Techniques and examples pertaining to variation calibration for envelope tracking on chip are described. Envelope tracking (ET) statistics among multiple wireless-capable mobile devices (e.g., smartphones) may be collected in laboratory. Optimal ET parameters may be determined based on ET statistics. An ET setting file may be generated for ET factory calibration. In production lines, the ET setting file may be loaded into each mobile device for ET factory calibration.

Techniques and examples pertaining to variation calibration for envelope tracking on chip are described. Envelope tracking (ET) statistics among multiple wireless-capable mobile devices (e.g., smartphones) may be collected in laboratory. Optimal ET parameters may be determined based on ET statistics. An ET setting file may be generated for ET factory calibration. In production lines, the ET setting file may be loaded into each mobile device for ET factory calibration.

A power amplifying circuit includes a switching circuit, an amplifier and a load. The switching circuit receives a first supply voltage and a second supply voltage. When the switching circuit is in a first operation mode, the first supply voltage is provided to a node. When the switching circuit is in a second operation mode, the second supply voltage is provided to the node. The amplifier receives a first input signal and a second input signal, and outputs a first output signal and a second output signal from a first output terminal and a second output signal, respectively. The load includes a first inductor and a second inductor. The first inductor is connected between the node and the first output terminal. The second inductor is connected between the node and the second output terminal.

A power amplifying circuit includes a switching circuit, an amplifier and a load. The switching circuit receives a first supply voltage and a second supply voltage. When the switching circuit is in a first operation mode, the first supply voltage is provided to a node. When the switching circuit is in a second operation mode, the second supply voltage is provided to the node. The amplifier receives a first input signal and a second input signal, and outputs a first output signal and a second output signal from a first output terminal and a second output signal, respectively. The load includes a first inductor and a second inductor. The first inductor is connected between the node and the first output terminal. The second inductor is connected between the node and the second output terminal.

A limiter circuit is integrated into an RF power amplifier. The limiter circuit automatically starts adding attenuation at the input of the RF power amplifier after a predetermined input power level threshold is exceeded, thereby extending the safe input drive level to protect the amplifier. In a preferred embodiment of the invention, the limiter circuit is implemented using a pseudomorphic high electron mobility transistor (PHEMT) device or a metal semiconductor field effect transistor (MESPET) device. Diode connected transistors or Schottky diodes may also be used in the limiter circuit.

Embodiments disclosed herein generally relate to power amplifier matching circuits used for matching impedance and harmonic control in a device, such as a cellular phone. In one example, a power amplifier matching circuit includes two DVCs, four inductors, a transistor, and a capacitor. Utilizing the two DVCs, the impedance matching ratio and the center frequency of the circuit are capable of adjustment as needed. Moreover, the inclusion of the two DVCs may also prevent harmonic frequencies from undesirably passing through the power amplifier matching circuit to the antenna of a cellular device. The power amplifier matching circuit may be used in conjunction with an amplifier, where the output of the amplifier is proportional to the current in the circuit.

Embodiments disclosed herein generally relate to power amplifier matching circuits used for matching impedance and harmonic control in a device, such as a cellular phone. In one example, a power amplifier matching circuit includes two DVCs, four inductors, a transistor, and a capacitor. Utilizing the two DVCs, the impedance matching ratio and the center frequency of the circuit are capable of adjustment as needed. Moreover, the inclusion of the two DVCs may also prevent harmonic frequencies from undesirably passing through the power amplifier matching circuit to the antenna of a cellular device. The power amplifier matching circuit may be used in conjunction with an amplifier, where the output of the amplifier is proportional to the current in the circuit.

Integrated filter and electromagnetic coupler assemblies. In certain examples, an integrated filter and electromagnetic coupler assembly includes a filter having a capacitance and a series inductance, the series inductance being connected between an input port and an output port of the integrated filter and electromagnetic coupler assembly, and combination of the capacitance and the series inductance being selected to provide the filter with a passband and a stopband. The integrated filter and electromagnetic coupler assembly further includes a coupling element positioned physically proximate the series inductance and extending between a coupled port and an isolation port of the integrated filter and electromagnetic coupler assembly, the integrated filter and electromagnetic coupler assembly being configured to provide at the coupled port a coupled signal via inductive coupling between the series inductance and the coupling element responsive to receiving an input signal at the input port.

Apparatus and methods for an improved-efficiency Doherty amplifier are described. The Doherty amplifier may include a two-stage peaking amplifier that transitions from an “off” state to an “on” state later and more rapidly than a single-stage peaking amplifier used in a conventional Doherty amplifier. The improved Doherty amplifier may operate at higher gain values than a conventional Doherty amplifier, with no appreciable reduction in signal bandwidth.

An integrated circuit architecture and circuitry is defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and columns. The die structure has a first operating frequency region with a first transmit and receive chain, and a second operating frequency region with a second transmit chain and a second receive chain. There is a shared region of the die structure defined by an overlapping segment of the first operating frequency region and the second operating frequency region with a shared power supply input conductive pad connected to the first transmit chain, the second transmit chain, the first receive chain, and the second receive chain, and a shared power detection output conductive pad connected to the first transmit chain and the second transmit chain.