Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

An electronic component includes: a stack that includes a bottom surface and a top surface; a first ground conductor layer and a second ground conductor layer that are each integrated with the stack and connected to the ground; a first filter that is arranged between the bottom surface and the first ground conductor layer in the stack; and a second filter that is arranged between the bottom surface and the second ground conductor layer in the stack.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

Apparatus and methods are provided for coupling RF signals. A lattice coupler design incorporating a pair of shunt inductors provides (i) a virtual ground for biasing and (ii) improved performance characteristics, in both splitter and combiner configurations. Magnetic coupling between the shunt inductors can be selected to maintain improved performance characteristics over a wide bandwidth, while retaining compactness and high efficiency. A design procedure, variations, and results are disclosed.

Disclosed are devices and methods for fabricating devices. A device can include a passive portion having at least one metal insulator metal (MIM) capacitor and at least one 2-dimensional (2D) inductor. The device further includes a substrate and the passive portion is formed on the substrate. A magnetic core is embedded in the substrate. A 3-dimensional (3D) inductor is also included having windings formed at least in part in the substrate and at least a portion of the windings being formed around the magnetic core.

An inverter for wireless power transfer includes a primary inverter connected in series with a first primary inductor. A first primary capacitor is connected in parallel with the first primary inductor and primary inverter. A series-connected second primary capacitor and primary pad inductor are in parallel with the second primary capacitor. The synchronous inverter includes a controller configured to detect a first primary current in the first primary inductor to control switches in the primary inverter to provide a positive primary inverter voltage across the output of the primary inverter in response to detecting a positive first primary current, and control the switches in the primary inverter to provide a negative primary inverter voltage across the output of the primary inverter in response to detecting a negative first primary current.

A band-pass filter includes a first input/output port, a second input/output port, a first high-pass filter, a first low-pass filter, and a first stub resonator. The first stub resonator includes a first distributed constant line. The first low-pass filter is provided between the first input/output port and the first high-pass filter in the circuit configuration. The first distributed constant line has a first end connected to a first path connecting the first input/output port and the first low-pass filter, and a second end closest to a ground in the circuit configuration.

A filter circuit includes a pass band filter portion configured to pass signals in a first frequency spectrum and attenuate or block signals in a second frequency spectrum. The first frequency spectrum and the second frequency spectrum do not overlap. The pass band filter portion is configured to cause a return loss of more than 10 decibels (dB) in the first frequency spectrum.

A filter circuit includes a pass band filter portion configured to pass signals in a first frequency spectrum and attenuate or block signals in a second frequency spectrum. The first frequency spectrum and the second frequency spectrum do not overlap. The pass band filter portion is configured to cause a return loss of more than 10 decibels (dB) in the first frequency spectrum.

Embodiments relate to a transformer-based impedance matching network that may dynamically change its characteristic impedance by engaging different inductor branches on a primary side and optionally, on the secondary side. A primary side transformer circuit includes a primary inductor (311) and secondary inductor (321) configured to provide impedance matching over a first frequency band. One or more additional inductor branches (314A, 314B, are switchably coupled to either or both of the primary and secondary inductors to modify the impedance matching characteristics over additional operating frequencies. One or more LC filter branches (321, 322, 326, 327, 336, 330) can be included at the output of the secondary side to filter harmonic frequencies in each of the operating frequency bands.