The present disclosure relates to a novel integrate-and-fire (IF) neuron circuit using a single-gated feedback field-effect transistor (FBFET) to realize small size and low power consumption. According to the present disclosure, the neuron circuit according to one embodiment may generate potential by charging current input from synapses through a capacitor. In this case, when the generated potential exceeds a threshold value, the neuron circuit may generate and output a spike voltage corresponding to the generated potential using a single-gated feedback field-effect transistor connected to the capacitor. Then, the neuron circuit may reset the generated spike voltage using transistors connected to the feedback field-effect transistor.

A circuit arrangement is disclosed for controlling the switching of a field effect transistor (FET). A current controlled amplifier may be configured to amplify a current in a current sense device to generate an amplified current, wherein the current in the current sense device indicates a current through the FET. A comparator may be coupled to the current sense amplifier to compare a voltage corresponding to the amplified current with a voltage reference and to generate a comparator output based on the comparison, wherein the comparator output controls whether the FET is on or off.

A charge pump cell for a charge pump is disclosed that may exhibit improved latch-up immunity. A circuit may be arranged at the charge pump cell to apply a voltage to a bulk contact of a charge transfer transistor of such a charge pump cell at least partially responsive to a relationship between a voltage at a first terminal of the charge transfer transistor and a voltage at a second terminal of the charge transfer transistor. A charge pump including one or more such charge pump cells may include a control loop that is configured to control a pumping signal at least partially responsive to a state of an output voltage of the charge pump.

An integrated circuit (IC) includes: an input terminal; an output terminal; a first reference voltage terminal and a second reference voltage terminal; a high-side power switch coupled between the first reference voltage terminal and the output terminal; a low-side power switch coupled between the output terminal and the second reference voltage terminal; a first combinational logic and a second combination logic that are coupled to the input terminal; a first driver coupled between the first combinational logic and the high-side power switch; a second driver coupled between the second combinational logic and the low-side power switch; and first comparators coupled to the second combinational logic, where the first comparators are configured to compare a voltage difference between load path terminals of the high-side power switch with a first threshold and a second threshold.

The invention relates to a method for setting a dead time between the opening of a first switching element (31) of a half bridge (2) and the closing of a second switching element (32) of the half bridge (2), comprising the steps: reducing the dead time of a switching cycle relative to the dead time of a preceding switching cycle, and determining a temperature of at least one of the switching elements (31, 32); wherein the steps of reducing the dead time and of determining the temperature are repeated for subsequent switching cycles until a critical dead time is reached, in the case of which a termination condition, which depends on the determined temperature, is fulfilled; and wherein the dead time is set using the critical dead time.

A method includes detecting a signal on a switching node connected to a power switch, detecting a gate drive voltage of the power switch, during a gate drive process of the power switch, reducing a gate drive current based on a first comparison result obtained from comparing the signal with a first threshold, and during the gate drive process of the power switch, increasing the gate drive current based on a second comparison result obtained from comparing the gate drive voltage with a second threshold.

A method for active gate driving a switching circuit, wherein: a characteristic of a waveform controlled by the switching circuit is represented by a function mapping an input variable to an output metric, and wherein: the input variable comprises: a design variable having a first set of possible values; and an environmental variable having a second set of possible values, wherein the environmental variable is observable but not controllable. The method comprising: performing Bayesian optimisation on the function to generate a model of the function, wherein a next value of the design variable for evaluating the function is selected based on values of an acquisition function associated with a predicted value of the environmental variable; determining a first value of the design variable that optimises the model of the function; and controlling the switching circuit according to the first value of the design variable.

The disclosure relates to a semiconductor die, including a vertical power transistor device, a pull-down transistor device, and a capacitor. The pull-down transistor device is connected between a gate electrode of the vertical power transistor device and a ground terminal and connects the gate electrode to the ground terminal in a conducting state. The capacitor is connected between one of the load terminals of the vertical power transistor device and the control terminal of the pull-down transistor device and capacitively couples the one load terminal to the control terminal.

System on a Chip (SoC) integrated circuits are configured to reduce Static Random-Access Memory (SRAM) power leakage. For example, SoCs configured to reduce SRAM power leakage may form part of an artificial reality system including at least one head mounted display. Power switching logic on the SoC includes a first power gating transistor that supplies a first, higher voltage to an SRAM array when the SRAM array is in an active state, and a third power gating transistor that isolates a second power gating transistor from the first, higher voltage when the SRAM array is in the active state. The second power gating transistor further supplies a second, lower voltage to the SRAM array when the SRAM array is in a deep retention state, such that SRAM power leakage is reduced in the deep retention state.

In some examples, this description provides for an apparatus. The apparatus includes a power switch having a power switch source configured to receive an input voltage, a power switch drain, and a power switch gate. The apparatus also includes a current sense component coupled to the power switch. The apparatus also includes a current limiting circuit coupled to the power switch gate, the power switch drain, and the current sense component. The apparatus also includes an over-current protection (OCP) circuit coupled to the power switch source, the power switch drain, and the power switch gate. The apparatus also includes an output voltage (VOUT) clamp coupled to the power switch drain and the power switch gate.