A resonator element includes a substrate having a first region performing thickness shear vibration, a second region located in a periphery of the first region and having a smaller thickness than the first region, a fixed end, and a free end opposite to the fixed end in the first region in a plan view. Excitation electrodes are disposed on a front and a rear of the first region and have regions overlapping each other in the plan view. A center of the first region and a center of the regions overlapping each other are located between a center of the substrate and the free end in the plan view. When Cs is a distance between the center of the regions overlapping each other and the center of the substrate in the plan view, a relation of 105 μm<Cs<130 μm is satisfied.

A method of fabricating an electronic component includes forming a functional unit on a main surface of a substrate, forming a sacrificial layer covering the functional unit on the main surface, forming a cap layer covering the sacrificial layer, the cap layer forming a periphery enclosing the cavity on the main surface, forming holes through the cap layer, forming a cavity by removing the sacrificial layer using a wet etching process through the holes, the holes including a peripheral hole communicating an inside of the cavity with an outside of the cavity along the main surface, and forming a first resin layer covering the cap layer and the main surface.

A method of fabricating an electronic component includes forming a functional unit on a main surface of a substrate, forming a sacrificial layer covering the functional unit on the main surface, forming a cap layer covering the sacrificial layer, the cap layer forming a periphery enclosing the cavity on the main surface, forming holes through the cap layer, forming a cavity by removing the sacrificial layer using a wet etching process through the holes, the holes including a peripheral hole communicating an inside of the cavity with an outside of the cavity along the main surface, and forming a first resin layer covering the cap layer and the main surface.

A device and method is presented to allow the high frequency clock generators and functional blocks of a wireless communication device to enter a very low power sleep state while the low frequency reference clock generator within the wireless communications device remains in an active state. The timing block provides methods of increasing and maintaining accuracy of the system timer which may have been reduced by temperature variation or manufacturing defects. The timing block also allows for selection of the highest accuracy clock from among multiple high frequency clock references. A device for timing control is presented comprising at least one high frequency reference clock, a low frequency reference clock and a timing controller for generating a system timer, wherein the timing controller selects one of the at least one high frequency reference clock and processes the low frequency reference clock with the selected high frequency reference clock.

A device and method is presented to allow the high frequency clock generators and functional blocks of a wireless communication device to enter a very low power sleep state while the low frequency reference clock generator within the wireless communications device remains in an active state. The timing block provides methods of increasing and maintaining accuracy of the system timer which may have been reduced by temperature variation or manufacturing defects. The timing block also allows for selection of the highest accuracy clock from among multiple high frequency clock references. A device for timing control is presented comprising at least one high frequency reference clock, a low frequency reference clock and a timing controller for generating a system timer, wherein the timing controller selects one of the at least one high frequency reference clock and processes the low frequency reference clock with the selected high frequency reference clock.

An elastic wave device includes a piezoelectric film and a high acoustic velocity member in which an acoustic velocity of a bulk wave propagating in the high acoustic velocity member is larger than an acoustic velocity of a main mode elastic wave propagating in the piezoelectric film, the piezoelectric film that is directly or indirectly laminated on the high acoustic velocity member, a first conductive film provided on the piezoelectric film, and a second conductive film that is provided on the piezoelectric film and on at least a portion of the first conductive film. A plurality of IDT electrodes including electrode fingers and busbars are provided on the piezoelectric film, at least electrode fingers of a plurality of IDT electrodes are defined by the first conductive film, and at least a portion of connection wiring with which the plurality of IDT electrodes are connected to each other is defined the second conductive film.

An elastic wave device includes a piezoelectric film and a high acoustic velocity member in which an acoustic velocity of a bulk wave propagating in the high acoustic velocity member is larger than an acoustic velocity of a main mode elastic wave propagating in the piezoelectric film, the piezoelectric film that is directly or indirectly laminated on the high acoustic velocity member, a first conductive film provided on the piezoelectric film, and a second conductive film that is provided on the piezoelectric film and on at least a portion of the first conductive film. A plurality of IDT electrodes including electrode fingers and busbars are provided on the piezoelectric film, at least electrode fingers of a plurality of IDT electrodes are defined by the first conductive film, and at least a portion of connection wiring with which the plurality of IDT electrodes are connected to each other is defined the second conductive film.

A resonator element includes a vibrating portion that vibrates in a thickness shear vibration and includes a first main surface and a second main surface which are in a front and back relationship to each other, a first excitation electrode that is provided on the first main surface, and a second excitation electrode that is provided on the second main surface, and an energy trapping coefficient M satisfies a relationship of 33.6≦M≦65.1.

A resonator element includes a vibrating portion that vibrates in a thickness shear vibration and includes a first main surface and a second main surface which are in a front and back relationship to each other, a first excitation electrode that is provided on the first main surface, and a second excitation electrode that is provided on the second main surface, and an energy trapping coefficient M satisfies a relationship of 33.6≦M≦65.1.

There are provided an acoustic resonator module, and a method of manufacturing the same. An acoustic resonator module includes a resonating part disposed on a substrate and an inductor electrically connected to the resonating part, and having at least a portion disposed to be spaced apart from the substrate.