Provided are various spacecraft propulsion systems, and associated methods of operation. A spacecraft comprises an ion propulsion system and an ion blocker suspended from the spacecraft via one or more electrically insulated tethers. The ion propulsion system is configured to generate a first propulsive force by emitting a charged ion beam in a direction with an ion velocity vector comprising an ion vector component that is perpendicular to a magnetic field of a planet, such as Earth. The magnetic field causes the ion beam to curve toward the ion blocker at a trajectory such that ions within the ion beam are blocked by the ion blocker to generate a second propulsive force on the ion blocker. The ion blocker blocks the ions by contacting or deflecting the ions. The ion blocker is positioned approximately twice the gyroradius of the ion beam trajectory.

A method and structure for a single crystal acoustic electronic device. The device includes a substrate having an enhancement layer formed overlying its surface region, a support layer formed overlying the enhancement layer, and an air cavity formed through a portion of the support layer. A single crystal piezoelectric material is formed overlying the air cavity and a portion of the enhancement layer. Also, a first electrode material coupled to the backside surface region of the crystal piezoelectric material and spatially configured within the cavity. A second electrode material is formed overlying the topside of the piezoelectric material, and a dielectric layer formed overlying the second electrode material. Further, one or more shunt layers can be formed around the perimeter of a resonator region of the device to connect the piezoelectric material to the enhancement layer.

An acoustic wave device includes a piezoelectric layer including lithium tantalate or lithium niobate, a dielectric film on the piezoelectric layer, the dielectric film including a dielectric material having a higher dielectric constant than that of the lithium tantalate or lithium niobate, and an IDT electrode on the dielectric film.

Methods of designing a BAW resonator and filter and the resulting devices are provided. Embodiments include patterning a bottom electrode of a resonator; patterning a top electrode of the resonator; and intersecting areas of the top and bottom electrodes to provide an effective area of the resonator, wherein the effective area includes a closed-loop contour line including a pulse function pattern with pre-defined amplitude, period and a number of repetitions of pulses along the closed-loop contour line.

A bulk-acoustic wave resonator includes: a substrate; and a resonator portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on the substrate. The piezoelectric layer is formed of aluminum nitride (AlN) containing scandium (Sc). The bulk-acoustic wave resonator satisfies the following expression: leakage current density×scandium (Sc) content<20. The leakage current density is a leakage current density of the piezoelectric layer in μA/cm2, and the scandium (Sc) content is a weight percentage (wt %) of scandium (Sc) in the piezoelectric layer.

A method of manufacture for an acoustic resonator or filter device. In an example, the present method can include forming metal electrodes with different geometric areas and profile shapes coupled to a piezoelectric layer overlying a substrate. These metal electrodes can also be formed within cavities of the piezoelectric layer or the substrate with varying geometric areas. Combined with specific dimensional ratios and ion implantations, such techniques can increase device performance metrics. In an example, the present method can include forming various types of perimeter structures surrounding the metal electrodes, which can be on top or bottom of the piezoelectric layer. These perimeter structures can use various combinations of modifications to shape, material, and continuity. These perimeter structures can also be combined with sandbar structures, piezoelectric layer cavities, the geometric variations previously discussed to improve device performance metrics.

The present disclosure provides a bulk acoustic wave resonator, a manufacturing method thereof, and a filter, wherein the bulk acoustic wave resonator includes: a substrate; an acoustic reflection unit on the substrate; a piezoelectric stack structure on the acoustic reflection unit; and a pad on the piezoelectric stack structure; wherein the pad has an overlapping region with the acoustic reflection unit. The acoustic wave resonator, the manufacturing method thereof and the filter of the present disclosure can effectively reduce connection resistance of the bulk acoustic wave resonator, thereby reducing insertion loss of the filter.

Multiplexers are disclosed. A multiplexer can include a first filter and a second filter that are coupled to a common node. The second filter can include a first type of acoustic wave resonators (e.g., bulk acoustic wave resonators) and a series acoustic wave resonator of a second type (e.g., a surface acoustic wave resonator) that is coupled between the acoustic wave resonators of the first type and the common node. The first filter can provide a single-ended radio frequency signal. In certain embodiments, the first filter can be a receive filter and the second filter can be a transmit filter.

A resonator is provided that includes a vibration member that includes a substrate, a metal layer formed along one of main surfaces of the substrate, and a piezoelectric thin film disposed between the substrate and the metal layer. The vibration member vibrates such that a main vibration is a contour vibration. Moreover, a frame surrounds at least a portion of the vibration member, and a support unit connects the vibration member to the frame. The vibration member includes depressed portions on or above the one of main surfaces where the piezoelectric thin film is removed.

An acoustic resonator includes a piezoelectric stack including a piezoelectric layer having a top surface and a bottom surface, a top electrode layer disposed above the top surface, and a bottom electrode layer disposed below the bottom surface. A number of acoustic wave reflectors are disposed on a side of the bottom electrode layer opposite the piezoelectric layer. Each acoustic wave reflector includes a high acoustic impedance layer and may include a low acoustic impedance layer. The acoustic resonator may include a tether that extends laterally to a stacking direction of the layers of the piezoelectric stack. A supporting structure may be coupled to the tether opposite the acoustic resonator for anchoring the acoustic resonator. A mirror, one or more phononic crystals, or both may be positioned on proximate the tether opposite the acoustic resonator to avoid resonant waves from exiting the acoustic resonator in use.