An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

Disclosed aspects include an apparatus having a card edge connector which has first and second positions. The apparatus may include a set of contacts to connect with a set of card edges in the second position. To adjust the set of contacts between the first position and the second position, the apparatus may include a set of electroactive polymers. Disclosed aspects include card edge connector management. It may be detected that a card edge connector is in a first position. A request for the card edge connector to be in a second position can be received. It is determined to adjust the card edge connector. The card edge connector is adjusted using a set of electroactive polymers. In embodiments, such adjustment can include introducing a voltage which causes the set of electroactive polymers to adjust a set of contacts between the first and second positions.

A semiconductor package carrier used to support a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) as the semiconductor package is moved from a shipping tray to a land grid array (LGA) socket during assembly of an electronic device. The semiconductor package carrier including a carrier body including a plurality of support structures arranged to support a portion of the semiconductor package. The semiconductor package carrier further including a locking structure moveable between a first position and a second position, wherein the first position allows the support structures to receive the semiconductor package and the second position secures the semiconductor package to the carrier body. In some embodiments, the semiconductor package carrier may also include a thermal interface material (TIM) breaker to facilitate removal of a heatsink from the semiconductor package. Other embodiments are described and claimed.

A semiconductor package carrier used to support a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) as the semiconductor package is moved from a shipping tray to a land grid array (LGA) socket during assembly of an electronic device. The semiconductor package carrier including a carrier body including a plurality of support structures arranged to support a portion of the semiconductor package. The semiconductor package carrier further including a locking structure moveable between a first position and a second position, wherein the first position allows the support structures to receive the semiconductor package and the second position secures the semiconductor package to the carrier body. In some embodiments, the semiconductor package carrier may also include a thermal interface material (TIM) breaker to facilitate removal of a heatsink from the semiconductor package. Other embodiments are described and claimed.

An axially resilient press-in contact pin includes a metal body and an electrically conductive, elastic element. The metal body includes a pin-shaped section and a press-in spring. The press-in spring is on a first end of the pin-shaped section. The elastic element surrounds at least portions of the pin-shaped section and extends beyond a second end (i.e., free end region) of the pin-shaped section.

A contact device system having a plate-shaped carrier and at least five accommodating areas are disposed on a bottom side of the pressing unit, at least five accommodating areas and at least five contact area pairs are disposed on a top side of the carrier. The contact area pairs each have a first and second electrically conductive contact area, and in each case the first contact area is spaced apart from the second contact area and insulated electrically therefrom. The first and second contact areas have a functional electrical connection to an evaluation circuit via a trace section. The carrier has a plurality of accommodating areas for a packaged electronic component, that each have one of the at least five contact area pairs. The electronic components have at least two terminal contacts, whereby after accommodation of the packaged electronic components, the terminal contacts of the particular component are pressed down.

In a housing of a connector, there is formed an opening to be fitted with a protruding portion formed on a flat cable in a state in which a terminal section of the flat cable is electrically connected with contactors of a contact portion in an opening space.

In a housing of a connector, there is formed an opening to be fitted with a protruding portion formed on a flat cable in a state in which a terminal section of the flat cable is electrically connected with contactors of a contact portion in an opening space.

The invention relates to a device and a method for thermally treating components, in particular electronic components or the like, the device comprising a batch tray (10) and at least two groups of components placed on the batch tray, the groups of components each comprising at least a first component and a second component connected or to be connected to the first component, the batch tray having at least two tray units (11) each accommodating a group of components. The tray units each have a tray (12) and a connecting member (13) for connecting the trays to each other, the connecting member being formed by at least one connecting element (14), a material of the connecting element and/or the trays being selected in such a manner that the connecting element and/or the tray exhibits thermal expansion in at least one linear direction when thermally treated, said thermal expansion essentially corresponding to a thermal expansion of the first component and/or the second component in the linear direction.

The invention relates to a device and a method for thermally treating components, in particular electronic components or the like, the device comprising a batch tray (10) and at least two groups of components placed on the batch tray, the groups of components each comprising at least a first component and a second component connected or to be connected to the first component, the batch tray having at least two tray units (11) each accommodating a group of components. The tray units each have a tray (12) and a connecting member (13) for connecting the trays to each other, the connecting member being formed by at least one connecting element (14), a material of the connecting element and/or the trays being selected in such a manner that the connecting element and/or the tray exhibits thermal expansion in at least one linear direction when thermally treated, said thermal expansion essentially corresponding to a thermal expansion of the first component and/or the second component in the linear direction.