Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed to be in contact with at least one piezoelectric substrate. The method further includes forming a micro-electro-mechanical structure (MEMS) comprising a MEMS beam in which, upon actuation, the MEMS beam will turn on the at least one piezoelectric filter structure by interleaving electrodes in contact with the piezoelectric substrate or sandwiching the at least one piezoelectric substrate between the electrodes.

A base includes a first substrate, a contact hole and a contact hole wiring, a first metal film, a second substrate, a second metal film, and a routing wiring. The second substrate is formed of a material identical to a material of the first substrate and bonded to the first substrate by intermetallic bonding. The second metal film is disposed on a third surface as a surface of the second substrate on the first substrate side and constitutes the intermetallic bonding cooperatively with the first metal film. The routing wiring reaches a fourth surface of the second substrate as an opposite surface of the third surface from the contact hole wiring via the third surface and a side surface of the second substrate. The contact hole has an opening area on a second surface side larger than an opening area on a first surface side.

A method for manufacturing an electronic device includes a through electrode forming step of forming a through electrode on an insulating base substrate; an electronic element mounting step of mounting an electronic element on one surface of the base substrate; a cover body placing step of bonding a cover body accommodating the electronic element; a conductive film forming step of forming a conductive film on the other surface of the base substrate and on an end face of the through electrode exposing on the other surface; an electrode pattern forming step of forming an electrode pattern on the end face of the through electrode and on the surface of the periphery of the end face while leaving the conductive film; and an external electrode forming step of forming an external electrode by accumulating an electroless plated film on the surface of the electrode pattern by an electroless plating method.

A crystal device has a crystal blank, a first excitation electrode part which is provided on an upper surface of the crystal blank, a first wiring part which extends from the first excitation electrode part to an edge part of the upper surface, a first lead-out terminal which is provided at the edge part of the upper surface of the crystal blank, a first mounting terminal which is provided at a position facing the first lead-out terminal, a first connection part which is provided so that one end is superimposed on the first lead-out terminal and the other end is superimposed on the first mounting terminal, a substrate having a mounting pad which is provided on its upper surface, a conductive adhesive which is provided between the mounting pad and the first mounting terminal, and a lid which is bonded to the upper surface of the substrate.

The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through hole 49 is formed in a base 4 so as to pass through between both main surfaces 42 and 43 of a base material of the base 4. An inner side surface 491 of the through hole 49 includes a curved surface 495 that expands outward in a width direction of the through hole 49.

A crystal unit includes an AT-cut crystal element, excitation electrodes, extraction electrodes. The AT-cut crystal element has an approximately rectangular planar shape. The excitation electrodes are disposed on front and back of principal surfaces of the AT-cut crystal element. The extraction electrodes are extended from the excitation electrodes to a side of one side of the AT-cut crystal element via a side surface of the AT-cut crystal element. Assuming that an extraction angle of the extraction electrode from the principal surface to the side surface is defined as an angle with respect to an X-axis of a crystallographic axis of a crystal, the angle is equal to or greater than 59 degrees and equal to or less than 87 degrees.

A piezoelectric oscillator, and method of making the same, includes an oscillation substrate comprising an oscillating part and a surrounding part, wherein a the surrounding part is thinner than the oscillating part, and oscillating electrodes disposed on an upper surface and a lower surface of the oscillating part. The oscillation substrate is configured according to H=400.59X+1.751.5, wherein H=100(T2/T1) and S=T2/(L1L2), wherein L1 represents an entire length of the oscillation substrate, L2 represents a length of the oscillating part, T1 represents a thickness of the oscillating part, and T2 represents a step height between the oscillating part and the surrounding part.

A crystal unit includes an AT-cut crystal element and a container. The AT-cut crystal element has an approximately rectangular planar shape. The AT-cut crystal element includes a first inclined portion, second inclined portions, and a first secured portion. The first inclined portion is inclined such that the crystal element decreases in thickness from a proximity of the first side to the first side. The second inclined portions are disposed on respective both ends of the first side, the second inclined portions being formed integrally with the first inclined portion. The second inclined portions are inclined gentler than the first inclined portion. The first secured portion and a second secured portion are formed integrally with the second inclined portion. The first secured portion and the second secured portion each project out from the first side to outside the crystal element to be used for securing with the securing members.

A crystal oscillator includes a piezoelectric substrate having a thinned portion with opposite upper and lower surfaces respectively defining upper and lower surface work portions, and at least one side portion having at least one recessed portion with a bottom surface flush with the upper surface of the thinned portion. A top electrode layer has a top work portion disposed on the upper surface work portion, and a top extension extending from the top work portion onto the bottom surface of the recessed portion. A bottom electrode layer has a bottom work portion disposed on the lower surface work portion, and a bottom extension extending from the bottom work portion toward the one end of the thinned portion and then bending upward and inward onto the bottom surface of the recessed portion. A method of making the crystal oscillator is also disclosed.

A vibrating device includes a base 10 including a semiconductor substrate 11 having a first surface 11a and a second surface 11b, a circuit element being formed on the first surface 11a, an insulating layer 12 disposed on a first surface 11a side, and a pad electrode 14a disposed between a third surface 10a on a side of the insulating layer 12 opposite from the semiconductor substrate 11 and the first surface 11a and electrically connected to the circuit element, an opening portion 16 that exposes a front surface 14a1 of the pad electrode 14a being formed in the insulating layer 12 at a position overlapping the pad electrode 14a in plan view; a first metal pattern 30A disposed on at least a part of the front surface 14a1; a vibrating element 40 electrically connected to the first metal pattern 30A; and a metal member 18 disposed on the first metal pattern 30A overlapping the front surface 14al in plan view, and electrically connecting the first metal pattern 30A and the vibrating element 40.