An apparatus includes a base having walls that define a track. The track has input and output ends and defines a coiled path that spirals inward from the input end, reaches an inflection point where a direction of curvature is reversed, and spirals outward towards the output end. The track is configured to receive and maintain a majority of an optical fiber in an at least substantially planar coiled arrangement. The apparatus also includes a first transition arm positioned at the input end and a second transition arm positioned at the output end. Each transition arm is configured to be mechanically coupled to the base and includes a groove configured to receive and maintain a portion of the optical fiber in an at least substantially straight orientation. The walls and transition arms are configured to maintain thermal contact with the optical fiber along its entire length.

Impingement cooling devices for a laser disk include a carrier plate on the front side of which the laser disk can be secured, and a supporting structure, on the front side of which the rear side of the carrier plate is secured. The supporting structure has a plurality of cooling liquid feed lines from which the cooling liquid emerges in the direction of the rear side of the carrier plate and a plurality of cooling liquid return lines. The feed and return lines run parallel to one another in the longitudinal direction of the supporting structure, and the supporting structure includes a plurality of cutouts or the rear side of the carrier plate that are open toward the supporting structure, and the cooling liquid feed lines lead into and the cooling liquid return lines lead away from the plurality of cutouts.

A system includes a heat sink module and a driving circuit module. The heat sink module includes stepped through-holes that each includes a cylindrical upper and lower portions connected by a ring-shaped surface. The bottom surface of the heat sink module includes grooves that respectively pass through the lower portions of respective sequences of the stepped through-holes. The driving circuit module includes conductive connectors and electrical driving surfaces that are disposed external to the heat sink module. Each conductive connector lies within a respective groove in the bottom surface of the heat sink module. The conductive connectors include internal connectors that each link at least two stepped through-holes in a respective sequence of stepped through-holes passed by a respective groove, and include external connectors that each link at least one stepped through-hole in the respective sequence of stepped through-holes to the electrical driving surfaces.

A bulk compressor for use in a chirped pulse amplification system (CPA) comprising a tunable pulse stretcher and an amplifier is provided. The bulk compressor includes a mounting block formed as a monolithic structure and made of solid material. The mounting block may define a plurality of mounting surfaces each forming a collar surrounding a light passage. Optical components are mounted on the mounting block in a fixed mutual spatial relationship, each optical component having a front face having a peripheral portion mounted in direct contact with the collar formed by a respective one of the mounting surfaces. The bulk compressor may be provided as a stand-alone component, a part of a stretcher-compressor pair or a full CPA system, and may be used in a method for amplifying input optical pulses.

An amplifier assembly may include a first heat sink plate that includes a first channel, a second heat sink plate that includes a second channel, and an amplifier rod disposed in the first channel and the second channel. The second heat sink plate may be connected with the first heat sink plate such that the first channel and the second channel align. The amplifier rod may be connected to the first heat sink plate and the second heat sink plate by a non-eutectic solder.

The invention relates to a LASER amplification module for a solid-state laser system and method for manufacturing thereof. The present invention relates to a laser amplification module for a solid-state laser. More particularly, the present invention relates to the module amplifying laser beam capable to provide effective cooling of a heat sink bonded to a solid-state disk. The monolithic laser amplification module (1) comprises a solid-state disk (2); a monolithic composite (6) comprising a heat sink (3) and a reflecting coating (4) configured to at least partially reflect an incident beam (5) propagated in the solid-state disk (2) in a wavelength range λ from 200 nm-10 μm, wherein the reflecting coating (4) is deposited on surface of the heat sink by a deposition method, wherein the heat sink (3) has: transverse thermal conductivity at least 100 W/m*K, Young's modulus at least 100 GPa, preferably at least 300 GPa; and thickness of the heat sink at least 1 mm, preferably at least 2 mm; and wherein the solid-state disk and the monolithic composite have surfaces (61 and 21) having PV-flatness<210 nm and have a surface roughness RMS<2 nm; and wherein the surfaces (21 and 61) of the solid-state disk (2) and the monolithic composite (6) are directly and permanently bonded together.

A laser transmitter assembly for use in a Coherent Doppler Wind Lidar (“CDWL”) system includes a telescope/scanner assembly, a receiver, and a master oscillator crystal and a power amplifier crystal each constructed of Ho:YAG. The crystals are end-pumped to transmit an output beam through the telescope/scanner assembly with a high repetition rate of 200-300 Hz and 35 mJ of energy. As part of the CDWL system, a pump laser end-pumps the master oscillator and power amplifier crystals using a pump beam having a nominal wavelength of 1.905 μm. A seed laser transmits a seeding beam into the master oscillator crystal at a nominal wavelength of 2.0965 μm. The telescope/scanner assembly transmits the generated laser beam through an atmosphere toward a scene of interest, collects a backscattered return signal, and communicates the backscattered return signal to the receiver during operation of the CDWL system.

A testing device may include a stage associated with holding an emitter wafer during testing of an emitter. The stage may be arranged such that light emitted by the emitter passes through the stage. The testing device may include a heat sink arranged such that the light emitted by the emitter during the testing is emitted in a direction away from the heat sink, and such that a first surface of the heat sink is near a surface of the emitter wafer during the testing but does not contact the surface of the emitter wafer. The testing device may include a probe card, associated with performing the testing of the emitter, that is arranged over a second surface of the heat sink such that, during the testing of the emitter, a probe of the probe card contacts a probe pad for the emitter through an opening in the heat sink.

A carbon dioxide gas-discharge slab-laser is assembled in a laser-housing. The laser-housing is formed from a hollow extrusion. An interior surface of the extrusion provides a ground electrode of the laser. Another live electrode is located within the extrusion, electrically insulated from and parallel to the ground electrode, forming a discharge-gap of the slab-laser. The electrodes are spaced apart by parallel ceramic strips. Neither the extrusion, nor the live electrode, include fluid coolant channels. The laser-housing is cooled by fluid-cooled plates attached to the outside thereof.

A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.