A method of preparing an integrated circuit device design including analyzing a preliminary device layout to identify a vertical abutment between a first cell and a second cell, the locations of, and spacing between, internal metal cuts within the first and second cells, indexing the second cell relative to the first cell by N CPP to define one or more intermediate device layouts to define a modified device layout with improved internal metal cut spacing in order to suppress BGE and LE.

A circuit includes a first bipolar junction transistor (BJT) including a first base, a first collector, and a first emitter, the first collector connected to a first supply voltage node and a second BJT including a second base, a second collector, and a second emitter, the second collector connected to the first emitter at an output node. The circuit also includes a capacitor including a first capacitor terminal and a second capacitor terminal, the first capacitor terminal connected to the second emitter of the second BJT and the second capacitor terminal connected to a second supply voltage node. A current source device is also included that is connected in parallel with the capacitor.

A circuit includes a first input terminal, a second input terminal, a third input terminal and an output terminal. A first summation node adds signals at the first and third input terminals. A second summation node subtracts signals at the second and third input terminals. A selector selects between the added signals and subtracted signals in response to a selection signal. The output of the selector is integrated to generate an integrated signal. The integrated signal is compared by a comparator to a threshold, the comparator generating an output signal at the output terminal having a first level and a second level. Feedback of the output signal produces the selection signal causing the selector to select the added signals in response to the first level of the output signal and causing the selector to select the subtracted signals in response to the second level of the output signal.

A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.

A memory subsystem includes a multi-device package including multiple memory devices organized as multiple ranks of memory. A control unit for the memory subsystem sends a memory access command concurrently to some or all of the ranks of memory, and triggers some of all of the memory ranks that receive the memory access command to change on-die termination (ODT) settings. One of the ranks is selected to execute the memory access command, and executes the command while all ranks triggered to change the ODT setting have the changed ODT setting.

A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.

A memory interface circuit includes a first variable impedance circuit coupled between a first supply voltage and a pad, and a second variable impedance circuit coupled between a second supply voltage and the pad; wherein when the first supply voltage changes, at least one of the first variable impedance circuit and the second variable impedance circuit is controlled to have different setting in response to the changing of the first supply voltage.

A memory subsystem includes a multi-device package including multiple memory devices organized as multiple ranks of memory. A control unit for the memory subsystem sends a memory access command concurrently to some or all of the ranks of memory, and triggers some of all of the memory ranks that receive the memory access command to change on-die termination (ODT) settings. One of the ranks is selected to execute the memory access command, and executes the command while all ranks triggered to change the ODT setting have the changed ODT setting.

A termination circuit includes a first transistor coupled to a first pad, a first resistor coupled between the first transistor and a second pad, and an operational amplifier circuit. The termination circuit provides termination impedance to input signals received at the first and second pads. The first transistor generates a first common mode voltage of the input signals at a first node between the first resistor and the first transistor in response to an output signal of the operational amplifier circuit. The operational amplifier circuit generates the output signal based on the first common mode voltage of the input signals and based on a second common mode voltage of the input signals. The termination circuit generates the second common mode voltage at a second node that is a different node than the first node.

A memory subsystem includes a multi-device package including multiple memory devices organized as multiple ranks of memory. A control unit for the memory subsystem sends a memory access command concurrently to some or all of the ranks of memory, and triggers some of all of the memory ranks that receive the memory access command to change on-die termination (ODT) settings. One of the ranks is selected to execute the memory access command, and executes the command while all ranks triggered to change the ODT setting have the changed ODT setting.