A current limiting circuit of a switching circuit, and a switching circuit are provided. The switching circuit uses a gallium nitride (GaN) power transistor as a main power transistor. The current limiting circuit includes a first terminal connected with a drain of the GaN power transistor, and a second terminal connected with a controller of the switching circuit. The current limiting circuit is configured to limit a current flowing out of a power supply terminal of the controller. The current limiting circuit suppresses a negative current flowing through the controller.

An ESD protection circuit includes a power MOS transistor disposed between a first line and a second line, a clamp circuit disposed between the first line and a first node to which a gate of the power MOS transistor is coupled, a first resistor disposed between the first node and the second line, a MOS transistor disposed between the first node and the second line, a third line supplied with a third potential generated by a constant-voltage circuit of the protection target circuit, and a second resistor and a first capacitor coupled in series between a second node coupled to the third line and the second line, wherein when defining a junction between the second resistor and the first capacitor as a third node, a gate of the MOS transistor is coupled to the third node.

An ESD protection circuit includes a terminal connected to the cathode of a first diode and to the anode of a second diode, where the cathode of the second diode is not made of epitaxial silicon.

A circuit includes a switch coupled between a configuration terminal and an internal node. In a method of operation, the configuration terminal of the circuit is coupled to an internal node during a configuration phase and decoupled from the internal node during normal operation.

An electronic device includes a first group III nitride transistor and an electrostatic discharge (ESD) protection circuit. The ESD protection circuit includes a diode and a second transistor. The diode has an anode electrically connected to a gate of the first group III nitride transistor. The second transistor has a drain electrically connected to the gate of the first group III nitride transistor, a gate electrically connected to a cathode of the diode and a source electrically connected to a source of the first group III nitride transistor.

An electronic device includes a first group III nitride transistor and an electrostatic discharge (ESD) protection circuit. an electronic device may include a first group III nitride transistor and an ESD protection circuit. The ESD protection circuit may include a first transistor, a second transistor, and a third transistor. The first transistor may have a source and a gate connected to each other and electrically connected to a gate of the first group III nitride transistor. The second transistor may have a source and a gate connected to each other and electrically connected to a source of the first group III nitride transistor. The third transistor may have a drain electrically connected to the gate of the first group III nitride transistor, a gate electrically connected to a drain of the first transistor and to a drain of the second transistor, and a source electrically connected to the source of the first group III nitride transistor.

The present disclosure provides an SST driving circuit, a chip, and a driving output method. The SST driving circuit includes: a signal driver for driving and outputting a signal to be driven, the signal driver including termination resistors; a first electrostatic current discharge module, providing first discharge paths for electrostatic currents generated in the signal driver; a second electrostatic current discharge module, connected in series with the termination resistors, providing second discharge paths for the electrostatic currents; and a power clamp, used for conducting the power clamp circuit, the first discharge paths and the second discharge paths when a power supply voltage of the signal driver exceeds a clamping voltage. The present disclosure provides different discharge paths, which effectively reduces voltage borne by a protected device through a voltage division method, and improves the device's ability to protect against electrostatic discharge.

An interface protection circuit and a device interface are disclosed. The interface protection circuit includes a capacitor and a transient voltage suppressor (TVS) transistor. A first end of the capacitor is connected to a connection port, a second end of the capacitor is connected to a first end of the TVS transistor and an interface chip, and a second end of the TVS transistor is grounded.

In some aspects, the disclosure is directed to methods and systems for providing voltage regulation and transient suppression from a battery to an integrated circuit. A resistor between a source power supply and the integrated circuit may dissipate power and reduce the voltage at the integrated circuit's input, with current through the resistor under control of an internal regulator of the integrated circuit.

In accordance with an embodiment, a method for protecting a circuit includes: receiving a stress caused by an electrostatic discharge (ESD) event from a first node; limiting a current using a current limiting element coupled between the first node and a second node connected to the circuit; and limiting a voltage on the second node caused by the ESD event using a protection circuit including at least one MOS transistor having a load path coupled to the second node, where the at least one MOS transistor is disposed in a well, and a bias circuit coupled to a gate and a bulk connection of the at least one MOS transistor and a supply node.