H04B1/44

Mismatch detection using replica circuit

An apparatus for detecting difference in operating characteristics of a main circuit by using a replica circuit is presented. In one exemplary case, a sensed difference in operating characteristics of the two circuits is used to drive a tuning control loop to minimize the sensed difference. In another exemplary case, several replica circuits of the main circuit are used, where each is isolated from one or more operating variables that affect the operating characteristic of the main circuit. Each replica circuit can be used for sensing a different operating characteristic, or, two replica circuits can be combined to sense a same operating characteristic.

ANTENNA AND ELECTRONIC DEVICE HAVING SAME

An electronic device includes a side surface member, a wireless communication circuit, and a switch circuit. The side surface member includes a first conductive portion coupled to the wireless communication circuit and the switch circuit, a second conductive portion coupled to the switch circuit, and a first non-conductive portion disposed between the first conductive portion and the second conductive portion. The switch circuit is controlled to be in at least one of a first state, a second state, and a third state, based on a first frequency of a first operating signal supplied by the wireless communication circuit. The switch circuit is configured to couple the second conductive portion to the wireless communication circuit, in the first state, and to couple the second conductive portion to the first conductive portion, in the second state.

WIRELESS SINGLE-PHASE AC-TO-AC CONVERSION CIRCUIT BASED ON 2.4G MICROWAVE

A wireless single-phase AC-to-AC conversion circuit based on a 2.4G microwave includes a receiving antenna unit, a RF switch unit, a positive voltage rectification unit, a negative voltage rectification unit and an AC synthesis unit. An output port of the receiving antenna unit is connected to the common input port of the RF switch unit. A first microwave output end of the RF switch unit and a second microwave output end of the RF switch unit are correspondingly connected to a microwave input end of the positive voltage rectification unit and a microwave input end of the negative voltage rectification unit, respectively. ADC output end of the positive voltage rectification unit and a DC output end of the negative voltage rectification unit are correspondingly connected to a positive voltage input port of the AC synthesis unit and a negative voltage input port of the AC synthesis unit, respectively.

WIRELESS SINGLE-PHASE AC-TO-AC CONVERSION CIRCUIT BASED ON 2.4G MICROWAVE

A wireless single-phase AC-to-AC conversion circuit based on a 2.4G microwave includes a receiving antenna unit, a RF switch unit, a positive voltage rectification unit, a negative voltage rectification unit and an AC synthesis unit. An output port of the receiving antenna unit is connected to the common input port of the RF switch unit. A first microwave output end of the RF switch unit and a second microwave output end of the RF switch unit are correspondingly connected to a microwave input end of the positive voltage rectification unit and a microwave input end of the negative voltage rectification unit, respectively. ADC output end of the positive voltage rectification unit and a DC output end of the negative voltage rectification unit are correspondingly connected to a positive voltage input port of the AC synthesis unit and a negative voltage input port of the AC synthesis unit, respectively.

FULL-DUPLEX COMMUNICATION METHOD, SYSTEM AND DEVICE
20220385329 · 2022-12-01 ·

A full-duplex communication device includes an antenna, a transceiving module a conversation module and a control module. The antenna is configured to receive and send signals. Two of the transceiving module are provided, the transceiving module is installed with a filter and a gating switch connecting to the filter, operating frequencies of the two transceiving module are different, and the gating switche is configured to switch operating states between a receiving mode and a sending mode of the transceiving modules. The conversation module is connected to the transceiving modules and configured to receive and play voice signals. The control module is connected to the transceiving modules and configured to control tasks of the transceiving modules.

FULL-DUPLEX COMMUNICATION METHOD, SYSTEM AND DEVICE
20220385329 · 2022-12-01 ·

A full-duplex communication device includes an antenna, a transceiving module a conversation module and a control module. The antenna is configured to receive and send signals. Two of the transceiving module are provided, the transceiving module is installed with a filter and a gating switch connecting to the filter, operating frequencies of the two transceiving module are different, and the gating switche is configured to switch operating states between a receiving mode and a sending mode of the transceiving modules. The conversation module is connected to the transceiving modules and configured to receive and play voice signals. The control module is connected to the transceiving modules and configured to control tasks of the transceiving modules.

Direct substrate to solder bump connection for thermal management in flip chip amplifiers

Solder bumps are placed in direct contact with the silicon substrate of an amplifier integrated circuit having a flip chip configuration. A plurality of amplifier transistor arrays generate waste heat that promotes thermal run away of the amplifier if not directed out of the integrated circuit. The waste heat flows through the thermally conductive silicon substrate and out the solder bump to a heat-sinking plane of an interposer connected to the amplifier integrated circuit via the solder bumps.

Direct substrate to solder bump connection for thermal management in flip chip amplifiers

Solder bumps are placed in direct contact with the silicon substrate of an amplifier integrated circuit having a flip chip configuration. A plurality of amplifier transistor arrays generate waste heat that promotes thermal run away of the amplifier if not directed out of the integrated circuit. The waste heat flows through the thermally conductive silicon substrate and out the solder bump to a heat-sinking plane of an interposer connected to the amplifier integrated circuit via the solder bumps.

SYSTEM AND METHOD FOR SHARING CIRCUITRY BETWEEN TRANSMIT AND RECEIVE PATH
20220376731 · 2022-11-24 ·

A transceiver circuit includes transmit circuitry comprising a transmit baseband filter and a driver amplifier having an output coupled to a power amplifier, receive circuitry comprising a low noise amplifier and a receive baseband filter, mixer circuitry and a magnetic circuit, wherein the mixer circuitry and the magnetic circuit are coupled between the transmit baseband filter and the driver amplifier, and are further coupled between the low noise amplifier and the receive baseband filter, wherein the mixer circuitry and the magnetic circuit are shared between the transmit circuitry and the receive circuitry in a time division duplexing (TDD) communication system.

Low power, centralized data collection

The systems and methods described herein are directed to techniques for improving battery life performance of end devices in resource monitoring systems which transmit data using low-power, wide area network (LPWAN) technologies. Further, the techniques include providing sensor interfaces in the end devices configured to communicate with multiple types of metrology sensors. Additionally, the systems and methods include techniques for reducing the size of a concentrator of a gateway device which receives resource measurement data from end devices. The reduced size of the concentrator results in smaller, more compact gateway devices that consume less energy and reduce heat dissipation experienced in gateway devices. The concentrator may comply with modular interface standards, and include two radios configured for transmitting 1-watt signals. Lastly, the systems and methods include techniques for fully redundant radio architecture within a gateway device, allowing for maximum range and minimizing downtime due to transmission overlap.