A semiconductor device includes a substrate comprising a layer made of Ge and a semiconductor multilayer structure grown on the layer made of Ge. The semiconductor multilayer structure includes at least one first layer comprising a material selected from a group consisting of Al.sub.xGa.sub.1-xAs, Al.sub.xGa.sub.1-x-yIn.sub.yAs, Al.sub.xGa.sub.1-x-yIn.sub.yAs.sub.1-zP.sub.z, Al.sub.xGa.sub.1-x-yIn.sub.yAs.sub.1-zN.sub.z, and Al.sub.xGa.sub.1-x-yIn.sub.yAs.sub.1-z-cN.sub.zP.sub.c, Al.sub.xGa.sub.1-x-yIn.sub.yAs.sub.1-z-cN.sub.zSb.sub.c, and Al.sub.xGa.sub.1-x-yIn.sub.yAs.sub.1-z-cP.sub.zSb.sub.c, wherein for any material a sum of the contents of all group-III elements equals 1 and a sum of the contents of all group-V elements equals 1. The semiconductor multilayer structure also includes at least one second layer comprising a material selected from a group consisting of GaInAsNSb, GaInAsN, AlGaInAsNSb, AlGaInAsN, GaAs, GaInAs, GaInAsSb, GaInNSb, GaInP, GaInPNSb, GaInPSb, GaInPN, AlInP, AlInPNSb, AlInPN, AlInPSb, AlGaInP, AlGaInPNSb, AlGaInPN, AlGaInPSb, GaInAsP, GaInAsPNSb, GaInAsPN, GaInAsPSb, GaAsP, GaAsPNSb, GaAsPN, GaAsPSb, AlGaInAs and AlGaAs.

A laser array includes a plurality of laser diodes arranged and electrically connected to one another on a surface of a non-native substrate. Respective laser diodes of the plurality of laser diodes have different orientations relative to one another on the surface of the non-native substrate. The respective laser diodes are configured to provide coherent light emission in different directions, and the laser array is configured to emit an incoherent output beam comprising the coherent light emission from the respective laser diodes. The output beam may include incoherent light having a non-uniform intensity distribution over a field of view of the laser array. Related devices and fabrication methods are also discussed.

In an embodiment an edge-emitting semiconductor laser includes a semiconductor layer sequence having a waveguide region with an active layer disposed between a first waveguide layer and a second waveguide layer and a layer system arranged outside the waveguide region configured to reduce facet defects in the waveguide region, wherein the layer system includes one or more layers with the material composition Al.sub.xIn.sub.yGa.sub.1-x-yN with 0≤x≤1, 0≤y<1 and x+y≤1, wherein at least one layer of the layer system includes an aluminum portion x≤0.05 or an indium portion y≥0.02, wherein a layer strain is at least 2 GPa at least in some areas, and wherein the semiconductor layer sequence is based on a nitride compound semiconductor material.

An optoelectronic device including a semiconductor layer formed from a central segment and at least two lateral segments forming tensioning arms that extend along a longitudinal axis A1. The semiconductor layer furthermore includes at least two lateral segments forming electrical biasing arms that extend along a transverse axis A2 orthogonal to the axis A1.

Tensile strained germanium is provided that can be sufficiently strained to provide a nearly direct band gap material or a direct band gap material. Compressively stressed or tensile stressed stressor materials in contact with germanium regions induce uniaxial or biaxial tensile strain in the germanium regions. Stressor materials may include silicon nitride or silicon germanium. The resulting strained germanium structure can be used to emit or detect photons including, for example, generating photons within a resonant cavity to provide a laser.

A semiconductor light-emitting element includes: a substrate; an n-type clad layer above the substrate; an active layer above the n-type clad layer; and a p-type clad layer above the active layer. The active layer includes: a well layer; an n-side first barrier layer on an n-type clad layer side of the well layer; and a p-side barrier layer on a p-type clad layer side of the well layer. The p-side barrier layer comprises In. The n-side first barrier layer has an In composition ratio lower than an In composition ratio of the p-side barrier layer. The n-side first barrier layer has a band gap energy smaller than a band gap energy of the p-side barrier layer.

A semiconductor laser including: a first mirror layer; a second mirror layer; an active layer, a current confinement layer, a first region, and a second region, in which the first mirror layer, the second mirror layer, the active layer, the current confinement layer, the first region, and the second region constitute a laminated body, the first region and the second region constitute an oxidized region of the laminated body, in a plan view, the laminated body includes a first part, a second part, and a third part disposed between the first part and the second part and resonating light generated in the active layer, and in a plan view, at least at a part of the third part, W1>W3 and W2>W3, W1 is a width of the oxidized region of the first part, W2 is a width of the oxidized region of the second part, and W.sub.3 is a width of the oxidized region of the third part.

A semiconductor laser device, which outputs laser light, includes: a substrate; an n-type semiconductor layer disposed above the substrate; a light emitting layer disposed above the n-type semiconductor layer; a p-type semiconductor layer disposed above the light emitting layer; and at least one p electrode disposed above the p-type semiconductor layer. At least one groove is formed that extends from an upper surface of the p-type semiconductor layer to reach a lower surface of the light emitting layer, and extends in a resonance direction of the laser light. A remaining length, which is a distance between an output end face from which the laser light is outputted and a portion of each groove that is closest to the at least one p electrode, is longer than a non-injection region length, which is a distance between the output end face and the at least one p electrode.

The present invention relates to a semiconductor device (10), comprising a substrate (11), a semiconductor layer (12), a stressor layer (13), an insulator barrier (14) and a plurality of electrical connectors. The semiconductor layer (12) is sandwiched between the substrate (11) and the stressor layer (13). The stressor layer (13) is on top of the semiconductor layer (12) and is capable of inducing strain on the semiconductor layer (12). A method for fabricating a semiconductor device comprises the steps of forming a substrate (110), epitaxially growing a semiconductor layer on the substrate (120), depositing a stressor layer on the semiconductor layer (130) and forming a plurality of electrical connectors (140), wherein the electrical connectors are capable of electrically connecting the semiconductor device to an external circuit.

Tunable VCSELs (TVCSELs) employing expanded material systems with expanded mechanical/optical design space for semiconductor DBR mirrors on GaAs substrates. One is the InGaAs/AlGaAsP material system. It adds indium In to decrease InGaAs H-layer bandgap for higher refractive index and higher DBR layer refractive index contrast. Adding phosphorus P gives independent control of bandgap and strain of AlGaAsP low refractive index L-layers. The tensile strain of AlGaAsP L-layer compensates compressive strain of InGaAs H-layer and lowers the cumulative strain of the multilayer DBR structure. Another option is the InGaAsN(Sb)/AlGaAsP material system, where both types of layers can be lattice matched to GaAs. It uses indium In and nitrogen N, and possibly antimony Sb, to get independent control of strain and bandgap, and thus refractive index, of dilute nitride InGaAsN(Sb) H-layers, with lower bandgap and higher refractive index than starting GaAs. Using expanded material system enables reliable DBR mirrors with higher reflectivity and spectral bandwidth and tunable VCSELs with wider tuning range.