In described examples of a micromechanical system (MEMS), a rigid cantilevered platform is formed on a base substrate. The cantilevered platform is anchored to the base substrate by only a single anchor point. A MEMS resonator is formed on the cantilevered platform.

A vibrator device includes a base; a circuit element attached to the base; a vibrator element attached to the circuit element; and a plurality of temperature sensors arranged in the circuit element, in which the circuit element includes a first connecting terminal connected to the base, a second connecting terminal connected to the vibrator element, and at least one circuit of an output buffer circuit, a power supply circuit, and a phase-locked loop circuit, and the shortest distance between each of the plurality of temperature sensors and the first connecting terminal or the second connecting terminal is shorter than the shortest distance between each of the temperature sensors and the at least one circuit.

A vibrator device includes a base, a first relay substrate mounted on the base, a second relay substrate mounted on the first relay substrate, and a vibrator element mounted on the second relay substrate, in which the second relay substrate is disposed between the first relay substrate and the vibrator, and the second relay substrate includes a terminal that is electrically coupled to the vibrator element and is positioned in a region overlapping with the first relay substrate and not overlapping the vibrator element in a plan view.

A piezoelectric resonator unit that includes a piezoelectric resonator, a substrate that has a first main surface and a second main surface that face each other, and an electroconductive holding member that holds the piezoelectric resonator on the first main surface of the substrate. The electroconductive holding member includes a plurality of metal particles and a plurality of spherical spacers that position the piezoelectric resonator at a predetermined distance from the first main surface of the substrate. A relationship W.sub.ave<{(2/3)1}V.sub.ave is satisfied, where V.sub.ave is an average particle diameter of the spherical spacers and W.sub.ave is an average particle diameter of the metal particles.

A piezoelectric resonator unit that includes a piezoelectric resonator, a substrate that has a first main surface and a second main surface that face each other, and an electroconductive holding member that holds the piezoelectric resonator on the first main surface of the substrate. The electroconductive holding member includes a plurality of metal particles and a plurality of spherical spacers that position the piezoelectric resonator at a predetermined distance from the first main surface of the substrate. A relationship W.sub.ave<{(2/3)1}V.sub.ave is satisfied, where V.sub.ave is an average particle diameter of the spherical spacers and W.sub.ave is an average particle diameter of the metal particles.

A BAW device includes a substrate and a piezoelectric element formed on a surface of the substrate. The substrate has a plurality of elastic wave diffusing regions disposed therein for diffusing an elastic wave, the elastic wave diffusing regions being formed by modifying the inside of the substrate with a laser beam.

A BAW device includes a substrate and a piezoelectric element formed on a surface of the substrate. The substrate has a plurality of elastic wave diffusing regions disposed therein for diffusing an elastic wave, the elastic wave diffusing regions being formed by modifying the inside of the substrate with a laser beam.

A vibration device including a vibrator, a circuit component, a relay substrate disposed between the vibrator and the circuit component, a package that accommodates the vibrator, the circuit component, and the relay substrate, a first metal bump that joins the circuit component to the package, a second metal bump that joins the relay substrate to the circuit component, and a third metal bump that joins the vibrator to the relay substrate.

A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.

A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.