frame attached to the first frame; wherein the second frame presses against and hold the circuit boards in position.

Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.