A semiconductor device includes an antenna functioning as a coil, a capacitor electrically connected to the antenna in parallel, a passive element forming a resonance circuit with the antenna and the capacitor by being electrically connected to the antenna and the capacitor in parallel, a first field effect transistor controlling whether the passive element is electrically connected to the antenna and the capacitor in parallel or not, and a memory circuit. The memory circuit includes a second field effect transistor which includes an oxide semiconductor layer where a channel is formed and in which a data signal is input to one of a source and a drain. The gate voltage of the first field effect transistor is set depending on the voltage of the other of the source and the drain of the second field effect transistor.

In an LC filter, a first inductor via, a second inductor via, and a third inductor via define a first inductor, a second inductor, and a third inductor, respectively. A first inductor pattern portion defines a fourth inductor. The first inductor pattern portion is connected to at least one of a first electrode, the first inductor via, and a first capacitor electrode, and a first input/output port. The first capacitor electrode and the third capacitor electrode do not face each other.

A filter circuit is provided having multipath interference mitigation. The filter includes a signal path extending from an input to an output. The signal path includes a conductive path and a ground. A pass band filter is disposed along the signal path between the input and the output. The pass band filter passes a first frequency spectrum in a provider bandwidth, and attenuates a second frequency spectrum in a home network bandwidth. The filter circuit further includes a multipath interference mitigation leg operatively branched from the signal path. The multipath interference mitigation leg increases a return loss of the home network bandwidth. A frequency response of the filter circuit is characterized by an insertion loss characteristic between the input and the output being less than 3 dB in the provider bandwidth, and more than 20 dB in the home network bandwidth.

An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.

A power filter circuit is provided for use in a package substrate for integrated circuits. A first power isolation circuit, having a first inductance, is configured to isolate power provided to one or more die connectors for provision to an integrated circuit die. A second power isolation circuit, having a second inductance, is configured to isolate power provided to one or more printed circuit board (PCB) connectors for provision to a PCB. A power plane electrically connects a first end of the first power isolation circuit to a first end of the second power isolation circuit, forming a power filtering structure in some embodiments. A de-coupling capacitor can be provided as a surface-mount capacitor, or as an embedded capacitor in a core layer of an integrated circuit package.

An LC filter includes an input terminal, an output terminal, a multilayer body, plate electrodes, connection electrodes connecting the plate electrodes, capacitor electrodes, and a inductor vias. Each of the capacitor electrodes opposes the plate electrode. One end of an inductor via is connected with the input terminal with a capacitor electrode interposed therebetween. Another end of the inductor via is connected to an intermediate point of a connection electrode. An inductor via is connected between the plate electrode and a capacitor electrode. An inductor via is connected between the plate electrode and a capacitor electrode. One end of an inductor via is connected with the output terminal with a capacitor electrode interposed therebetween. Another end of the inductor via is connected to an intermediate point of a connection electrode.

Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.

A very wide bandwidth composite band pass filter with steep roll-off of a corresponding passband includes a band pass filter and a high-Q acoustic resonator. The band pass filter has a corresponding passband with a very wide bandwidth and a passband roll-off. The high-Q acoustic filter has a corresponding stopband with a roll-off steeper than the passband roll-off, the high-Q acoustic filter being connected in parallel with the band pass filter such that a portion of the stopband is within the passband of the band pass filter, forming a combined passband. A frequency range of the combined passband is approximately the same as a frequency range of the passband of the band pass filter, and a combined roll-off of the combined passband is steeper on one side than the passband roll-off of the band pass filter.

An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.