A digital transmitter architecture is disclosed to transmit (TX) multi-gigabit per second data signals on single carriers (SC) or orthogonal frequency division multiplexing (OFDM) carriers at millimeter wave frequencies in either one of a high-resolution modulation mode or a spectral shaping mode. The architecture includes a number of digital power amplifier (DPA) and modulation reconfigurable circuit segments to process individual bits of a data bit stream in parallel according to a specific circuit configuration corresponding to the selected TX mode using a multiplexer to switch between configurations.

A digital transmitter architecture is disclosed to transmit (TX) multi-gigabit per second data signals on single carriers (SC) or orthogonal frequency division multiplexing (OFDM) carriers at millimeter wave frequencies in either one of a high-resolution modulation mode or a spectral shaping mode. The architecture includes a number of digital power amplifier (DPA) and modulation reconfigurable circuit segments to process individual bits of a data bit stream in parallel according to a specific circuit configuration corresponding to the selected TX mode using a multiplexer to switch between configurations.

An electronic device may include wireless circuitry with a processor, a transceiver, an antenna, and a front-end module coupled between the transceiver and the antenna. The front-end module may include one or more power amplifiers for amplifying a signal for transmission through the antenna. A power amplifier may include a phase distortion compensation circuit. The phase distortion compensation circuit may include one or more n-type metal-oxide-semiconductor capacitors configured to receive a bias voltage. The bias voltage may be set to provide the proper amount of phase distortion compensation.

The present invention provides an amplifier including an input stage, an amplifier stage, a power stage and a de-gain stage. The input stage is configured to receive an input signal to generate an amplified signal. The amplifier stage is configured to generate a first driving signal and a second driving signal according to the amplified signal. The power stage comprises a first input terminal and a second input terminal, wherein the power stage is coupled to a supply voltage and a ground voltage, for receiving the first driving signal and the second driving signal from the first input terminal and the second input terminal, respectively, and generating an output signal.

A radio frequency module includes a mounting board, a power amplifier, a plurality of transmission filters, a first switch, an output matching circuit, a low-noise amplifier, and an external-connection terminal. The mounting board includes a first principal surface and a second principal surface on opposite sides of the mounting board. The first switch switches a connection between the power amplifier and the transmission filters. The output matching circuit is connected between the power amplifier and the first switch. The low-noise amplifier is disposed on the second principal surface of the mounting board. The external-connection terminal is disposed on the second principal surface of the mounting board. The power amplifier, the output matching circuit, the first switch, and the transmission filters are disposed on the mounting board in stated order in a direction that is orthogonal to a thickness direction of the mounting board.

A radio frequency module includes a mounting board, a power amplifier, a plurality of transmission filters, a first switch, an output matching circuit, a low-noise amplifier, and an external-connection terminal. The mounting board includes a first principal surface and a second principal surface on opposite sides of the mounting board. The first switch switches a connection between the power amplifier and the transmission filters. The output matching circuit is connected between the power amplifier and the first switch. The low-noise amplifier is disposed on the second principal surface of the mounting board. The external-connection terminal is disposed on the second principal surface of the mounting board. The power amplifier, the output matching circuit, the first switch, and the transmission filters are disposed on the mounting board in stated order in a direction that is orthogonal to a thickness direction of the mounting board.

A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.

A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.

The present disclosure relates to single-ended-to-differential amplifiers and radio frequency receivers. One example single-ended-to-differential amplifier includes a first inverting amplifier, a second inverting amplifier, and a third inverting amplifier. Both an input end of the first inverting amplifier and an input end of the second inverting amplifier are coupled to an input end of the single-ended-to-differential amplifier, an output end of the first inverting amplifier is coupled to an input end of the third inverting amplifier, an output end of the second inverting amplifier is coupled to a first output end of the single-ended-to-differential amplifier, and an output end of the third inverting amplifier is coupled to a second output end of the single-ended-to-differential amplifier. An impedance element is coupled between the input end of the first inverting amplifier and the output end of the first inverting amplifier.

The present disclosure relates to single-ended-to-differential amplifiers and radio frequency receivers. One example single-ended-to-differential amplifier includes a first inverting amplifier, a second inverting amplifier, and a third inverting amplifier. Both an input end of the first inverting amplifier and an input end of the second inverting amplifier are coupled to an input end of the single-ended-to-differential amplifier, an output end of the first inverting amplifier is coupled to an input end of the third inverting amplifier, an output end of the second inverting amplifier is coupled to a first output end of the single-ended-to-differential amplifier, and an output end of the third inverting amplifier is coupled to a second output end of the single-ended-to-differential amplifier. An impedance element is coupled between the input end of the first inverting amplifier and the output end of the first inverting amplifier.