Disclosed according to an embodiment is a communications module comprising: a first substrate having a first hole formed herein; a communications unit including a second substrate and a plurality of elements disposed on one side of the second substrate; and a heat sink disposed on the other side of the second substrate, wherein a peripheral region of the second substrate is disposed so as to vertically overlap with the periphery of the first hole of the first substrate. Accordingly, the communications module can realize an optimized heat dissipation structure in which the communications unit and the heat sink are in contact with each other on the substrate by using a thermally conductive member as a medium.

Disclosed according to an embodiment is a communications module comprising: a first substrate having a first hole formed herein; a communications unit including a second substrate and a plurality of elements disposed on one side of the second substrate; and a heat sink disposed on the other side of the second substrate, wherein a peripheral region of the second substrate is disposed so as to vertically overlap with the periphery of the first hole of the first substrate. Accordingly, the communications module can realize an optimized heat dissipation structure in which the communications unit and the heat sink are in contact with each other on the substrate by using a thermally conductive member as a medium.

A local area network system that includes modular, multi-frequency, multi-channel, upgradable transmission nodes. The transmission nodes may include one or more independent RF modules and may be configured to include, for example, 802.11ac and may evolve to LTE and other technologies and frequency bands.

A local area network system that includes modular, multi-frequency, multi-channel, upgradable transmission nodes. The transmission nodes may include one or more independent RF modules and may be configured to include, for example, 802.11ac and may evolve to LTE and other technologies and frequency bands.

A satellite transmitter module for accepting input signals and emitting output signals for uplink transmission. The module includes a transmitter unit that includes i) transmitter circuitry, ii) at least one input port, iii) and at least one output port. At least one heat sink coupled to the transmitter unit includes a plurality of heat sink fins, wherein at least two of the plurality of heat sink fins are of different heights. A fan is capable of generating air flow parallel with the plurality of heat sink fins. The module further includes an outer enclosure that i) encloses the transmitter unit and the plurality of heat sink fins and ii) is impermeable to the air flow generated by the fan. The outer enclosure includes an enclosure cross section shape that is substantially similar to the at least one heat sink cross section shape defined by the height of each of the plurality of the heat sink fins.

A satellite transmitter module for accepting input signals and emitting output signals for uplink transmission. The module includes a transmitter unit that includes i) transmitter circuitry, ii) at least one input port, iii) and at least one output port. At least one heat sink coupled to the transmitter unit includes a plurality of heat sink fins, wherein at least two of the plurality of heat sink fins are of different heights. A fan is capable of generating air flow parallel with the plurality of heat sink fins. The module further includes an outer enclosure that i) encloses the transmitter unit and the plurality of heat sink fins and ii) is impermeable to the air flow generated by the fan. The outer enclosure includes an enclosure cross section shape that is substantially similar to the at least one heat sink cross section shape defined by the height of each of the plurality of the heat sink fins.

A method and device for thermal mitigation. The communications device including a first radio communications subsystem configured to operate according to a first radio communications protocol and a second radio communications subsystem configured to operate according to a second radio communications protocol. The first radio communications subsystem includes a temperature sensor and an electronic processor configured to determine, via the temperature sensor, a first temperature indicative of a temperature of the second radio communications subsystem, compare the first temperature to at least one predetermined temperature threshold, and deactivate the second radio communications subsystem when the first temperature exceeds a predetermined temperature threshold of the at least one predetermined temperature threshold.

Provided is an electronic device that includes: a housing that includes a metallic member; a battery pack that is disposed in the housing; a substrate that is disposed in parallel with the battery pack and includes at least one heat generating source; a heat dissipation plate that is disposed to overlap with at least a portion of the battery pack and the substrate, and is formed of a metallic material. Heat generated from the heat generating source may be dissipated to the battery pack through the heat dissipation plate. The electronic device includes an efficient heat dissipation structure that also contributes to the rigidity reinforcement and slimming of the electronic device, and can prevent an electric shock accident beforehand, which may be caused by an exterior of a metallic member. Other various embodiments may be made.

Provided is an electronic device that includes: a housing that includes a metallic member; a battery pack that is disposed in the housing; a substrate that is disposed in parallel with the battery pack and includes at least one heat generating source; a heat dissipation plate that is disposed to overlap with at least a portion of the battery pack and the substrate, and is formed of a metallic material. Heat generated from the heat generating source may be dissipated to the battery pack through the heat dissipation plate. The electronic device includes an efficient heat dissipation structure that also contributes to the rigidity reinforcement and slimming of the electronic device, and can prevent an electric shock accident beforehand, which may be caused by an exterior of a metallic member. Other various embodiments may be made.

A wireless communication module includes a wireless module board, a frequency converter, an amplifier phase shifter, a band-pass filter, and a communication board, and a through-hole, which penetrates in a direction in which the wireless module board and the communication board are aligned, is formed at a portion of the communication board to which at least one of IC chips of the frequency converter and the amplifier phase shifter faces, and the band-pass filter is covered by the communication board.