An apparatus comprising an interconnect comprising a conductive core; a first conductive layer connected to the conductive core and extending parallel to the conductive core towards a first end of the conductive core; a second conductive layer connected to the conductive core and extending parallel to the conductive core towards a second end of the conductive core; a first non-conductive layer between the conductive core and the first conductive layer; and a second non-conductive layer between the first conductive layer and the second conductive layer.

The present invention provides a method for designing USB floating with low electromagnetic interference, especially in a scenario in which a distance between a pin and a metal housing of a USB interface of a terminal device is increasingly small. A first plug and a second plug are connected by using a connection cable having a first shield layer and a second shield layer. The first shield layer and the second shield layer overlap and there is no electrical connection between the first shield layer and the second shield layer. One end of the first shield layer is connected to a metal housing of the first plug, and the other end is suspended. One end of the second shield layer is connected to a metal housing of the second plug, and the other end is suspended. In addition, a metal housing of a first socket and a metal housing of a second socket may be connected to a housing of the terminal device or a housing of an adapter by using a capacitive component, thereby helping the terminal device reduce a short circuit risk and radiation.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

A contact module includes a frame assembly having a leadframe and a dielectric frame partially encasing the leadframe. The leadframe includes ground conductors each having a transition portion extending between a mating end configured to be mated to a mating connector and a terminating end configured to be terminated to one of a circuit board or a cable conductor. The dielectric frame includes dielectric material encasing at least a portion of each transition portion. Each mating end extends from the dielectric frame for connection with the mating connector. Each terminating end extends from the dielectric frame for connection with the circuit board or the cable conductor. The contact module includes resistive elements within the dielectric frame. Each resistive element is coupled in series with the transition portion of the corresponding ground conductor.

An electrical connector is disclosed. The electrical connector has a casing, a terminal seat and a conductive plastic element. The terminal seat is mounted in the casing and has an insulator board and a terminal set. The terminal set has a ground terminal and a high-speed signal terminal set. One side of the conductive plastic element is mounted on an inner wall of the casing and another side thereof passes through the insulator board to be close to the high-speed signal terminal set. When the casing is electrically connected to a ground, the conductive plastic element is electrically connected to the ground through the casing. Therefore, the conductive plastic element may eliminate a noise interference caused by the high-speed signal terminal set during high-speed transmission. A crosstalk and a common-mode interference are also reduced to keep the stability of signal transmission of the electrical connector.

A Peripheral Component Interconnect Express/Serial Attached SCSI (PSAS) female connector includes a frame member, a terminal member, and a cover member; the frame member including a terminal groove disposed in the frame member and a tilt portion disposed in the terminal groove adjacent to a plug end; the terminal member inserted in the frame member and including a Serial Advanced Technology Attachment (SATA) 7 pin terminal, a Serial Attached SCSI (SAS) 40 pin terminal, a 15 Pin signal terminal, a 6 Pin terminal, and a 4 Pin terminal. When the PSAS female connector is engaged with the male connector, the SATA 7 Pin terminal and the SAS 40 Pin terminal are pressed by a terminal of the male connector to be bent toward an outer lateral side of the terminal groove to contact the elastic plate of the cover member. The present invention effectively improves the cross interference during high speed transmission, thereby achieving the Generation 5 performance requirement.

An land grid array (LGA) or hybrid land grid array (HLGA) includes a socket housing and a plurality of electrical contacts. The socket housing is made of a first material that defines a first dielectric constant. The plurality of electrical contacts extends through the socket housing to electrically couple a printed circuit board on a first side of the socket housing to a processor on a second side of the socket housing. A coating of a second material that defines a second dielectric constant that is higher than the first dielectric constant covers surfaces of a subset of the plurality of electrical contacts.

There is provided a coaxial connector device that enables a reduction in deterioration in signal quality and transmission characteristics at high frequencies. A coaxial connector device 1 includes a main connector 10 and a board connector 20. A main connector body 11 has a first fitting part R1 for a coaxial cable connector at one end and a second fitting part R2 at the other end. Inside the main connector body 11, a center contact 13 and a card edge substrate 17 electrically connected to the center contact 13 are included. In a board connector body 21 a slot 23 is formed. When the second fitting part R2 of the main connector 10 is fitted to the board connector 20, the end portion of the card edge substrate 17 is coupled to the slot 23 of the board connector body 21, a plurality of substrate contacts included in the card edge substrate 17 electrically contacts a plurality of inner contacts 25 of the board connector body 21, and the second fitting part R2 of the main connector body 11 electrically contacts an outer conductor contact 27.

Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.