Patent classifications
H03K2217/9607
Device and method for generating an electrical power supply in an electronic system with a variable reference potential
A method and device for generating a power supply voltage (Vf), referenced to a first reference potential (4), in an electronic system including an energizing source (3) connected to the first and second reference potentials (4, 5) so as to impart an AC voltage differential between the reference potentials (4, 5), wherein the device includes: (i) a source (10) for supplying AC voltage, which is referenced to the second reference potential (5), connected to the first reference potential (4), and encompasses the energizing source (3); and (ii) rectifying and filtering elements (1) connected, at the input thereof, to the first reference potential (4) and to the source (10) for supplying AC voltage, respectively, so as to generate, at an output (8), a power supply voltage (Vf) referenced to the first reference potential (4) by rectifying a voltage at the terminals of the source (10) for supplying AC voltage.
INPUT DEVICE
An input device includes a fixed electrode layer, an elastic body, a movable member, and an insulating layer. The movable member includes a pressure receiving part on which an operation force is to be exerted. The elastic body includes a first deformable part and at least one second deformable part. When the operation force is exerted on the pressure receiving part, the first deformable part and the at least one second deformable part are compressed. At least at a time point at which the operation force is started to be exerted on the pressure receiving part, a ratio of change in an area of the first deformable part is higher than a ratio of change in an area of the at least one second deformable part.
Haptic touch module and a method for manufacturing the haptic touch module
A haptic touch module (124, 170) comprises a bottom plate (100, 140) comprising a recess (102, 172); a haptic sensor (104, 152) mounted in the recess (102, 172); a capacitive sensor printed circuit board assembly (106, 160) mounted on the haptic sensor (104, 152); and an overlay (108, 164) mounted on the capacitive sensor printed circuit board assembly (106, 160), the overlay (108, 164) having a length and width covering the bottom plate (100, 140).