An electronic component carrier board includes a plurality of carrier plates, a plurality of insulating layers and a plurality of conductive members. The carrier plates are formed with a plurality of slots. The insulating layers are disposed between the carrier plates. The conductive members are made of conductive material and each is disposed in one of the slots. Each of the conductive members includes a tubular body that is inserted in a corresponding one of the slots and that defines a conductive space, and a pin body that is inserted in the conductive space and that is electrically connected with the tubular body. For each of the conductive members, at least one of the tubular body and the pin body is detachably disposed in the corresponding one of the slots.

An electronic component carrier board includes a plurality of carrier plates, a plurality of insulating layers and a plurality of conductive members. The carrier plates are formed with a plurality of slots. The insulating layers are disposed between the carrier plates. The conductive members are made of conductive material and each is disposed in one of the slots. Each of the conductive members includes a tubular body that is inserted in a corresponding one of the slots and that defines a conductive space, and a pin body that is inserted in the conductive space and that is electrically connected with the tubular body. For each of the conductive members, at least one of the tubular body and the pin body is detachably disposed in the corresponding one of the slots.

A loading mechanism for a land grid array (LGA) semiconductor package can include a backplate configured to attach to a motherboard, a socket attached to the motherboard opposite the backplate, and a load plate configured to secure the LGA semiconductor package into the socket. The load plate can be removably coupled to the backplate and can include contact interfaces extending from the load plate and configured to contact the LGA semiconductor package when the LGA semiconductor package is loaded into the socket. The load plate can also include three or more spring elements configured to accommodate mechanical tolerances in one or more of the loading mechanism, the LGA semiconductor package, or the socket.

A loading mechanism for a land grid array (LGA) semiconductor package can include a backplate configured to attach to a motherboard, a socket attached to the motherboard opposite the backplate, and a load plate configured to secure the LGA semiconductor package into the socket. The load plate can be removably coupled to the backplate and can include contact interfaces extending from the load plate and configured to contact the LGA semiconductor package when the LGA semiconductor package is loaded into the socket. The load plate can also include three or more spring elements configured to accommodate mechanical tolerances in one or more of the loading mechanism, the LGA semiconductor package, or the socket.