A laser resonator assembly and a method of assembly of the laser resonator assembly are described. The laser resonator assembly has a gain element and an output coupler that are placed in a gain element frame and output coupler frame, respectively. The output coupler may also be a saturable absorber element so that the laser resonator assembly emits Q-switched pulses. The frames provide heat dissipation and can be easily aligned and permanently affixed in an appropriate alignment. A laser using the laser resonator assembly can be assembled in a low-cost manner.

A laser resonator assembly and a method of assembly of the laser resonator assembly are described. The laser resonator assembly has a gain element and an output coupler that are placed in a gain element frame and output coupler frame, respectively. The output coupler may also be a saturable absorber element so that the laser resonator assembly emits Q-switched pulses. The frames provide heat dissipation and can be easily aligned and permanently affixed in an appropriate alignment. A laser using the laser resonator assembly can be assembled in a low-cost manner.

A heat sink assembly may include an alignment body with an opening configured to receive a crystal rod, wherein the opening is configured to maintain a crystalline orientation of the crystal rod relative to a physical orientation of the alignment body. The heat sink assembly may include a first cooling stack, wherein the first cooling stack includes a first cutout to receive the crystal rod and the alignment body. The heat sink assembly may include a second cooling stack, wherein the second cooling stack includes a second cutout to receive the crystal rod and the alignment body, and wherein the first cooling stack and the second cooling stack are configured to mate and at least partially sandwich the crystal rod and the alignment body.

A heat sink assembly may include an alignment body with an opening configured to receive a crystal rod, wherein the opening is configured to maintain a crystalline orientation of the crystal rod relative to a physical orientation of the alignment body. The heat sink assembly may include a first cooling stack, wherein the first cooling stack includes a first cutout to receive the crystal rod and the alignment body. The heat sink assembly may include a second cooling stack, wherein the second cooling stack includes a second cutout to receive the crystal rod and the alignment body, and wherein the first cooling stack and the second cooling stack are configured to mate and at least partially sandwich the crystal rod and the alignment body.

Chip technology for fabricating ultra-low-noise, high-stability optical devices for use in an optical atomic clock system. The proposed chip technology uses diamond material to form stabilized lasers, frequency references, and passive laser cavity structures. By utilizing the exceptional thermal conductivity of diamond and other optical and dielectric properties, a specific temperature range of operation is proposed that allows significant reduction of the total energy required to generate and maintain an ultra-stable laser. In each configuration, the diamond-based chip is cooled by a cryogenic cooler containing liquid nitrogen.

Chip technology for fabricating ultra-low-noise, high-stability optical devices for use in an optical atomic clock system. The proposed chip technology uses diamond material to form stabilized lasers, frequency references, and passive laser cavity structures. By utilizing the exceptional thermal conductivity of diamond and other optical and dielectric properties, a specific temperature range of operation is proposed that allows significant reduction of the total energy required to generate and maintain an ultra-stable laser. In each configuration, the diamond-based chip is cooled by a cryogenic cooler containing liquid nitrogen.

An optical resonator, a constituent part of the optical resonator, and a laser device that enable a reduction in size even if a wavelength band limiting element is disposed in the optical resonator, are provided.

An optical resonator including: a laser medium that is disposed between a pair of reflection members, and emits emitted light that has been excited by excitation light that has been predetermined; and a wavelength band limiting element that is disposed on a side of emission of the emitted light between the pair of reflection members, includes two reflection flat faces that are orthogonal to an optical axis of the laser medium, and limits a wavelength band of the emitted light, in which the wavelength band limiting element is disposed in a position that prevents a resonance component outside an intended wavelength range of the wavelength band limiting element from being generated between a reflection member on a laser beam emission side from among the pair of reflection members and the wavelength band limiting element.

A heat sink assembly may include a first cooling stack. The first cooling stack may include a silver-diamond composite material. The heat sink assembly may include a second cooling stack. The second cooling stack may include the silver-diamond composite material. The heat sink assembly may include a crystal rod. The crystal rod may be an ytterbium-doped, yttrium-aluminum-garnet laser medium. The crystal rod may be at least partially sandwiched by the first cooling stack and the second cooling stack.

A heat sink assembly may include a first cooling stack. The first cooling stack may include a silver-diamond composite material. The heat sink assembly may include a second cooling stack. The second cooling stack may include the silver-diamond composite material. The heat sink assembly may include a crystal rod. The crystal rod may be an ytterbium-doped, yttrium-aluminum-garnet laser medium. The crystal rod may be at least partially sandwiched by the first cooling stack and the second cooling stack.

The present disclosure relates to a gain optical fiber heat-dissipating device for high power ultra-fast laser, including a gain optical fiber and a heat-dissipating structure. The heat-dissipating structure includes a metal tube, a flexible heat-conducting layer and a water-cooling structure. The gain optical fiber is passed through the metal tube, and the flexible heat-conducting layer is provided between the metal tube and the gain optical fiber. The water-cooling structure is provided on the metal tube to reduce temperature of the gain optical fiber. The gain optical fiber heat-dissipating device according to the present disclosure can dissipate the heat through a water-cooling mode, and realize rapid heat dissipation, thus improving heat-dissipating efficiency.