In one example, a semiconductor die includes multi-standard, multi-channel expandable television/satellite receiver that can be flexibly implemented in a number of different configurations to enable incorporation into a plurality of different systems. The semiconductor die may include multiple tuners to receive and tune a terrestrial radio frequency (RF) signal and a satellite RF signal. These tuners may include different frequency synthesizers including voltage controlled oscillators (VCOs) to generate VCO signals at different frequencies, mixers to downconvert the RF signals to baseband signals using the VCO signals. In an implementation, the semiconductor die may further include shared circuitry coupled to the tuners to digitize, process and demodulate the baseband signals.

In one example, a semiconductor die includes multi-standard, multi-channel expandable television/satellite receiver that can be flexibly implemented in a number of different configurations to enable incorporation into a plurality of different systems. The semiconductor die may include multiple tuners to receive and tune a terrestrial radio frequency (RF) signal and a satellite RF signal. These tuners may include different frequency synthesizers including voltage controlled oscillators (VCOs) to generate VCO signals at different frequencies, mixers to downconvert the RF signals to baseband signals using the VCO signals. In an implementation, the semiconductor die may further include shared circuitry coupled to the tuners to digitize, process and demodulate the baseband signals.

A power amplifier system front end measures both forward and reverse power associated with an RF transmit signal. A processor is configured to use measurements derived from the measured forward and reverse power output to adjust the RF transmit signal in order to compensate for one or more memory effects of the power amplifier system.

A power amplifier system front end measures both forward and reverse power associated with an RF transmit signal. A processor is configured to use measurements derived from the measured forward and reverse power output to adjust the RF transmit signal in order to compensate for one or more memory effects of the power amplifier system.

A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

A method of data reduction implemented in a communication system, the method comprising steps of generating a plurality of first baseband signals in response to a plurality of signals received by at least one antenna, capturing a plurality of second baseband signals, in response to a signal time duration, from each of the first baseband signals, generating a plurality of third baseband signals in response to the second baseband signals, transmitting a first combined signal including the third baseband signals to at least one baseband signal unit via a communication system, retrieving the third baseband signal from the received first combined signal, generating a plurality of fourth baseband signals, and generating a second combined signal including the fourth baseband signals.

A full duplex, low latency, near field data link controls a resonant induction, wireless power transfer system for recharging batteries. In an electric vehicle embodiment, an assembly is aligned with respect to a ground assembly to receive a charging signal. The vehicle assembly includes one or more charging coils and a first full duplex inductively coupled data communication system that communicates with a ground assembly including one or more charging coils and a second full duplex inductively coupled data communications system. The charging coils of the ground assembly and the vehicle assembly are selectively enabled based on geometric positioning of the vehicle assembly relative to the ground assembly for charging. As appropriate, the transmit/receive system of the ground assembly and/or the vehicle assembly are adjusted to be of the same type to enable communication of charging management and control data between the ground assembly and the vehicle assembly during charging.

A full duplex, low latency, near field data link controls a resonant induction, wireless power transfer system for recharging batteries. In an electric vehicle embodiment, an assembly is aligned with respect to a ground assembly to receive a charging signal. The vehicle assembly includes one or more charging coils and a first full duplex inductively coupled data communication system that communicates with a ground assembly including one or more charging coils and a second full duplex inductively coupled data communications system. The charging coils of the ground assembly and the vehicle assembly are selectively enabled based on geometric positioning of the vehicle assembly relative to the ground assembly for charging. As appropriate, the transmit/receive system of the ground assembly and/or the vehicle assembly are adjusted to be of the same type to enable communication of charging management and control data between the ground assembly and the vehicle assembly during charging.

Embodiments of the present disclosure utilizes the natural properties of RFI noise on a wireline link. Since differential RFI noise in the system has some correlation with the common mode noise on the cable, a replica of RFI noise can be regenerated by an adaptive filter based on information about the common mode noise. The replica RFI is subtracted from the equalizer output prior to the data decision circuitry or slicer. In this method, the system does not require expensive cable, nor does the equalizer suffer additional loss due to an RFI notch filter. Since RFI can be detected and mitigated, this information can also be coupled to safety systems to increase functional safety under high EMI conditions.