The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

A vibrator element has a first vibration mode in which first and second detection portions perform flexural vibration in opposite directions in the opposite phase to first and second driving portions which vibrate in opposite directions according to a Coriolis force, and a second vibration mode in which the first and second detection portions perform flexural vibration in opposite directions in the same phase as the first and second driving portions which vibrate in opposite directions according to a Coriolis force. A ratio r=R2/R1 of equivalent series resistance R2 at the time of the second vibration mode to equivalent series resistance R1 at the time of the first vibration mode is set between 0.15 and 6.0.

An electronic component manufacturing method, in which a notch and a concave portion are formed in a substrate, includes forming an etching mask in which a maximum width of a first mask portion which forms a width between two side surfaces of the concave portion along a longitudinal direction, when the substrate is seen in a plan view from a direction perpendicular to a surface of the substrate having the concave portion formed therein, is smaller than a width of a second mask portion which forms a minimum width of an opening of the notch, and forming the notch and the concave portion by performing dry etching processing on the substrate.

There is provided a method of manufacturing a piezoelectric vibrator element capable of preventing the piezoelectric vibrator element from being damaged when segmentallizing the piezoelectric vibrator element. The method of manufacturing a piezoelectric vibrator element includes the steps of providing the wafer with the piezoelectric plate and a frame part adapted to support the piezoelectric plate via a connection part, providing a pair of excitation electrodes to the piezoelectric plate, and forming a pair of extending electrodes extending from the piezoelectric plate to the frame part through the connection part and electrically connected respectively to the pair of excitation electrodes, and segmentallizing the piezoelectric plate by cutting the connection part. In the step of providing the pair of excitation electrodes, the pair of extending electrodes are formed on a side surface of the connection part.

The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through hole 49 is formed in a base 4 so as to pass through between both main surfaces 42 and 43 of a base material of the base 4. An inner side surface 491 of the through hole 49 includes a curved surface 495 that expands outward in a width direction of the through hole 49.

A tuning fork type crystal blank includes a base part, a pair of vibrating parts which extend from the base part parallel with each other, an auxiliary part including a support part located on one side of an alignment direction of the pair of vibrating parts relative to the base part and pair of vibrating parts and extending parallel with the pair of vibrating parts, and a holding part which is located on the opposite side to the pair of vibrating parts relative to the base part and connects the base part and the support part. When viewed in a planar view direction perpendicular to the alignment direction and to the direction in which the pair of vibrating parts extend, cut away part is formed in a side surface of the auxiliary part.

In a quartz crystal unit, the unit comprising a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines, each of the first and second quartz crystal tuning fork tines having a first vibrational portion including a first width and a second vibrational portion including a second width greater than the first width, at least one groove being formed in at least one of opposite main surfaces of the first vibrational portion of each quartz crystal tuning fork tine, the first width of the first vibrational portion of each quartz crystal tuning fork tine being greater than 0.03 mm and less than 0.075 mm and the second width of the second vibrational portion of each quartz crystal tuning fork tine being greater than 0.04 mm and less than 0.23 mm.

The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

A vibration element includes a base and a vibrating arm extending from the base. The vibrating arm includes an arm positioned between the base and a weight. A weight film is disposed on the weight. The weight has a first principal surface and a second principal surface in a front and back relationship with respect to a center plane of the arm. A center of gravity of the weight is located between the first principal surface and the center plane of the arm. A center of gravity of the weight film is located between the second principal surface and the center plane of the arm.

In a quartz crystal unit, the unit comprising a case, a quartz crystal tuning fork resonator and a lid, the resonator having a tuning fork base, and first and second tuning fork tines, each of the first and second tuning fork tines having a first side surface and a second side surface opposite the first side surface, the first side surface of the first tuning fork tine confronting the second side surface of the second tuning fork tine; at least one groove having a plurality of surfaces including a first surface being formed in at least one of first and second main surfaces of each of the first and second tuning fork tines so that only the first surface of the at least one groove is directly opposite the first side surface of the corresponding tuning fork tine and a width of the at least one groove is greater than or equal to a distance in the width direction of the at least one groove measured from an outer edge of the at least one groove to an outer edge of the corresponding one of the first and second tuning fork tines and less than 0.07 mm.