A vibration device includes a vibration element; a package including a base that is a semiconductor substrate having a first surface and a second surface that are in front-back relation, with the vibration element disposed at the first surface, an oscillation circuit that is disposed at the base and electrically coupled to the vibration element, and a lid that is a semiconductor substrate bonded to the base so as to accommodate the vibration element and electrically coupled to the base, and a resin layer disposed at the outer surface of the package.

A method for manufacturing a vibration element includes, a base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a protective film forming step of forming a first protective film in a bank portion forming region of the first base film, and a dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film.

The vibrator element includes a base part, a vibrating arm extending from the base part, and a weight provided to the vibrating arm, wherein the weight includes a thick film part, a thin film part thinner in film thickness than the thick film part, and a connection part which is located between the thick film part and the thin film part to connect the thick film part and the thin film part to each other, and which forms a taper shape gradually decreasing in film thickness in a direction from the thick film part side toward the thin film part.

A resonator component includes a resonator element which has a rectangular shape having a longitudinal direction set to a first direction and a width direction set to a second direction in a plan view, which is made of a piezoelectric material, and which has a first principal surface, a second principal surface having an obverse-reverse relationship with the first principal surface, and a first side surface and a second side surface which are configured to couple the first principal surface and the second principal surface to each other, and extend in the first direction, a first excitation electrode disposed on the first principal surface, a second excitation electrode disposed on the second principal surface, a first mounting electrode electrically coupled to the first excitation electrode, a second mounting electrode electrically coupled to the second excitation electrode, a first side-surface electrode which extends in the first direction on the first side surface, and is electrically coupled to the first mounting electrode, and a second side-surface electrode which extends in the first direction on the second side surface, and is electrically coupled to the second mounting electrode.

A piezoelectric vibration device that includes a piezoelectric vibrator having excitation electrodes formed thereon; a base having the piezoelectric vibrator on a first surface thereof; outer electrodes formed to continuously extend from the first surface of the base through a side face of the base to a second surface of the base opposite the first surface; and a lid having a recess opening that faces the first surface of the base, the lid being joined to the base to hermetically seal the piezoelectric vibrator in an internal space defined by the recess and the base. An edge portion of a corresponding one of the outer electrodes, formed by the first surface and the side face of the base, is at least partly covered by a covering member having insulating properties.

A vibrator device includes: a base having a first surface and a second surface in a front-back relationship with each other; a circuit element located at a first surface side of the base and having a third surface at the first surface side and a fourth surface in a front-back relationship with the third surface; a vibrator element located at a fourth surface side of the circuit element; a first bonding member that bonds the base to the circuit element; a second bonding member that bonds the circuit element to the vibrator element; and a lid bonded to the base so as to form a cavity that accommodates the circuit element and the vibrator element between the lid and the base, in which at least a part of the second bonding member overlaps the first bonding member in a plan view of the circuit element.

Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed to be in contact with at least one piezoelectric substrate. The method further includes forming a micro-electro-mechanical structure (MEMS) comprising a MEMS beam in which, upon actuation, the MEMS beam will turn on the at least one piezoelectric filter structure by interleaving electrodes in contact with the piezoelectric substrate or sandwiching the at least one piezoelectric substrate between the electrodes.

An electronic device that includes a base substrate having a mounting surface; an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate; an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside; and a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.

A method for manufacturing a piezoelectric resonator unit by forming a via conductor in a through hole of a ceramic substrate, forming a connection electrode foundation layer connected to the via conductor, and forming a sealing frame foundation layer in a substantially frame shape. The ceramic substrate is then fired together with the via conductor, the connection electrode foundation layer, and the sealing frame foundation layer. The surface of the connection electrode foundation layer and the surface of the sealing frame foundation layer are flattened by pressing the ceramic substrate from a first main surface side and a second main surface side thereof. A plating treatment is carried out to form a connecting electrode and a sealing frame. A piezoelectric resonator is electrically connected to the connection electrode.

A layered solid element includes a ferroelectric layer of a crystalline material Li.sub.1−x(Nb.sub.1−yTa.sub.y).sub.1+xO.sub.3+2x−z which has X- or 33° Y-orientation with respect to a substrate of the layered solid element. The ferroelectric layer is grown epitaxially from a buffer layer having of one of the chemical formulae L.sub.kNi.sub.rO.sub.1.5.Math.(k+r)+w or L.sub.n+1Ni.sub.nO.sub.3n+1+δ, where L is a lanthanide element. Such layered solid element may form a thin-film bulk acoustic resonator and be useful for integrated electronic circuits such as RF-filters, or guided optical devices such as integrated optical modulators.