The object is to provide a technique that allows a semiconductor laser to be efficiently cooled. A semiconductor laser light source device includes: a semiconductor laser; a cooler that cools the semiconductor laser; and a driving substrate that drives the semiconductor laser. The cooler is placed in contact with a surface of the semiconductor laser that is opposite to a light emitting surface of the semiconductor laser. Furthermore, the driving substrate is placed in contact with a surface of the cooler that is opposite to a surface of the cooler on which the semiconductor laser is placed.

A heat removal system for use in optical and optoelectronic devices and subassemblies is provided. The heat removal system lowers the power consumption of one or more active cooling components within the device or subassembly, such as a TEC, which is used to remove heat from heat generating components within the device or subassembly. For any particular application, the heat removal system more efficiently removes the heat from the active cooling component, by using a heat transfer assembly, such as a planar heat pipe type assembly. The heat transfer assembly employs properties like, but not limited to, phase transition change and thermal conductivity to move heat without external power. In some embodiments, the heat transfer assembly can be used to allow the active cooling component, such as a TEC to be removed, leaving the heat transfer assembly to remove the heat from the device or subassembly.

A compact and inexpensive air-cooled laser device, having heat radiating fins configured to sufficiently cool a heat-receiving member thermally connected to a laser diode module positioned within a housing of the laser device having a substantially sealing structure. A flow direction of air flowing between heat radiating fins of a first fin set and a flow direction of air flowing between heat radiating fins of a second fin set are generally opposed to each other. Further, the first and second fin sets are positioned adjacent to each other, and thus an inflow area of the first fin set and an outflow area of the second fin set are also adjacent to each other. Therefore, most of the air after flowing between the fins of the first fin set is deflected by colliding with an inner wall of a housing, and then enters between the fins of the second fin set.

An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

A photonic device comprises a heterogenous laser source and heat-dissipating means that are configured to dissipate the heat liable to be emitted by the laser source. The heat-dissipating means implements a heat-transferring layer and a heat-transferring element that are arranged to interact with contact pads accessible on the front side of the photonic device and, the heat-transferring layer is made of an electrically insulating material and makes contact with either or both of the contact pads. The heat-transferring element is located exclusively in contact with the heat-transferring layer.

A cooling fan (1) for cooling an electronic device (2) is disclosed. The cooling fan (1) comprises a heat sink (5) thermally connectable to the electronic device (2), the heat sink (5) having a first clearance side (6a, 6b) centered relative to a longitudinal axis (L) of the heat sink (5), and several thermally conductive fan blades (13) arranged in a circle centered on the longitudinal axis (L). The fan blades (13) are rotatable relative to the heat sink (5) about the longitudinal axis (L) by a motor (19) and each fan blade (13) has a second clearance side (14) facing the first clearance side (6a, 6b). A clearance space (18) is provided between the first clearance side (6) and each second clearance side (14), the majority of said clearance spaces (18) having a size of 100 micrometer or less in a direction perpendicular to the first clearance side (6a, 6b) and the corresponding second clearance side (18).

An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

A metasurface reflector for quantum cascade lasing is disclosed. The metasurface reflector uses an array of subcavities disposed on a substrate and spaced with a sub-wavelength period. Each of the subcavities includes a layer of quantum-cascade-laser-active material sandwiched between two metallic layers. The array of subcavities reflect an incident light of a resonant frequency with amplification. When used with an output coupler, a quantum cascade laser beam can be generated.

An optical transmitter includes a semiconductor laser, a thermoelement that is connected with the semiconductor laser and that heats or cools the semiconductor laser, a thermistor that detects the temperature of the semiconductor laser via the thermoelement, a laser drive circuit that drives the semiconductor laser, a thermoelement driving circuit that acquires information about the temperature of the semiconductor laser from the thermistor, and that controls a current flowing through the thermoelement in such a way that the temperature detected by the thermistor becomes equal to a set value, and a controller that varies the set value on the basis of monitor current information outputted from the semiconductor laser, the temperature information about the semiconductor laser which is notified from the thermistor, and laser driving current information notified from the laser drive circuit.

A cooling device including a cooling controller cools a laser light source in a laser device. The laser light source irradiates a medium with a laser beam. The cooling controller controls a cooling operation according to data associated with a heating state of a laser light source in the laser device.