This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. The piezoelectric vibration piece is broken off at the coupling portion and separated from the piezoelectric wafer. On front and back surfaces of the coupling portion, grooved slits extending along a width direction of the coupling portion are formed except for parts of the coupling portion in the width direction. An electrode on at least one of front and back surfaces of the piezoelectric vibration piece is extracted to a frame-portion side of the piezoelectric wafer by way of the part of the coupling portion in the width direction.

A quartz crystal resonator element includes: a base portion and a pair of vibrating arms which extend from a first end portion of the base portion along a Y-axis direction. The base portion includes a second end portion provided on the opposite side to a first end portion in the Y-axis direction. The base portion is provided with a protrusion in at least one of a third end portion and a fourth end portion which respectively connect both ends of the first end portion and both ends of the second end portion.

A tuning fork type crystal blank includes a base part, a pair of vibrating parts which extend from the base part parallel with each other, an auxiliary part including a support part located on one side of an alignment direction of the pair of vibrating parts relative to the base part and pair of vibrating parts and extending parallel with the pair of vibrating parts, and a holding part which is located on the opposite side to the pair of vibrating parts relative to the base part and connects the base part and the support part. When viewed in a planar view direction perpendicular to the alignment direction and to the direction in which the pair of vibrating parts extend, cut away part is formed in a side surface of the auxiliary part.

A method of manufacturing a gyro element as a vibration element is a manufacturing method of processing a quartz crystal substrate to form an outward shape of a gyro element including a vibrating arm and form recessed portions in a vibrating arm. The method includes forming the outward shape of a gyro element from one surface of the quartz crystal substrate using dry etching and forming the recessed portions using wet etching.

Provided is a method for bonding wafers, which can bond the wafers to each other with high reliability while reducing the influence on the wafers. The method for bonding wafers includes the steps of: preparing a first wafer that has, on the surface thereof, a first metal layer with a first rigidity modulus, and a second wafer that has, on the surface thereof, a second metal layer with a second rigidity modulus higher than the first rigidity modulus; removing an oxide film at the surface of the second metal layer while an oxide film at the surface of the first metal layer is not removed; and bonding the surface of the first wafer to the surface of the second wafer.

A piezoelectric quartz tuning fork resonator having a pair of tines formed from a common quartz plate, with a middle electrode and two outer electrodes being disposed at or on top and bottom surfaces of each of the pair of tines and interconnected such that the outer electrodes at or on the top and bottom surfaces of a first one of the pair of tines are connected in common with the middle electrodes on the top and bottom surfaces of a second one of the pair of tines and further interconnected such that the outer electrodes at or on the top and bottom surfaces of the second one of the pair of tines are connected in common with the middle electrodes on the top and bottom surfaces of the first one of the pair of tines.

A vibrator element includes drive vibrating arms extending from an end of a base section, the drive vibrating arms are each provided with an obverse surface, a reverse surface disposed on an opposite side to the obverse surface, and a side surface connecting the obverse surface and the reverse surface to each other, a tilted section facing toward the obverse surface is disposed at least a part of the side surface, and there are disposed a first drive electrode and a second drive electrode obtained by bisection with an electrode separation section disposed in the tilted section.

The present invention provides a tuning fork crystal oscillator plate and a manufacturing method therefor, and a piezoelectric device. The tuning fork crystal oscillator plate has a base and a pair of vibrating arms extending out of the base, wherein a front surface and a back surface of each vibrating arm are separately provided with step-shaped sinking grooves formed by photolithography and corrosion along a thickness direction, and the photolithography and corrosion are performed on the step-shaped sinking grooves along a length direction of the vibrating arms; the step-shaped sinking groove is provided with n steps; and outer surfaces of the step-shaped sinking groove are all plated with electrodes. The piezoelectric oscillator plate manufactured by the present invention has the advantages of low impedance, high frequency precision and low energy consumption.

An element is arranged to cooperate with another part so as to form an encapsulation device for a component including the element at least partially coated with a metallization. The metallization includes at least one metal layer protected by an intermetallic compound which is coated by a non-diffused portion of a material whose melting point is lower than 250 C. A method of fabricating the encapsulation device is also disclosed.

The present invention provides a tuning fork crystal oscillator plate and a manufacturing method therefor, and a piezoelectric device. The tuning fork crystal oscillator plate has a base and a pair of vibrating arms extending out of the base, wherein a front surface and a back surface of each vibrating arm are separately provided with step-shaped sinking grooves formed by photolithography and corrosion along a thickness direction, and the photolithography and corrosion are performed on the step-shaped sinking grooves along a length direction of the vibrating arms; the step-shaped sinking groove is provided with n steps; and outer surfaces of the step-shaped sinking groove are all plated with electrodes. The piezoelectric oscillator plate manufactured by the present invention has the advantages of low impedance, high frequency precision and low energy consumption.