A control system includes a field-programmable gate array (FPGA), a digital-to-analog conversion (DAC) circuit, an external TEC driver, and a pump chip. The field-programmable gate array (FPGA) includes a pump driver and a thermoelectric-cooler (TEC) controller. The digital-to-analog conversion (DAC) circuit is coupled to the FPGA. The external TEC driver is external to the FPGA and coupled to the FPGA. The pump chip includes a pump and a TEC and is coupled to the DAC circuit and the external TEC driver.

Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.

A laser device includes a vacuum container including a wall portion, a laser medium disposed inside the vacuum container, a cooler disposed outside the vacuum container, and a heat conductor penetrating the wall portion in a predetermined direction and connected to the laser medium and the cooler.

An active device with a heat sink and low mechanical stress comprises a heat-producing substrate having a first thermal expansion coefficient; a heat sink having a second thermal expansion coefficient, wherein the first and second thermal expansion coefficients are different; and an interface between the heat-producing substrate and the heat sink formed so that, when the heat-producing substrate is operating at a predetermined temperature, a mechanical stress between the heat-producing substrate and the heat sink is substantially minimized. The heat sink has a yield strength that is lower than a yield strength of the heat-producing substrate and has been plastically deformed during fabrication to minimize the stress between the heat-producing substrate and the heat sink. Methods for fabricating the device are also disclosed.

A fiber laser apparatus includes: a short-length type fiber to which an active element is added and that has a length of 300 mm or less: a ferrule attached to an end of the fiber; and a housing that accommodates the fiber and supports the fiber with the ferrule. Each of the housing and the ferrule is composed of a material having a first thermal expansion coefficient that is equal to or have a predetermined difference from a second thermal expansion coefficient of a raw material of the fiber. The predetermined difference between the first and second thermal expansion coefficients is within −8.6×10.sup.−6 to 11.4×10.sup.−6/K.

Provided is a laser device in which: a laser medium doped with ytterbium emits light upon absorption of excitation light; the light emitted by the laser medium is amplified to obtain output light; and the output light is outputted in the form of a plurality of pulses. In the laser device, a spatial filter is disposed in the optical path of the light emitted by the laser medium or is disposed in the optical path of the output light outputted from an optical resonator, the spatial filter being configured to filter out a portion of the light or of the output light around the optical axis.

A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.

This application discloses a laser emission module and a LIDAR. The laser emission module includes: a laser emitter, a heat conduction substrate including a first board surface, and a first support board including a third board surface facing toward the laser emitter. The first board surface is configured to connect the laser emitter. The third board surface has a mounting region. The heat conduction substrate corresponding to the mounting region is mounted on the first support board.

A chamber device includes an inner housing including a passage port through which light generated by excitation of laser gas at an internal space thereof passes, an outer housing surrounding at least a part of the inner housing from a lateral side of a travel direction of the light, and a partition wall arranged between the inner housing and the outer housing and fixed to the inner housing and the outer housing.

Apparatus and methods for producing ultrashort optical pulses are described. A high-power, solid-state, passively mode-locked laser can be manufactured in a compact module that can be incorporated into a portable instrument for biological or chemical analyses. The pulsed laser may produce sub-100-ps optical pulses at a repetition rate commensurate with electronic data-acquisition rates. The optical pulses may excite samples in reaction chambers of the instrument, and be used to generate a reference clock for operating signal-acquisition and signal-processing electronics of the instrument.