In one embodiment, a device is provided that includes: a plurality of actuators arranged into a plurality of rows and a plurality of columns; a plurality of row conductors corresponding to the plurality of rows; a plurality of column conductors corresponding to the plurality of columns; and a controller configured to select at least one of the actuators a row by raising a voltage on the corresponding row conductor to couple each selected actuator to its corresponding column conductor.

A variable speed drive for an electrostatic motor provides feedback control by conversion of measured current phases provided to the motor into a vector in a rotating rotor framework. This vector is used for evaluating corrective voltages and then reconverted to a non-rotating framework for application to the motor electrodes. Current-source drive circuits provide current stabilized outputs making such sophisticated control tractable.

A soft haptic device and a local control method are disclosed. The soft haptic device includes a soft actuator. The soft actuator includes an electroactive polymer film, a patterned electrode, and a dielectric liquid injected between the electroactive polymer film and the patterned electrode. The soft actuator generates a reconfigurable shape such that a form of an output shape and a number of outputtable shapes are changed depending on the number of electrodes constituting the patterned electrode, a shape of the electrodes, and an arrangement of the electrodes.

A vertical comb drive assembly may include a rotor assembly. The rotor assembly may include a comb anchor to attach the rotor assembly to a base, a comb rotor attached to the comb anchor, and a movable element attached to the comb rotor. The vertical comb drive assembly may include a stator assembly. The stator assembly may include a plate anchor to attach the stator assembly to the base, a plate, wherein the plate forms a comb stator, and a plate hinge to connect the plate to the plate anchor. The plate hinge and the plate may be configured for moving the plate from a first position where the comb rotor and the comb stator are both in a first plane to a second position where the comb rotor is in the first plane and the comb stator is in a second plane.

A multiple silicon trenches forming method and an etching mask structure, the method comprises: step S11, providing a MEMS sealing cap silicon substrate (100); step S12, forming n stacked mask layers (101, 102, 103) on the MEMS sealing cap silicon substrate (100), after forming each mask layer, photolithographing and etching the mask layer and all other mask layers beneath the same to form a plurality of etching windows (D1, D2, D3); step S13, etching the MEMS sealing cap silicon substrate by using the current uppermost mask layer and a layer of mask material beneath the same as a mask; step S14, removing the current uppermost mask layer; step S15, repeating the step S13 and the step S14 until all the n mask layers are removed. The present invention can form a plurality of deep trenches with high aspect ratio on the MEMS sealing cap silicon substrate using conventional semiconductor processes, avoiding the problem that the conventional spin coating cannot be conducted on a sealing cap wafer with deep trenches using photoresist.

A MEMS self-aligned high-and-low comb tooth and manufacturing method thereof, the comb tooth having a lifting structure, the lifting structure generating a displacement in the vertical direction to drive the movement of a movable comb tooth or a fixed comb tooth attached thereto. The manufacturing method thereof adopts a silicon wafer, the lifting structure and the comb tooth are sequentially formed on a mechanical structure layer, the fixed comb tooth and the movable comb tooth are formed with the same etching process, and the stress in the lifting structure displaces the fixed comb tooth and the movable comb tooth in the vertical direction, thus forming the self-aligned high-and-low comb tooth.

MEMS devices include a suspended element connected to a fixed part of a substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate. A sensor coupled to the suspended element and a damping structure coupled to the suspended element extends into a gap between the suspended element and the fixed part of the substrate. One or more fluid confinement structures are configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.

A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.

A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.

Systems and methods of interacting complex electric fields and static electric fields to effect motion are disclosed. An example method includes producing an action force having a reaction force perpendicular to the action force by interacting a relative velocity electric field based on charge of a moving first charged object and a static charge on a second charged object in a different inertial frame of reference. Another example method includes producing an action force having a reaction force perpendicular to the action force by interacting an acceleration generated electric field based on acceleration of a first charged object and a static charge on a second charged object in a different inertial frame of reference. Another example method includes producing an action force having a reaction force perpendicular to the action force by interacting a scalar electric potential and static electric field.