A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module including: a first phase switch including one or more first phase power switches; a second phase switch including one or more second phase power switches; and one or more controllers configured to detect a gate open condition of the first phase switch or the second phase switch.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first power module including: a first connection; a second connection; a first power switch including a first gate terminal, the first power switch configured to control a first flow of current between the first connection and the second connection based on a first signal to the first gate terminal; and a first point-of-use controller configured to provide the first signal to the first gate terminal to control the first power switch.

A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first decoupling capacitor configured to be connected to a positive connection of the battery and a negative connection of the battery; and a first power module including: a first upper phase switch configured to control a first upper phase flow of current between the positive connection of the battery and a first phase connection of the motor, and a first lower phase switch configured to control a first lower phase flow of current between a negative connection of the battery and the first phase connection of the motor.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power switch including a drain terminal, a source terminal, and a gate terminal; and one or more controllers configured to: detect a temperature of the power switch, a rate of change in current of the power switch, and a filtered current of the power switch, and control a pulse width of a gate control signal to the gate terminal based on the detected temperature of the power switch, the detected rate of change in current of the power switch, and the detected filtered current of the power switch.

A power module includes: a fin housing including a fluid passage; a power switch having an exterior surface; and a fin system comprising a plurality of fins attached to a base plate, the plurality of fins extending from the base plate and away from the exterior surface of the power switch, the fin system being in thermal connection with the exterior surface of the power switch and disposed within the fluid passage.

A motorized hand tool, such as a cordless ratchet wrench, that has a motor, one or more electronic components and/or integrated circuits, and a step-up converter that are housed or disposed in a housing of the tool. The step-up converter is adapted to prevent a voltage of a battery of the tool from dropping below a threshold voltage of a component or integrated circuit when current draw from the battery increases, thus preventing a brownout condition.

Hydraulic load management for electric motor driven systems, such as hydraulic systems in a work machine, is disclosed. The hydraulic system may include an electric motor coupled to a hydraulic pump to provide hydraulic fluid to a hydraulic actuator, and a power bus may connect an electric power source to the electric motor. Hydraulic load management may include determining an actual electric power available at the electric power source, comparing the actual electric power to a threshold electric power for operating the electric motor at a full capacity, and setting a value for an available electric power and a current power curve for the electric motor corresponding to the available electric power. When hydraulic system input is detected, electric power is provided via the power bus, and the electric motor is operated at a motor speed based on the current power curve and a commanded speed from the hydraulic system input.

Hydraulic load management for electric motor driven systems, such as hydraulic systems in a work machine, is disclosed. The hydraulic system may include an electric motor coupled to a hydraulic pump to provide hydraulic fluid to a hydraulic actuator, and a power bus may connect an electric power source to the electric motor. Hydraulic load management may include determining an actual electric power available at the electric power source, comparing the actual electric power to a threshold electric power for operating the electric motor at a full capacity, and setting a value for an available electric power and a current power curve for the electric motor corresponding to the available electric power. When hydraulic system input is detected, electric power is provided via the power bus, and the electric motor is operated at a motor speed based on the current power curve and a commanded speed from the hydraulic system input.

A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.