A power amplifier module can be formed that includes metamaterial matching circuits. This power amplifier module can be included as part of a front-end module of a wireless device. The front-end module can replace a passive duplexer with an active duplexer that uses the power amplifier module in combination with a low noise amplifier circuit that can include a metamaterial matching circuit. The combination of PA and LNA circuits that utilize metamaterials can provide the functionality of a duplexer without including a stand-alone or passive duplexer. Thus, in certain cases, the front-end module can provide duplexer functionality without including a separate duplexer. Advantageously, in certain cases, the size of the front-end module can be reduced by eliminating the passive duplexer. Further, the loss introduced into the signal path by the passive duplexer is eliminated improving the performance of the communication system that includes the active duplexer.

A wireless communication device includes a signal generator supply a signal to an input node to which a power amplifier is connected. The power amplifier includes an inverter including a first transistor with a gate connected to the input node via a first signal path and a second transistor with a gate electrode connected to the input node via a second signal path. An output signal corresponding to the signal supplied to the input node is supplied from an output node between the first and second transistors. A filter is connected to the output node and outputs a filtered signal having a high frequency component removed. A bias application unit applies a first bias voltage to the first signal path and a second bias voltage to the second signal path. Levels of the bias voltages being set according to a direct current component in the filtered signal.

A wireless communication system including a phased array comprising a plurality of antennas configured to emit a respective radio wave based on a respective antenna signal. Further, the system includes a plurality of power amplifiers each coupled to one of the plurality of antennas via a feed line and configured to output the antenna signal to the feed line. Also, the system includes a plurality of directional couplers each coupled into one of the feed lines and comprising a third port configured to output a fraction of a power received at a first port coupled to the power amplifier via the feed line, likewise a fourth port configured to output a fraction of a power received at a second port. Additionally, the system includes switching circuitry configured to alternately couple the third port to a first feedback receiver, and to alternately couple the fourth port to a second feedback receiver.

A radio-frequency module includes a first inductor and a second inductor disposed on or above a major surface of a module substrate, a resin member, a metal shield layer covering a surface of the resin member, and a metal shield plate disposed on the major surface between the first inductor and the second inductor. The metal shield plate is in contact with a ground electrode of the major surface and the metal shield layer. The first inductor is disposed in any one of a transmitting path, a receiving path, and a transmitting and receiving path. The second inductor is disposed in any one of the transmitting path, the receiving path, and the transmitting and receiving path, other than the path in which the first inductor is disposed.

A radio-frequency module includes a first inductor and a second inductor disposed on or above a major surface of a module substrate, a resin member, a metal shield layer covering a surface of the resin member, and a metal shield plate disposed on the major surface between the first inductor and the second inductor. The metal shield plate is in contact with a ground electrode of the major surface and the metal shield layer. The first inductor is disposed in any one of a transmitting path, a receiving path, and a transmitting and receiving path. The second inductor is disposed in any one of the transmitting path, the receiving path, and the transmitting and receiving path, other than the path in which the first inductor is disposed.

Size reduction is enabled. A power amplifying circuit includes a splitter, a first amplifier, a second amplifier, and a third amplifier. The splitter splits an input signal into a first signal and a second signal. The first amplifier has a first input terminal and a first output terminal, amplifies the first signal, and outputs a first amplified signal. The second amplifier has a second input terminal and a second output terminal, amplifies the second signal, and outputs a second amplified signal. The third amplifier has a third input terminal and a third output terminal, amplifies the first signal, and outputs a third amplified signal. The first output terminal and the second output terminal are connected to each other, the third input terminal is connected to the first input terminal, and the third output terminal is connected to the second output terminal.

One or more systems, devices and/or methods of use provided herein relate to a baseband filter that can be used in a current-mode end-to-end signal path. The current-mode end-to-end signal path can include a digital to analog converter (DAC) operating in current-mode and an upconverting mixer, operating in current-mode and operatively coupled to the DAC. In one or more embodiments, a device used in the signal path can comprise a baseband filter that receives an input current and outputs an output current. The baseband filter can comprise a feedback loop component having an active circuit branch and a passive circuit branch coupled in a loop. A mirroring device can be coupled to the feedback loop component and can provide an output of the device. Selectively activating the mirroring device can vary gain, such as of the mirroring device.

In order to reduce costs as well as to effectively dissipate heat in certain RF circuits, a semiconductor device of the circuit can include one or more active devices such as transistors, diodes, and/or varactors formed of a first semiconductor material system integrated onto (e.g., bonded to) a base substrate formed of a second semiconductor material system that includes other circuit components. The first semiconductor material system can, for example, be the III-V or III-N semiconductor system, and the second semiconductor material system can, for example be silicon.

A radio frequency transceiver device includes an antenna unit, a first matching circuit, a receiver circuit, a second matching circuit, a transmitter circuit, and an auxiliary circuit. The receiver circuit includes a mixer unit. The auxiliary circuit includes a first transformer coil and a second transformer coil. The first matching circuit and the receiver circuit are configured to form a first signal reception channel to receive, process, and transmit the first radio frequency signal to the mixer unit when the first radio frequency signal is a high gain radio frequency signal. The second matching circuit and the auxiliary circuit are configured to form a second signal reception channel to receive, process, and transmit the first radio frequency signal to the mixer unit when the first radio frequency signal is a middle-low gain radio frequency signal. Another radio frequency signal transceiver device further includes a third matching circuit.

The present disclosure relates to semiconductor structures and, more particularly, to a differential circuit with automatic parasitic neutralization and gain boost and methods of manufacture. The structure includes a plurality of auxiliary circuit devices with back-gate controls to perform a boost gain, and a differential pair of circuit devices which are connected to the auxiliary circuit devices.