A high frequency signal amplifying circuitry of an embodiment includes a first splitter, a first amplifier, a second amplifier, a loop oscillation suppressor, and a combiner. The first amplifier includes a second splitter, a first carrier amplifier, a first peak amplifier, and a first combiner. The second amplifier includes a third splitter, a second carrier amplifier, a second peak amplifier, and a second combiner. The second carrier amplifier being adjacent to an associated the first carrier amplifier or the second peak amplifier being adjacent to an associated the first peak amplifier. The loop oscillation suppressor located between the second carrier amplifier and the associated first carrier amplifier or the second peak amplifier and the associated first peak amplifier.

A low-noise amplifier device includes an inductive input element, an amplifier circuit, an inductive output element and an inductive degeneration element. The amplifier device is formed in and on a semiconductor substrate. The semiconductor substrate supports metallization levels of a back end of line structure. The metal lines of the inductive input element, inductive output element and inductive degeneration element are formed within one or more of the metallization levels. The inductive input element has a spiral shape and the an amplifier circuit, an inductive output element and an inductive degeneration element are located within the spiral shape.

A transimpedance amplifier (TIA) structure includes an input node with a variable inductance component serving to reduce variation in peak amplitude over different gain conditions. According to certain embodiments, an inductor at the TIA input has a first node in communication with a Field Effect Transistor (FET) drain, and a second node in communication with the FET source. A control voltage applied to the FET gate effectively controls the input inductance by adding a variable impedance across the inductor. Under low gain conditions, lowering of inductance afforded by the control voltage applied to the FET reduces voltage peaking. TIAs in accordance with embodiments may be particularly suited to operate over a wide dynamic range to amplify incoming electrical signals received from a photodiode.

The current-to-voltage converter includes an input for the current to be converted, an output for the converted voltage, a current-to-voltage conversion resistor arranged between the output and a reference potential, a processing circuit including a transistor, the input being connected to the output via the transistor, a twin circuit including components identical to and disposed in a similar way to those of the processing circuit, a voltage follower connected at the input to the processing circuit and at the output to the twin circuit, and means for reinjecting the current at the output of the follower into the processing circuit.

The input stage (16) of a high-fidelity amplifier (10) with high linearity and a low distortion rate comprises:—an input (12) for the digital signal to be converted;—a voltage output (26) for the converted voltage;—a digital/analog converter (20), the input of which forms the input (12) for the digital signal to be converted, the digital/analog converter (20) having access to a signal terminal (24);—a voltage current conversion resistor (36) arranged between the voltage output (26) and a reference potential; and—a current/voltage converter (22) that has a voltage output and is arranged between the signal terminal (24) and the voltage outlet (26). The current/voltage converter (22) comprises a transistor (46). The source of the transistor (46) is only connected to the signal terminal (24) of the digital/analog converter (20).

A transformer includes: a primary winding comprising a first port, a second port and a metal layer connected between the first port and the second port, the metal layer comprising a plurality of sections of different electrical lengths and/or characteristic impedances; and a secondary winding electromagnetically coupled with the primary winding, the secondary winding comprising a first port, a second port and a metal layer connected between the first port and the second port, the metal layer comprising a plurality of sections of different electrical lengths and/or characteristic impedances.

Systems and methods for amplifying signals. In some embodiments, the signals may be amplified using a diode steering network with an amplifier operated in class AB mode. In some embodiments, distortion in the amplified signal may be corrected using a feed forward cancellation circuit operated in class A mode.

Methods and systems for accurate gain adjustment of a transimpedance amplifier using a dual replica and servo loop is disclosed and may include, in a transimpedance amplifier (TIA) circuit comprising a first TIA, a second TIA, and a third TIA, each comprising a configurable feedback impedance, and a control loop, where the control loop comprises a gain stage with inputs coupled to outputs of the first and second TIAs and an output coupled to the configurable feedback impedance of the second and third TIAs: configuring a gain level of the first TIA by configuring its feedback impedance, configuring a gain level of the third TIA by configuring a reference current applied to an input of the first TIA, and amplifying a received electrical signal to generate an output voltage utilizing the third TIA. The reference current may generate a reference voltage at one of the inputs of the gain stage.

An amplification device includes a base substrate, an amplification element, and a matching circuit board. The amplification element is mounted on the base substrate. The matching circuit board is mounted on the base substrate and includes a circuit pattern which is electrically connected to the amplification element. The matching circuit board includes a first side surface and a second side surface each extending in the longitudinal direction of the matching circuit board. A first recess is provided in the first side surface. A second recess facing the first recess is provided in the second side surface.

A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.