A light emitting device includes a submount, a semiconductor laser device, and a base supporting the submount. The submount includes a graphite layer having upper and lower surfaces extending in first and second directions orthogonal to each other and a support layer having upper and lower surfaces extending in the first and second directions. The graphite layer includes a plurality of graphene structures layered in the first direction. Each of the plurality of graphene structures extends in the second direction. The support layer is thicker than the graphite layer. The upper surface of the support layer supports the lower surface of the graphite layer. The semiconductor laser device emits laser light through an end surface in the first direction. The semiconductor laser device includes a waveguide that extends in the first direction and is supported by the upper surface of the graphite layer.

A light emitting device includes a submount, a semiconductor laser device, and a base supporting the submount. The submount includes a graphite layer having upper and lower surfaces extending in first and second directions orthogonal to each other and a support layer having upper and lower surfaces extending in the first and second directions. The graphite layer includes a plurality of graphene structures layered in the first direction. Each of the plurality of graphene structures extends in the second direction. The support layer is thicker than the graphite layer. The upper surface of the support layer supports the lower surface of the graphite layer. The semiconductor laser device emits laser light through an end surface in the first direction. The semiconductor laser device includes a waveguide that extends in the first direction and is supported by the upper surface of the graphite layer.

A method includes providing a first plate for a front wall that defines a front surface of a recess to accommodate a laser diode, a second plate for a rear wall that defines a rear side of the recess, and a third plate for a main body that defines an upper side and lateral sides of the recess and is connected to the front wall and the rear wall. The third plate has through-holes arranged in a first direction and in a second directions orthogonal to the first direction. The plates are bonded together to produce a stacked body. The stacked body is cut along the first direction and the second direction to produce a plurality of caps from the stacked body. When cutting the stacked body along the first direction, a first incision is made along inner wall surfaces of through-holes adjacent along the first direction.

An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.

An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.

To provide a laser oscillator, in which an LD module is fixed to a cooling plate through insulated fixation that is superior in durability, cost, and workability in an insulated fixation operation. A laser oscillator includes an LD module. The LD module has one or a plurality of LD light source(s), and is placed on a thermally conductive insulating member placed on a cooling plate. The LD module of the laser oscillator is fixed to the cooling plate, via an elastic insulating member fixed to the cooling plate.

A lighting device for a vehicle includes a lighting device body that has a light source part and a housing body that supports the light source part, and a ventilation part-adjacent to the lighting device body and through which outside wind passes. The light source part has a light source element part that emits light and a heat release member that releases heat that is generated in the light source element part. The light source element part is inside of the housing body and the heat release member is exposed inside of the ventilation part.

A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.

A substrate for mounting a light-emitting element includes a base and a dam part. The base includes a front surface and a back surface that are principal surfaces thereof where the front surface includes a mounting part that is capable of mounting a light-emitting element thereon. The dam part is arranged on a peripheral part of the front surface to surround the mounting part. The front surface is inclined relative to the back surface at a predetermined angle. The dam part is provided with an opening part at a site where the front surface is inclined to decrease a thickness of the base, in the peripheral part of the front surface. A site of the dam part where the opening part is provided is inclined relative to the back surface in a direction of the front surface.

A semiconductor laser module includes a semiconductor laser chip, a first collimator element, and a package. The package includes: a body having a bottom and a top with an opening; a cap member; and a window member. The semiconductor laser chip has a light-emitting point for emitting laser light. The semiconductor laser chip is located on the bottom so as to emit the laser light in a direction parallel to the principal surface of the bottom. The laser light has a greater divergence angle along the first axis than a divergence angle along a second axis perpendicular to the first axis. The first collimator element includes a concave mirror surface. The mirror surface reflects the laser light toward the opening, and reduces the divergence angle of the laser light along the first axis.