Connector devices or connectors for use in interconnection to a circuit board may be configured in an open or closed configuration. The connectors devices may utilize a shape memory alloy (SMA) actuator to move clamping portions with respect to each other into one or both of the open or closed positions.

An electrical connector used for bearing a chip module includes an insulating body, terminals arranged in the insulating body, a carrying member, for carrying the chip module to the insulating body, disposed at one side of the insulating body and contacting with the terminals, a pressing plate for pressing the carrying member or the chip module, and an elastic member having at least two limiting portions. The pressing plate and the carrying member are separately disposed at two adjacent sides on the periphery of the insulating body. The two limiting portions define a pivoting space, and the carrying member is pivotally connected to the pivoting space. The elastic member and the carrying member are disposed at the same side of the insulating body, the elastic member has a buffer portion, and the buffer portion abuts against the carrying member and is disposed between the insulating body and the carrying member.

An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

An electrical connector used for bearing a chip module includes an insulating body, terminals arranged in the insulating body, a carrying member, for carrying the chip module to the insulating body, disposed at one side of the insulating body and contacting with the terminals, a pressing plate for pressing the carrying member or the chip module, and an elastic member having at least two limiting portions. The pressing plate and the carrying member are separately disposed at two adjacent sides on the periphery of the insulating body. The two limiting portions define a pivoting space, and the carrying member is pivotally connected to the pivoting space. The elastic member and the carrying member are disposed at the same side of the insulating body, the elastic member has a buffer portion, and the buffer portion abuts against the carrying member and is disposed between the insulating body and the carrying member.

An electrical connector used for carrying a chip module includes an insulating body with multiple terminals arranged in the insulating body, a carrying member pivoted to the insulating body and used for carrying the chip module to the insulating body, and a pressing plate located on one side of the insulating body and used for pressing the carrying member or the chip module. The chip module contacts with the multiple terminals. The carrying member is directly pivoted to the insulating body. Each of two ends of a pivoting side of the carrying member is provided with a pivot shaft. Fixing holes are formed on the outer side of the insulating body. The pivoting shafts are pivoted into the fixing holes, so that the carrying member is rotatingly pivoted to the insulating body without the assistance of a pivoting device for pivoting the carrying member.

An electrical connector used for carrying a chip module includes an insulating body having terminals arranged in the insulating body and used for contacting the chip module, a carrying member used for carrying the chip module to the insulating body, a pressing plate used for pressing the carrying member or the chip module, and a positioning member pivoted to the carrying member through a pivoting device. The pivoting device includes a pivoting shaft and at least one elastic portion. The elastic portion includes a first elastic section and at least two limiting portions being elastic and enclosing a pivoting space. The pivoting shaft is pivoted to the pivoting space. When the electrical connector is opened, the first elastic section springs back to remove the chip module from the insulating body without damaging the terminals, so as to align and contact the chip module with the terminals without tool.

Systems, apparatus, articles of manufacture, and methods to improve thermal dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes: a socket to receive an integrated circuit package; and a plate to apply a load on the integrated circuit package towards the socket. The plate includes an internal channel to carry a coolant through the plate. The liquid coolant is to facilitate cooling of the integrated circuit package.

Systems, apparatus, articles of manufacture, and methods to improve thermal dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes: a socket to receive an integrated circuit package; and a plate to apply a load on the integrated circuit package towards the socket. The plate includes an internal channel to carry a coolant through the plate. The liquid coolant is to facilitate cooling of the integrated circuit package.

A contact device system having a plate-shaped carrier and at least five accommodating areas are disposed on a bottom side of the pressing unit, at least five accommodating areas and at least five contact area pairs are disposed on a top side of the carrier. The contact area pairs each have a first and second electrically conductive contact area, and in each case the first contact area is spaced apart from the second contact area and insulated electrically therefrom. The first and second contact areas have a functional electrical connection to an evaluation circuit via a trace section. The carrier has a plurality of accommodating areas for a packaged electronic component, that each have one of the at least five contact area pairs. The electronic components have at least two terminal contacts, whereby after accommodation of the packaged electronic components, the terminal contacts of the particular component are pressed down.