Various embodiments disclose a method and a device including: an antenna, a switching regulator, communication chip including an amplifier and a linear regulator operably connected to the amplifier and the switching regulator, the communication chip configured to transmit a radio-frequency signal from the electronic device through the antenna, and control circuitry configured to control the communication chip such that the linear regulator provides the amplifier with a voltage corresponding to an envelope of an input signal input to the amplifier, the input signal corresponding to the radio-frequency signal.

An amplifier and corresponding method include a field-effect transistor (FET) amplifier and a cascode FET. Each FET may operate with a positive ratio between its third-order nonlinearity coefficient and its linear gain. An inductor added at a gate of the cascode FET, operatively coupled with other components in a circuit, results in a first equivalent impedance looking into an input of the cascode FET. The first equivalent impedance may substantially offset a distortion output of the FET amplifier based upon the added inductor. The inductor operatively coupled with the circuit may result in a second equivalent impedance looking out of the gate of the cascode FET. The second equivalent impedance may substantially offset a distortion output of the cascode FET based upon the added inductor. In addition, a programmable capacitor connected between the gate and drain of the cascode FET may further substantially offset a distortion output of each FET.

An amplifier and corresponding method include a field-effect transistor (FET) amplifier and a cascode FET. Each FET may operate with a positive ratio between its third-order nonlinearity coefficient and its linear gain. An inductor added at a gate of the cascode FET, operatively coupled with other components in a circuit, results in a first equivalent impedance looking into an input of the cascode FET. The first equivalent impedance may substantially offset a distortion output of the FET amplifier based upon the added inductor. The inductor operatively coupled with the circuit may result in a second equivalent impedance looking out of the gate of the cascode FET. The second equivalent impedance may substantially offset a distortion output of the cascode FET based upon the added inductor. In addition, a programmable capacitor connected between the gate and drain of the cascode FET may further substantially offset a distortion output of each FET.

An amplifier that is configured to amplify an RF signal includes a power combiner circuit. The power combiner circuit includes a first branch connected between a first RF input port and a summing node and a second branch connected between a second RF input port and the summing node. Each of the first and second branches includes an impedance inverter. The Chireix combiner is configured to present a Chireix load modulated impedance response to the first and second RF input ports. The power combiner circuit further includes compensation elements being configured to at least partially compensate for a reactance of the Chireix combiner circuit in a Doherty amplifier mode in which a signal is applied to the first RF input port and the second RF input port is electrically open.

An amplifier that is configured to amplify an RF signal includes a power combiner circuit. The power combiner circuit includes a first branch connected between a first RF input port and a summing node and a second branch connected between a second RF input port and the summing node. Each of the first and second branches includes an impedance inverter. The Chireix combiner is configured to present a Chireix load modulated impedance response to the first and second RF input ports. The power combiner circuit further includes compensation elements being configured to at least partially compensate for a reactance of the Chireix combiner circuit in a Doherty amplifier mode in which a signal is applied to the first RF input port and the second RF input port is electrically open.

In an embodiment, a high frequency amplifying circuit includes a semiconductor device. The semiconductor device includes a semiconductor substrate having a bulk resistivity ρ≧100 Ohm.Math.cm, a front surface and a rear surface, an LDMOS (Lateral Diffused Metal Oxide Semiconductor) transistor in the semiconductor substrate, and a RESURF structure comprising a doped buried layer arranged in the semiconductor substrate, spaced at a distance from the front surface and the rear surface, and coupled with at least one of a channel region and a body contact region of the LDMOS transistor.

In an embodiment, a high frequency amplifying circuit includes a semiconductor device. The semiconductor device includes a semiconductor substrate having a bulk resistivity ρ≧100 Ohm.Math.cm, a front surface and a rear surface, an LDMOS (Lateral Diffused Metal Oxide Semiconductor) transistor in the semiconductor substrate, and a RESURF structure comprising a doped buried layer arranged in the semiconductor substrate, spaced at a distance from the front surface and the rear surface, and coupled with at least one of a channel region and a body contact region of the LDMOS transistor.

A current feedback amplifier (CFA). The CFA includes a common-gate input stage, a biasing circuitry, and a differential pair coupled in parallel between the supply voltage node and the reference voltage node. The common-gate input stage amplifies an input signal received at an input node and supplies it to a gate of the complementary transistors of the differential pair. The biasing circuitry supplies a bias voltage to a gate of the transistors of the common-gate input stage. The input node of the common-gate input stage and a node between the complementary transistors in the first path of the differential pair are shorted.

In one embodiment, a dual-mode power amplifier that can operate in different modes includes: a first pair of metal oxide semiconductor field effect transistors (MOSFETs) to receive and pass a constant envelope signal; a second pair of MOSFETs to receive and pass a variable envelope signal, where first terminals of the first pair of MOSFETs are coupled to first terminals of the second pair of MOSFETs, and second terminals of the first pair of MOSFETs are coupled to. second terminals of the second pair of MOSFETs; and a shared MOSFET stack coupled to the first pair of MOSFETs and the second pair of MOSFETs.

Methods and apparatus for an amplifier including first and second transistors coupled in a stacked configuration with first and second current mirrors to provide respective bias signals to the amplifier transistors. A reference transistor is coupled to the first and second current mirrors for referencing the bias signals together.