An apparatus for tuning a plurality of antennas is provided. The apparatus includes a plurality of antenna ports connected to the plurality of antennas; a plurality of user ports; first adjustable impedance elements, each being connected to one of the antenna ports and ground; second adjustable impedance elements, each being connected to one of the user ports and another one of the user ports; and a plurality of connecting elements, each being connected to one of the antenna ports and one of the user ports, wherein the first and second adjustable impedance elements are configured to be adjustable so to tune the plurality of antennas.

The present disclosure provides an inductive element capable of lowering a Q-value. An inductive element includes a first cover and a second cover covering an annular core, and a first winding and a second winding wound around a region of the core, the first cover and the second cover. The first cover covers a part of an inner circumferential surface of the core, a part of an outer circumferential surface and an end surface on one end side in an axial direction. The second cover covers a part of the inner circumferential surface of the core, a part of the outer circumferential surface an end surface on the other end side in the axial direction.

An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.

An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.

Aspects of the disclosure are directed to an inductor-capacitor (LC) resonator. In accordance with one aspect, the LC resonator architecture includes a lower metal plate, the lower metal plate is of an open configuration; an upper metal plate, the upper metal plate is stacked vertically above the lower metal plate and is vertically aligned to the lower metal plate; a first ultra thick metal (UTM) plate, the first UTM plate is stacked vertically above the upper metal plate and is vertically aligned to both the upper metal plate and the lower metal plate; and an electrical coupling to couple the first UTM plate to the upper metal plate, wherein a current on the first UTM plate flows through to the upper metal plate through the electrical coupling, the current flows in a direction on the first UTM plate and in the same direction on the upper metal plate.

A motor vehicle with at least one energizable active current line, which at least sometimes carries an active current for the operation of at least one electrical consumer. At least one attenuation line layout is coupled by way of an inductive coupling to the energizable active current line in such a way that, in a protection area spaced apart from the active current line and the attenuation line layout, a magnetic field generated by the active current and/or a perturbation superimposed on the active current and/or a leakage current produced by the active current is attenuated by current flow induced in the attenuation line layout.

Certain aspects of the present disclosure provide a directional coupler. In certain aspects, the directional coupler generally includes a first inductor and a second inductor wirelessly coupled to the first inductor. In certain aspects, the directional coupler generally includes an input port at a first terminal of the first inductor and a transmitted port at a second terminal of the first inductor. In certain aspects, the directional coupler generally includes a coupled port at a first terminal of the second inductor and an isolated port at a second terminal of the second inductor. In certain aspects, the directional coupler generally includes a first complex impedance component directly coupled to the isolated port and a second complex impedance component directly coupled to the coupled port.

Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

A multilayer circuit board with an LC resonant circuit that has an electronic component package including the multilayer circuit board with the LC resonant circuit are provided. The multilayer circuit board with the LC resonant circuit configured by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate includes a first set of wiring lines, a set of vias, and a second set of wiring lines. The first set of wiring lines configures both ends of the LC resonant circuit and is formed in a first one of the conductive layers. The set of vias extends through the insulating resin layers. The second set of wiring lines is connected to an input/output terminal of the LC resonant circuit and is formed in a second one of the conductive layers. The first set of wiring lines is connected to the second set of wiring lines.

A filter circuit is provided having multipath interference mitigation. The filter includes a signal path extending from an input to an output. The signal path includes a conductive path and a ground. A pass band filter is disposed along the signal path between the input and the output. The pass band filter passes a first frequency spectrum in a provider bandwidth, and attenuates a second frequency spectrum in a home network bandwidth. The filter circuit further includes a multipath interference mitigation leg operatively branched from the signal path. The multipath interference mitigation leg increases a return loss of the home network bandwidth. A frequency response of the filter circuit is characterized by an insertion loss characteristic between the input and the output being less than 3 dB in the provider bandwidth, and more than 20 dB in the home network bandwidth.