A single-stage radio frequency amplifier is provided with a signal amplification stage for a magnetic resonance tomography scanner, for example as a low-noise preamplifier in a local coil. The radio frequency amplifier includes a signal input, a signal amplifier, a signal output of the signal amplifier and a phase shifter. The phase shifter is in signal connection with the signal output and the signal input of the signal amplifier and is configured to couple a predetermined portion of an output signal of the signal amplifier with a predetermined phase shift into the signal input of the signal amplifier.

A single-stage radio frequency amplifier is provided with a signal amplification stage for a magnetic resonance tomography scanner, for example as a low-noise preamplifier in a local coil. The radio frequency amplifier includes a signal input, a signal amplifier, a signal output of the signal amplifier and a phase shifter. The phase shifter is in signal connection with the signal output and the signal input of the signal amplifier and is configured to couple a predetermined portion of an output signal of the signal amplifier with a predetermined phase shift into the signal input of the signal amplifier.

Embodiments of a method and a device are disclosed. In an embodiment, a method for operating a bias controller for an amplifier circuit involves obtaining temperature data corresponding to a temperature of the amplifier circuit, generating a proportional to absolute temperature (PTAT) bias voltage based on a first PTAT slope when the temperature is within a first range of temperatures or a second PTAT slope when the temperature is within a second range of temperatures, wherein the second PTAT slope is greater than the first PTAT slope, and biasing the amplifier circuit based on the generated PTAT bias voltage.

A wireless communication apparatus includes: a processor that performs distortion compensation on a transmission signal by using a distortion compensation coefficient; an amplifying unit that amplifies the transmission signal; and a feedback path that feeds back a feedback signal to the processor. The processor executes a process including: acquiring, from a transmission signal at a first timing and feedback signals at a second timing that is before the first timing and at a third timing that is after the first timing, instantaneous delay associated with propagation delay of the feedback signals in the feedback path; calculating a mean value of the instantaneous delay acquired in a predetermined time period; adding delay associated with the calculated mean value to the transmission signal; and updating the distortion compensation coefficient by using the transmission signal to which the delay is added and the feedback signal.

A device having device function circuitry configured to receive a device signal and output a modified device signal is disclosed. The device includes a device temperature sensor configured to generate a device temperature signal that is proportional to a temperature of the device function circuitry. The device function circuitry is further configured to maintain power dissipation of the device function circuitry to below a predetermined safe power dissipation level in response to a control signal that is generated based upon the device temperature signal.

Stack assembly for radio-frequency applications. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.

Stack assembly for radio-frequency applications. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.

A radio-frequency (RF) amplifier circuit facilites carrier-aggregation (CA) operation in a wireless communication network. A first amplifier subcircuit is coupled to an input node, and a second amplifier subcircuit is coupled to the input node. An amplifier subcircuit selector is to selectively enable operation of the first amplifier subcircuit, the second amplifier subcircuit, or the first and the second amplifier subcircuits together, in response to a selection indication. A reactive coupling network is arranged to selectively adjust the input impedance at the input node in response to the selection indication to reduce the input impedance variation.

A radio-frequency (RF) amplifier circuit facilites carrier-aggregation (CA) operation in a wireless communication network. A first amplifier subcircuit is coupled to an input node, and a second amplifier subcircuit is coupled to the input node. An amplifier subcircuit selector is to selectively enable operation of the first amplifier subcircuit, the second amplifier subcircuit, or the first and the second amplifier subcircuits together, in response to a selection indication. A reactive coupling network is arranged to selectively adjust the input impedance at the input node in response to the selection indication to reduce the input impedance variation.

A multipurpose front-end board for solid state sensors is described. In particular, the board is optimized for fast timing particle detection or for characterization and test of silicon and diamond detectors that produce a fast but small current signal at the passage of a particle. The multipurpose front-end board includes a sensor pad configured to receive a solid state sensor to be characterized, distribute a bias potential, and read out the current signal produced by the sensor. The board also includes an amplifier configured to read out the current signal from the sensor pad and convert the current signal to an output voltage signal and a discriminator configured to receive the output voltage signal from the amplifier. A threshold voltage of the discriminator can be controlled by a potentiometer, and the board includes at least one output port to provide data for characterization of the sensor.