An integrated circuit comprising an output stage circuit. The output stage circuit comprises: an input node for receiving a digital input signal; a supply voltage node for receiving a supply voltage signal; a digital to analog convertor for converting the digital signal; an amplifier for amplifying the converted signal; a first/second and optionally third voltage regulator generating a first/second and optionally third voltage signal; a greatest-voltage selector circuit for providing power to the amplifier. Two different voltages are provided to the DAC. The output signal can be a SENT signal. The circuit is highly robust against power-interruptions and EMI.

A circuit comprises a first amplifier coupled to a first and a second node; a differential capacitive load coupled to the first and the second node, the differential capacitive load coupled between drains of transistors in a cross coupled transistor circuit; a current mirror coupled to a source of each transistor; and a capacitor coupled between the sources of the transistors. A plurality of amplifiers can be coupled to the differential capacitive load, wherein each amplifier comprises a clock-less pre-amplifier of a comparator. The amplifiers may be abutted to one another such that an active transistor of a first differential stage in a first amplifier behaves as a dummy transistor for an adjacent differential stage in a second amplifier.

The present invention discloses a pipelined analog-to-digital converter (ADC) including a sub-ADC, a multiplying digital-to-analog converter (MDAC) and a decoder. The decoder provides a ground signal for the MDAC. The sub-ADC is electrically connected to a ground pad via a first metal trace, and the decoder is electrically connected to the ground pad via a second metal trace.

A complementary metal-oxide-semiconductor (CMOS) switching system with increased supply rejection is disclosed. The system comprises a voltage regulator and a CMOS circuit. The voltage regulator receives a supply voltage and generates a regulated voltage by regulating an amplitude of the received supply voltage. The CMOS circuit includes an input terminal to receive a first voltage, switching circuitry to selectively couple the CMOS circuit to the voltage regulator in one of a plurality of configurations, and an output terminal to output a second voltage based at least in part on the first voltage and the regulated voltage when the CMOS circuit is coupled to the voltage regulator in a first configuration of the plurality of configurations.

A low dropout voltage regulator, coupled to a load circuit receiving a clock signal, includes an amplifier; a power transistor comprising a control terminal, coupled to an output terminal of the amplifier; and a first terminal, coupled to a positive input terminal of the amplifier and the load circuit; and a control circuit, configured to control a current flowing through the power transistor in response to the clock signal.

Methods and systems are provided for circuits. One method is for increasing device threshold voltage distribution of a plurality of devices of a circuit. The method includes adjusting a device threshold voltage of the plurality of devices by different amounts; and selecting a subset of the plurality of devices with adjusted device threshold voltage by a device selection module for performing a function associated with the circuit. In one aspect, a system for device threshold voltage adjustment is provided. The system includes a sensor module for sensing one or more of temperature and voltage values of a die having a plurality of devices for a circuit; and a threshold temperature and voltage compensation module for receiving an input value from the sensor module to compensate variation in a device threshold voltage caused by changes of one or more of temperature and voltage of the die.

The present invention discloses a pipelined analog-to-digital converter (ADC) including a sub-ADC, a multiplying digital-to-analog converter (MDAC) and a decoder. The decoder provides a ground signal for the MDAC. The sub-ADC is electrically connected to a ground pad via a first metal trace, and the decoder is electrically connected to the ground pad via a second metal trace.

In at least some embodiments, a system comprises a frequency generator configured to generate a second clock signal having a second frequency using a first clock signal having a first frequency. The second frequency is offset from the first frequency and each of a plurality of harmonic frequencies of the second frequency is offset from a harmonic frequency of the first frequency. The system also includes a power converter configured to produce a power signal that at least partially corresponds to the second frequency. The system further comprises an analog-to-digital converter (ADC) configured to sample and convert analog voltages at the first frequency. The ADC is powered by the power signal.

An image sensor chip includes an internal voltage generator for generating internal voltages using an external voltage received at a first terminal of the image sensor chip, a temperature sensor for generating a temperature voltage, a selection circuit for outputting one of the external voltage, the internal voltages, and the temperature voltage, a digital code generation circuit for generating a digital code using an output voltage of the selection circuit, and a second terminal for outputting the digital code from the image sensor chip.

An image sensor chip includes an internal voltage generator for generating internal voltages using an external voltage received at a first terminal of the image sensor chip, a temperature sensor for generating a temperature voltage, a selection circuit for outputting one of the external voltage, the internal voltages, and the temperature voltage, a digital code generation circuit for generating a digital code using an output voltage of the selection circuit, and a second terminal for outputting the digital code from the image sensor chip.