An interface module comprises a base defining a planar sliding surface for a male contact element, a connector housing formed of an electrically insulating material and movably received in a receptacle of the base, a contact received in the connector housing and arranged above the planar sliding surface, and a spring disposed opposite the contact in a direction perpendicular to the sliding surface. The connector housing has an insertion opening adapted to receive the male contact element. The contact has a contact leg projecting below a planar supporting surface for the male contact element. The spring is adapted to elastically abut against an underside of the male contact element in an assembled state. The male contact element is received within the insertion opening of the connector housing and the contact leg abuts a contact surface on an upper side of the male contact element in the assembled state.

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

An apparatus can dynamically adjust, in a card edge connector including first and second positions, an opening configured to receive a printed-circuit card. The apparatus may also include a set of contacts configured to connect with a set of edges of the printed-circuit card in the second position. The apparatus may also include a set of electroactive polymers configured to adjust the set of contacts between the first position and the second position by changing thickness in response to voltages applied to electrodes positioned adjacent to opposing faces of the set of electroactive polymers. The set of electroactive polymers can also include an electroactive polymer configured to control a single contact of the set of contacts.

It is aimed to provide a connector capable of satisfactorily holding a board even in a high-temperature and high-humidity atmosphere. A connector is provided with a connector housing including a board accommodation space, a terminal fitting mounted in the connector housing to face the board accommodation space, and a retainer for sandwiching and holding a flexible board arranged in the board accommodation space between the terminal fitting and the retainer. A state of the retainer changes to a pressing state for pressing the flexible board toward the terminal fitting and a non-pressing state for releasing pressing to the flexible board. The retainer is made of metal.

A micro-electro-mechanical systems (MEMS) terminal structure of board-to-board electrical connector and manufacturing method thereof are provided. The terminal of the terminal structure includes a side arm, a bent portion, and a flexible arm integrally formed as one component. The flexible arm includes a first portion and a second portion. The first portion and the side arm form an insertion space. The second portion and the side arm form a locking space. The second portion of the flexible arm has a contact portion. The insertion space is greater than the locking space. The terminal has curved and locking features to extend the moment arm of the terminal for improving the terminal flexibility. The terminal contacts a mating terminal through multiple points, thereby improving the contact stability and providing the locking function. Furthermore, by using the MEMS techniques for semiconductor industries, the terminal of micro board-to-board electrical connector can be manufactured.

A micro-electro-mechanical systems (MEMS) terminal structure of board-to-board electrical connector and manufacturing method thereof are provided. The terminal of the terminal structure includes a side arm, a bent portion, and a flexible arm integrally formed as one component. The flexible arm includes a first portion and a second portion. The first portion and the side arm form an insertion space. The second portion and the side arm form a locking space. The second portion of the flexible arm has a contact portion. The insertion space is greater than the locking space. The terminal has curved and locking features to extend the moment arm of the terminal for improving the terminal flexibility. The terminal contacts a mating terminal through multiple points, thereby improving the contact stability and providing the locking function. Furthermore, by using the MEMS techniques for semiconductor industries, the terminal of micro board-to-board electrical connector can be manufactured.

A test socket with a link and mount system is used to couple a device under test to a testing apparatus for quick and reliable testing of microchips post-production. The socket includes a pivoting link that connects to the DUT, an elastomer for biasing the link in a first preferred orientation, and a mount that operates as a fulcrum to rotate the link into engagement with the DUT. The mount includes projections that extend below a bottom surface of the socket, such that engagement of the mount with the test device at the projections translates the mount parallel to a diagonal support wall in the socket such that the mount is driven away from the bottom surface of the socket and also toward the elastomer. The socket includes a gap above the mount to allow for movement of the mount within the socket, eliminating the fixed arrangement and the non-compliant loads that accompany the engagement of the mount to the test apparatus. The mount projections carry a small preload that ensures successful contact with the test equipment without the risk of damaging the test equipment with rigid contact surfaces.

A testing device and a method for testing a semiconductor device are provided. The testing device includes a socket having a cavity for accommodating a device under test (DUT), and a cover disposed on the socket. The socket includes a thermal conductive material. The cover includes a plate, a circuit board attached to the plate, and an opening penetrating the plate and the circuit board, exposing the cavity of the socket.

A testing device and a method for testing a semiconductor device are provided. The testing device includes a socket having a cavity for accommodating a device under test (DUT), and a cover disposed on the socket. The socket includes a thermal conductive material. The cover includes a plate, a circuit board attached to the plate, and an opening penetrating the plate and the circuit board, exposing the cavity of the socket.