A surface acoustic wave (SAW) resonator includes a piezoelectric layer disposed over a substrate, and a plurality of electrodes disposed over the first surface of the piezoelectric layer. A layer is disposed between the substrate and the piezoelectric layer. A silicon layer disposed between a first surface of the layer and a second surface of the piezoelectric layer. A first surface of the silicon layer has a smoothness sufficient to foster atomic bonding between the first surface of the silicon layer and the second surface of the piezoelectric layer.

A vibration device is provided with reduced thickness and size while maintaining vibration strength. The vibration device includes a first elastic plate with first and second ends and a first planar section disposed between the first and second ends. Moreover, a second elastic plate is joined to the second end of the first elastic plate and includes a second planar section opposing the first planar section of the first elastic plate. The second elastic plate has a flexural rigidity that is higher than that of the first elastic plate. In addition, a piezoelectric vibrating element is disposed on in the first planar section of the first elastic plate to face the second elastic plate. A weight can be attached to the first end of the first elastic plate to facilitate vibration.

A vibration device is provided with reduced thickness and size while maintaining vibration strength. The vibration device includes a first elastic plate with first and second ends and a first planar section disposed between the first and second ends. Moreover, a second elastic plate is joined to the second end of the first elastic plate and includes a second planar section opposing the first planar section of the first elastic plate. The second elastic plate has a flexural rigidity that is higher than that of the first elastic plate. In addition, a piezoelectric vibrating element is disposed on in the first planar section of the first elastic plate to face the second elastic plate. A weight can be attached to the first end of the first elastic plate to facilitate vibration.

An electronic component-use package includes a base that holds an electronic component element, and terminal electrodes formed on a bottom surface of the base. The terminal electrodes have chamfered parts facing corner parts of the base bottom surface and having angles of chamfer ranging in 10 degrees to a reference line. The reference line is a perpendicular line to a straight line that connects the corner parts of the base bottom surface to a central part on one side of the terminal electrode in proximity to a center point of the base bottom surface, the reference line L8 passing through the chamfered parts.

An electronic component-use package includes a base that holds an electronic component element, and terminal electrodes formed on a bottom surface of the base. The terminal electrodes have chamfered parts facing corner parts of the base bottom surface and having angles of chamfer ranging in 10 degrees to a reference line. The reference line is a perpendicular line to a straight line that connects the corner parts of the base bottom surface to a central part on one side of the terminal electrode in proximity to a center point of the base bottom surface, the reference line L8 passing through the chamfered parts.

An electronic component includes a piezoelectric substrate, a functional electrode on the piezoelectric substrate, a support layer on the piezoelectric substrate, a cover layer on the support layer, the cover layer, the support layer, and the piezoelectric substrate defining a hollow space that the functional electrode faces, and connection terminals that are electrically connected to the functional electrode, that are each made from a metal particle aggregate, and that each have a porous structure. The connection terminals are each located at a position in which the connection terminals overlap at least a portion of the hollow space in plan view.

An electronic component includes a piezoelectric substrate, a functional electrode on the piezoelectric substrate, a support layer on the piezoelectric substrate, a cover layer on the support layer, the cover layer, the support layer, and the piezoelectric substrate defining a hollow space that the functional electrode faces, and connection terminals that are electrically connected to the functional electrode, that are each made from a metal particle aggregate, and that each have a porous structure. The connection terminals are each located at a position in which the connection terminals overlap at least a portion of the hollow space in plan view.

A resonator and/or MEMS device is provided with a flexible suspension mount to reduce mechanical stress and/or interference arising from other electrical components. In one illustrative embodiment, the flexible suspension mount can be configured as one or more metallic springs that provide for electrical connection as well as for specific spring and dampening coefficients. In another illustrative material, techniques can be use which change spring and/or dampening coefficients at a particular point in the manufacturing/assembly/distribution process, optionally before device characterization and/or programming.

A resonator and/or MEMS device is provided with a flexible suspension mount to reduce mechanical stress and/or interference arising from other electrical components. In one illustrative embodiment, the flexible suspension mount can be configured as one or more metallic springs that provide for electrical connection as well as for specific spring and dampening coefficients. In another illustrative material, techniques can be use which change spring and/or dampening coefficients at a particular point in the manufacturing/assembly/distribution process, optionally before device characterization and/or programming.

A frequency adjustment method is provided for a piezoelectric resonator including a first vibrator, a second vibrator, a third vibrator, and a supporting portion. The second and the third vibrators connect to ends positioned along a vibration direction of a width-longitudinal mode in the first vibrator. The supporting portion is connected to two ends positioned along a vibration direction of the length-longitudinal mode in the first vibrator. The method includes: setting the second vibrator to a first region, a second region, and a third region along the vibration direction of the width-longitudinal mode; setting the third vibrator to a first region, a second region, and a third region along the vibration direction of the width-longitudinal mode; and performing the frequency adjustment by reducing or adding mass of at least one of the first region and the third region in each of the second vibrator and the third vibrator.